| Patent application number | Description | Published |
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| 20100181500 | METHOD AND SYSTEM FOR LOW TEMPERATURE ION IMPLANTATION - A method comprises pre-cooling a first semiconductor wafer outside of a process chamber, from a temperature at or above 15° C. to a temperature below 5° C. The pre-cooled first wafer is placed inside the process chamber after performing the pre-cooling step. A low-temperature ion implantation is performed on the first wafer after placing the first wafer. | 07-22-2010 |
| 20100240224 | MULTI-ZONE SEMICONDUCTOR FURNACE - A semiconductor furnace suitable for chemical vapor deposition processing of wafers. The furnace includes a thermal reaction chamber having a top, a bottom, a sidewall, and an internal cavity for removably holding a batch of vertically stacked wafers. A heating system is provided that includes a plurality of heaters arranged and operative to heat the chamber. The heating system includes at least one top heater; at least one bottom heater, and a plurality of sidewall heaters spaced along the height of the reaction chamber to control temperature variations within in the chamber and promote uniform film deposit thickness on the wafers. | 09-23-2010 |
| 20100248496 | ROTATABLE AND TUNABLE HEATERS FOR SEMICONDUCTOR FURNACE - A semiconductor furnace suitable for chemical vapor deposition processing of wafers. The furnace includes a thermal reaction chamber having a top, a bottom, a sidewall, and an internal cavity for removably holding a batch of vertically stacked wafers. A heating system is provided that includes a plurality of rotatable heaters arranged and operative to heat the chamber. In one embodiment, spacing between the sidewall heaters is adjustable. The heating system controls temperature variations within the chamber and promotes uniform film deposit thickness on the wafers. | 09-30-2010 |
| 20120079289 | SECURE ERASE SYSTEM FOR A SOLID STATE NON-VOLATILE MEMORY DEVICE - A secure erase system for a solid state memory device is disclosed. A memory area provides a data block for storing data and a key block for storing at least one key. A translation unit maps a logical address to a physical address associated with the memory area. An encryption unit encrypts plaintext data to be written to the memory area with the associated key and decrypts the encrypted data to be read by a host with the associated key. The key associated with a logical erase group to be secure erased is deleted after receiving a command requesting to erase the data associated with the logical erase group. | 03-29-2012 |
| 20120098006 | LIGHT EMITTING DIODE PACKAGE WITH PHOTORESIST REFLECTOR AND METHOD OF MANUFACTURING - Optical emitters are fabricated by forming and shaping photoresist reflectors on a package wafer using lithography processes, and bonding Light-Emitting Diode (LED) dies to the package wafer. | 04-26-2012 |
| 20120104435 | REFRACTIVE INDEX TUNING OF WAFER LEVEL PACKAGE LEDS - Two or more molded ellipsoid lenses are formed on a packaged LED die by injecting a glue material into a mold over the LED die and curing the glue material. After curing, the refractive index of the lens in contact with the LED die is greater than the refractive index of the lens not directly contacting the LED die. At least one phosphor material is incorporated into the glue material for at least one of the lenses not directly contacting the LED die. The lens directly contacting the LED die may also include one or more phosphor material. A high refractive index coating may be applied between the LED die and the lens. | 05-03-2012 |
| 20120104450 | LIGHT EMITTING DIODE OPTICAL EMITTER WITH TRANSPARENT ELECTRICAL CONNECTORS - An optical emitter includes a Light-Emitting Diode (LED) on a package wafer, transparent insulators, and one or more transparent electrical connectors between the LED die and one or more contact pads on the packaging wafer. The transparent insulators are deposited on the package wafer with LED dies attached using a lithography or a screen printing method. The transparent electrical connectors are deposited using physical vapor deposition, chemical vapor deposition, spin coating, spray coating, or screen printing and may be patterned using a lithography process and etching. | 05-03-2012 |
| Patent application number | Description | Published |
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| 20120119606 | MOTOR STATOR AND ASSEMBLING METHOD THEREOF - A motor stator includes a stator unit and an auxiliary induction unit. The stator unit includes a circuit substrate, and a plurality of induction coils embedded within the circuit substrate. The auxiliary induction unit includes an insulating member, a magnetic conductor, and at least one coil winding assembly. The coil winding assembly includes a conductive rod and an auxiliary coil. The rod has an insert rod section extending through the magnetic conductor, the insulating member, and the circuit substrate, and a wound rod section permitting the auxiliary coil to be wound thereon, such that the auxiliary coil is disposed outwardly of the magnetic conductor. During assembly, the induction coil assembly is mounted to the magnetic conductor, and the insulating member is superposed on the circuit substrate. Subsequently, the rod is inserted through the insulating member and into the circuit substrate. | 05-17-2012 |
| 20120119607 | MOTOR STATOR - A motor stator includes an insulating frame having a plurality of projecting rods, an induction unit, and a plurality of conductive members. The induction unit includes an induction circuit board, a plurality of induction coils embedded within the induction circuit board, and a plurality of coil windings wound respectively on the projecting rods. The conductive members extend through the insulating frame and the induction circuit board for establishing an electrical connection between each of the induction coils and a corresponding one of the coil windings. The turn numbers of the coil windings are not limited by the area and thickness of the induction circuit board, and can be increased. Alternatively, the coil windings may be positioned to increase the magnetic pole slot number when energized. As such, a driving force of the motor stator can be increased. | 05-17-2012 |
| 20120119608 | MOTOR STATOR - A motor stator includes a stator unit and at least one auxiliary unit. The stator unit includes a circuit substrate, and a plurality of spaced-apart induction coils embedded within the circuit substrate. The auxiliary unit includes an auxiliary coil attached to and disposed outwardly of the circuit substrate. | 05-17-2012 |
