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Hsin-Ting
Hsin-Ting Chen, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20100275042 | COMPUTER AND EXPANDABLE POWER SUPPLY SYSTEM THEREOF - The invention discloses a computer and an expandable power supply system. The expandable power supply system includes N interface units, a determination unit, and a voltage converting unit. N is an integer equal to or more than two. The interface units are electrically connected with at least one power supplies and switching the levels of (N−1) control signals according to conductance of the power supplies. When the interface units are electrically connected with 1 | 10-28-2010 |
Hsin-Ting Huang, Bade City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120086127 | PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF - A package system includes a first substrate. A second substrate is electrically coupled with the first substrate. At least one electrical bonding material is disposed between the first substrate and the second substrate. The at least one electrical bonding material includes a eutectic bonding material. The eutectic bonding material includes a metallic material and a semiconductor material. The metallic material is disposed adjacent to a surface of the first substrate. The metallic material includes a first pad and at least one first guard ring around the first pad. | 04-12-2012 |
Hsin-Ting Huang, Bade TW
| Patent application number | Description | Published |
|---|---|---|
| 20120115305 | METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PACKAGING - A method for wafer to wafer bonding in semiconductor packaging provides for roughening the bonding surfaces in one embodiment. Also provided is a method for passivating the bonding surfaces with a lower melting point material that becomes forced away from the bonding interface during bonding. Also provided is a method for forming an eutectic at the bonding interface to reduce the impact of any native oxide formation at the bonding interface. | 05-10-2012 |
Hsin-Ting Lin, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20100309095 | ELECTRONIC APPARATUS HAVING DUAL DISPLAYS - An electronic apparatus having dual displays includes a casing, a circuit board, an electronic-paper display and a non-electronic-paper display. The casing has a first side and a second side. The circuit board is disposed in the casing. The electronic-paper display is disposed on the first side of the casing and connected to the circuit board. The non-electronic-paper display is disposed on the second side of the casing and connected to the circuit board. The electronic-paper display can be used for displaying a text document, and the non-electronic-paper display can be used for displaying high quality image data, e.g. a streaming media. Based on the attribute of a file, a user can select an appropriate display for displaying the file so as to make good use of the electronic apparatus. | 12-09-2010 |
Hsin-Ting Tsai, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090294888 | METHOD FOR FABRICATING AN IMAGE SENSOR - A method for fabricating an image sensor is disclosed. First, a semiconductor substrate is provided, in which a photosensitive region is defined on the semiconductor substrate. At least one photosensitive material is then formed on the semiconductor substrate, and a first exposure process is performed to form a tapered pattern in the photosensitive material. A second exposure process is performed to form a straight foot pattern in the photosensitive material, and a developing process is performed to remove the tapered pattern and straight foot pattern to form the photosensitive material into a plurality of photosensitive blocks. A reflow process is conducted thereafter to form the photosensitive blocks into a plurality of microlenses. | 12-03-2009 |
| 20110139188 | WAFER CLEANING DEVCIE AND METHOD THEREOF - A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height. | 06-16-2011 |