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Hsin-Chien
Hsin-Chien Chao, Jhongli City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100244081 | LIGHTING DEVICE USING HIGH POWER LED WITH MULTIPLE LEAD - The lighting device mainly contains a first material, a second material, at a light generation chip, and multiple metallic leads. The metallic leads are sandwiched between the first and second materials, and arranged in a radial manner around the indentation or the raised stand. The center of the first material has an obconical through channel and the center of the second material has either an indentation or a raised stand. The light generation chips are positioned in the center of the second material. High thermal conducting insulation paste is provided between the first material, the metallic leads, and the second material so that they are electrical insulated from each other. The present invention could achieve versatile color combinations and high brightness under superior heat dissipation effect, and could be applied in various types of packaging and welding. | 09-30-2010 |
Hsin-Chien Chiang, Bade City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080272384 | Light emitting diode - A light emitting diode (LED) having disposed on a top of a package an optical mechanism comprised of multiple grooves or dots to promote optical use efficiency of the packaging through light condensing effects produced by the optical mechanism to collect a light source inside the LED to emit in a given direction through the optical mechanism for effectively reducing discriminating escape of the light source in both right and left sides of the given direction thus to significantly upgrade general luminance performance of the LED. | 11-06-2008 |
Hsin-Chien Kao, Pingtung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090147689 | Method, network apparatus and computer readable medium thereof for detecting the defect of the network - Method, network apparatus and computer readable medium thereof for detecting the defect of the network are provided. The network apparatus comprises a controlling module and a relaying module. The controlling module comprises a generating module for generating a plurality of sub-detecting packets; and a first combining module for combining the plurality of sub-detecting module into a detecting packet; the relaying module is for receiving the detecting packet from the controlling module, the relaying module comprises a decomposing module for decomposing the detecting packet into the plurality of sub-detecting packets and transfer the sub-detecting packets to a target host; and a second combining module for receiving a plurality sub-result packets from the target host which are corresponding to the sub-detecting packets, combining the sub-result packets into a result packet and transferring the result packet to the controlling module to complete the detection. | 06-11-2009 |
Hsin-Chien Lu, Tucheng City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110086504 | METHODS FOR FORMING INTEGRATED CIRCUITS - A method for forming an integrated circuit is provided. The method includes forming a gate dielectric structure over a substrate. A titanium-containing sacrificial layer is formed, contacting the gate dielectric structure. The whole titanium-containing sacrificial layer is substantially removed. | 04-14-2011 |