| Patent application number | Description | Published |
|---|
| 20090115046 | Micro-electro-mechanical system device and method for making same - According to the present invention, a method for making a micro-electro-mechanical system (MEMS) device comprises: providing a substrate with devices and interconnection formed thereon, the substrate having a to-be-etched region; depositing and patterning an etch stop layer; depositing and patterning metal and via layers to form an MEMS structure, the MEMS structure including an isolation region between MEMS parts, an isolation region exposed upwardly, and an isolation region exposed downwardly, wherein the isolation region exposed downwardly is in contact with the etch stop layer; masking the isolation region exposed upwardly, and removing the isolation region between MEMS parts; and removing the etch stop layer. | 05-07-2009 |
| 20100213568 | MICRO-ELECTRO-MECHANICAL-SYSTEM DEVICE WITH GUARD RING AND METHOD FOR MAKING SAME - The present invention discloses a MEMS device with guard ring, and a method for making the MEMS device. The MEMS device comprises a bond pad and a sidewall surrounding and connecting with the bond pad, characterized in that the sidewall forms a guard ring by an etch-resistive material. | 08-26-2010 |
| 20110024850 | MICRO ELECTRONIC DEVICE AND METHOD FOR FABRICATING MICRO ELECTROMECHANICAL SYSTEM RESONATOR THEREOF - A method for fabricating a MEMS resonator is provided. A stacked main body including a silicon substrate, a plurality of metallic layers and an isolation layer is formed and has a first etching channel extending from the metallic layers into the silicon substrate. The isolation layer is filled in the first etching channel. The stacked main body also has a predetermined suspended portion. Subsequently, a portion of the isolation layer is removed so that a second etching channel is formed and the remained portion of the isolation layer covers an inner sidewall of the first etching channel. Afterwards, employing the isolation layer that covers the inner sidewall of the first etching channel as a mask, an isotropic etching process through the second etching channel is applied to the silicon substrate, thereby forming the MEMS resonator suspending above the silicon substrate. The method for fabricating MEMS resonator can be integrated with the process of fabricating the CMOS circuit, thereby the process of fabricating a microelectronic device can be simplified and the cost of fabricating a micro electronic device can be reduced. A micro electronic device is also provided in the present invention. | 02-03-2011 |
| 20110024852 | MEMS DEVICE AND MEMS SPRING ELEMENT - A micro electromechanical system (MEMS) spring element is disposed on a substrate, and includes a fixing portion and a moveable portion. The fixing portion is fixed on the substrate, and includes an insulating layer, a plurality of metal-fixing layers and a plurality of supporting-fixing layers. The insulating layer is disposed on the substrate. The metal-fixing layers are disposed above the insulating layer. The supporting-fixing layers are connected between the metal-fixing layers. The moveable portion has a first end and a second end. The first end is connected with the fixing portion, and the second end is suspended above the substrate. The moveable portion includes a plurality of metal layers and at least a supporting layer. The supporting layer is connected between the adjacent metal layers, and a hollow region is formed between the supporting layer and the adjacent metal layers. The deformation of the MEMS spring element generated because of the different thermal expansion may be avoided and the working performance of the MEMS spring element can be improved. | 02-03-2011 |
| 20110037132 | MEMS PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - A method for fabricating MEMS package structure includes the following steps. Firstly, a substrate is provided. Next, a plurality of lower metallic layers and first oxide layers are formed to compose a MEMS structure and an interconnecting structure. Next, an upper metallic layer is formed on the MEMS structure and the interconnecting structure. The upper metallic layer has a first opening and a second opening. Next, the first opening and the second opening are employed as etching channels to remove a portion of the first oxide layers so as to form a first cavity surrounding the MEMS structure and form a second cavity above the interconnecting structure. The first cavity communicates with the second cavity. Next, the second opening is sealed in a vacuum environment. Next, a packaging element is formed on the upper metallic layer in a non-vacuum environment to seal the first opening. | 02-17-2011 |
| 20110037160 | MICROELECTRONIC DEVICE AND FABRICATING METHOD THEREOF AND MEMS PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF - A fabricating method of a microelectronic device including the following steps is provided. First, a substrate is provided. Second, a semi-conductor element is formed in a CMOS circuit region of the substrate. Next, a plurality of metallic layer, a plurality of contact plugs and a plurality of oxide layer are formed on the substrate. The metallic layers and the oxide layers are interlaced with each other and the contact plugs are formed in the oxide layers and connected with the metallic layers correspondingly so as to form a micro electromechanical system (MEMS) structure within a MEMS region and an interconnecting structure within the CMOS circuit region. Then, a first protective layer is formed on at least one of the oxide layers and a second protective layer is formed on the interconnecting structure. Predetermined portions of the oxide layers located within the MEMS region are removed and thereby the MEMS structure is partially suspended above the substrate. The present invention also provides a microelectronic device, a MEMS package structure and a fabricating method thereof | 02-17-2011 |
| 20120017427 | METHOD FOR FORMING ANTENNA STRUCTURE - A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and disposing a plating resist material on the non-conductive frame, removing a part of the plating resist material within a predetermined region on the non-conductive frame and forming a roughened surface on the non-conductive frame within the predetermined region by laser marking, forming a medium layer on the roughened surface, wherein the medium layer comprises Pd or Ag, removing the plating resist material on the non-conductive frame, and forming a metal layer on the medium layer. | 01-26-2012 |
| 20120027951 | METHOD FOR FORMING ANTENNA STRUCTURE - A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and forming a photosensitive medium layer on the non-conductive frame, wherein the medium layer comprises a catalyzer for electroless deposition; applying a light beam through a transparent portion of a mask to the medium layer, such that a part of the medium layer is solidified within a predetermined region on the non-conductive frame; removing a part of the medium layer outside of the predetermined region; and forming a metal layer on the medium layer within the predetermined region. | 02-02-2012 |
