Patent application number | Description | Published |
20110122653 | OPTICAL PLATE WITH MICRO-STRUCTURES AND BACKLIGHT MODULE USING SAME - An exemplary optical plate includes a base and an array of micro-structures. The base includes a first surface and a second surface opposite to the first surface. The micro-structures are provided at the first surface. Each micro-structure includes a base surface substantially coplanar with the first surface of the base and two side surfaces. The base surface has an approximately olive-shaped profile enclosed by two arc-outlines. The two side surfaces extend obliquely from the two arc-outlines and intersect at a ridge of the micro-structure. | 05-26-2011 |
20120250349 | LIGHT GUIDE MODULE AND TOUCH PANEL - A light guide module is provided. The light guide module includes a light guide strip, a light transmitting plate, and a microstructure unit. The light guide strip includes a light incident surface, a first lateral surface, and an intense region, wherein the first lateral surface is adjacent to the light incident surface and the intense region is defined in a region of the light guide strip which is close to the light incident surface. The light transmitting plate faces the first lateral surface of the light guide strip. The microstructure unit is disposed at the light transmitting plate corresponding to the intense region. | 10-04-2012 |
20130258249 | BACKLIGHT MODULE AND LIQUID CRYSTAL DISPLAY DEVICE - A back light module is provided, which includes a light guide plate, a first light source device and a second light source device. The light guide plate has a first side surface, a second side surface and a third side surface, wherein the first side surface is opposite to the third side surface, and the second side surface is orthogonal to the first and third side surfaces. The first lighting device is disposed at two sides of an intersection corner of the first and second side surfaces and faces the first and second side surfaces. The second light source device is disposed at two sides of an intersection corner of the second and third side surfaces and faces the second and third side surfaces. | 10-03-2013 |
Patent application number | Description | Published |
20100275003 | SYSTEM AND METHOD FOR EXPRESS EXECUTION OF INTERNET SERVICE ACCESSING - A method for express execution of internet service accessing with a touch-control interface for a computer system is provided. A computer system is installed with a first operating system in a data storage therein. The method includes the following steps: the computer system executing the BIOS of the computer system; before loading and executing the first operating system, the computer system detecting and activating a touch-control display device; the touch-control display device displaying executive item icons representing internet service accessing programs; detecting the executive item icon selection by the user; based on the selection, loading and executing the first operating system; and executing the internet service accessing program corresponding to the selected executive item icon. | 10-28-2010 |
20100275004 | SYSTEM AND METHOD FOR EXPRESS EXECUTION OF NAVIGATION FUNCTION - A method for express execution of navigation function is provided. A computer system is installed with a first operating system in a data storage device therein. The method includes the following steps: the computer system executing the BIOS of the computer system; before loading and executing the first operating system, the computer system detecting and activating a touch-control display device; the touch-control display device displaying an executive item icon representing the navigation function; detecting the executive item icon selection by the user; based on the selection, loading and executing the first operating system; and executing the navigation function corresponding to the selected executive item icon. | 10-28-2010 |
20110037834 | IMAGING DEVICE FOR GENERATING AND DISPLAYING IMAGES TO SIMULATE MOVEMENT OF THREE-DIMENSIONAL OBJECTS - An imaging device for generating and displaying image to simulate movement of 3D objects includes a frame, imaging units, and image output units. The imaging units are arranged between two opposite sides of the frame and connected to one another to define an imaging space therebetween. One side of each imaging unit connects to the frame at a first angle and the opposite side thereof connected to the frame at a second angle. The image output units are arranged on the side of the frame where forming the second angle, such that the image output units face the imaging units in one-to-one correspondence to separately present a first image. The first images presented by the image output units are identical to one another, and are separately transferred by corresponding imaging units to the imaging space to form a simulated image in the imaging space. | 02-17-2011 |
Patent application number | Description | Published |
20120256215 | PACKAGE HAVING LIGHT-EMITTING ELEMENT AND FABRICATION METHOD THEREOF - A package having a light-emitting element includes a substrate having a light-emitting element disposed thereon, an insulating layer formed on the substrate and having an opening for exposing the light-emitting element, a florescent layer formed in the opening of the insulating layer for encapsulating the light-emitting element, and a transparent material formed on the florescent layer and the insulating layer. As such, a specific space can be defined by the insulating layer for exposing the light-emitting element and forming the fluorescent layer, thereby overcoming the problem of non-uniform coating of phosphor powder as encountered in prior techniques. | 10-11-2012 |
20130026516 | LIGHT-EMITTING DIODE (LED) PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF - A light-emitting diode (LED) package structure and a packaging method thereof are provided. The packaging method includes: forming first conductive layers on a silicon substrate, and forming a reflection cavity and electrode via holes from a top surface of the silicon substrate; forming a reflection layer on predetermined areas of a surface of the reflection cavity, and forming second conductive layers and metal layers on surfaces of the electrode via holes; and mounting a chip and forming an encapsulant, so as to fabricate the LED package structure. In the present invention, there is no need to perform at least two plating processes for connecting upper and lower conductive layers of the silicon substrate in the electrode via holes, and the problem of poor connection of the conductive layers in the electrode via holes can be avoided, thereby making the fabrication processes simplified and time-effective and also improving the overall production yield. | 01-31-2013 |
20140367849 | INTERPOSER AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an interposer is provided, including forming a plurality of first openings on one surface side of a substrate, forming a first metal layer in the first openings, forming on the other surface side of the substrate a plurality of second openings that are in communication with the first openings, forming a second metal layer in the second openings, and electrically connecting the first metal layer to the second metal layer, so as to form conductive through holes. The conductive through holes are formed stage by stage, such that the fabrication time in forming the metal layers is reduced, and a metal material will not be accumulated too thick on a surface of the substrate. Therefore, the metal material has a smoother surface, and no overburden will be formed around end surfaces of the through holes. An interposer is also provided. | 12-18-2014 |
20150035163 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - The present invention provides a semiconductor package and a method of fabricating the same, including: placing a semiconductor element in a groove of a carrier; forming a dielectric layer on the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second of the carrier on a sidewall of the groove intact for the second portion to function as a supporting part. The present invention does not require formation of a silicon interposer, therefore the overall cost of the final product is much reduced. | 02-05-2015 |
20150035164 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - The present invention provides a semiconductor package and a method of fabricating the same, including: placing in a groove of a carrier a semiconductor element having opposing active and non-active surfaces, and side surfaces abutting the active surface and the non-active surface; applying an adhesive material in the groove and around a periphery of the side surfaces of the semiconductor element; forming a dielectric layer on the adhesive material and the active surface of the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second portion of the carrier on a side wall of the groove intact for the second portion to function as a supporting member. The present invention does not require formation of a silicon interposer, and therefore the overall cost of a final product is much reduced. | 02-05-2015 |
Patent application number | Description | Published |
20130087951 | Molding Chamber Apparatus and Curing Method - An embodiment is a molding chamber. The molding chamber comprises a mold-conforming chase, a substrate-base chase, a first radiation permissive component, and a microwave generator coupled to a first waveguide. The mold-conforming chase is over the substrate-base chase, and the mold-conforming chase is moveable in relation to the substrate-base chase. The first radiation permissive component is in one of the mold-conforming chase or the substrate-base chase. The microwave generator and the first waveguide are together operable to direct microwave radiation through the first radiation permissive component. | 04-11-2013 |
20130122689 | Methods for De-Bonding Carriers - A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape. | 05-16-2013 |
20130207306 | Methods for Molding Integrated Circuits - A method includes molding a polymer onto a package component. The step of molding includes a first molding stage performed at a first temperature, and a second molding stage performed at a second temperature different from the first temperature. | 08-15-2013 |
20140346665 | Integrated Circuit Structure and Method for Reducing Polymer Layer Delamination - An embodiment integrated circuit structure includes a substrate, a metal pad over the substrate, a post-passivation interconnect (PPI) structure over the substrate and electronically connected to the metal pad, a first polymer layer over the PPI structure, an under bump metallurgy (UBM) extending into an opening in the first polymer layer and electronically connected to the PPI structure, and a barrier layer on a top surface of the first polymer layer adjacent to the UBM. | 11-27-2014 |
20150050783 | Molding Chamber Apparatus and Curing Method - An embodiment is a molding chamber. The molding chamber comprises a mold-conforming chase, a substrate-base chase, a first radiation permissive component, and a microwave generator coupled to a first waveguide. The mold-conforming chase is over the substrate-base chase, and the mold-conforming chase is moveable in relation to the substrate-base chase. The first radiation permissive component is in one of the mold-conforming chase or the substrate-base chase. The microwave generator and the first waveguide are together operable to direct microwave radiation through the first radiation permissive component. | 02-19-2015 |
Patent application number | Description | Published |
20130141301 | ANTENNA STRUCTURE - An antenna structure includes a circuit board and at least one antenna circuit. The circuit board includes a ground area and an antenna area. The antenna area is substantially rectangular-shaped and arranged between the ground area and the periphery of the circuit board. The antenna circuit is formed within the antenna area and includes a feeding segment, a border segment and at least one ground segment. The feeding segment is connected to the border segment and the distance from the border segment to the periphery of the circuit board ranges from 0 to 3 millimeters; a substantially 90° bent-structure is formed within the border segment. One end portion of the ground segment is connected to the ground area. Thus an antenna structure which enables the antenna circuit to be formed within the remaining space on the periphery of the circuit board is provided. | 06-06-2013 |
20130292347 | BOOKCASE SYSTEM - A bookcase system is provided. The bookcase system includes at least adjacently arranged two bookcase units. Each of the bookcase units further includes a first RFID reader having an antenna and placed on a first lateral side of the bookcase unit. The bookcase unit further includes a separating structure placed between two of the adjacently arranged bookcase units. The separating structure may further include at least three metal plates forming a three-layer stacked structure, and a lateral side of each of the metal plates is larger than half of a wavelength of an operating frequency of the antenna. And books are placed along a direction parallel to the lateral side. | 11-07-2013 |
20130334310 | RECOGNITION SYSTEM HAVING PERIODIC GUIDED-WAVE STRUCTURE - A recognition system is offered. The recognition system is for sensing a plurality of units under test of at least an object under test. The recognition system comprises a periodic guided-wave structure and a near field sensing device. The periodic guided-wave structure is disposed under the object under test and has a plurality of conductive units periodically arranged on a plane. The near field sensing device has a near field antenna and senses the plurality of units under test through detecting the near filed magnetic field. The periodic guided-wave structure confines the electromagnetic field for facilitating to determine the distance from any one of the units under test to the periodic guided-wave structure. | 12-19-2013 |
20150035708 | ANTENNA SYSTEM FOR MOBILE COMMUNICATION AND ANTENNA MODULE THEREOF - An antenna system for mobile communication includes a transportation device and an antenna module installed on the transportation device. The antenna module has a first polarized antenna unit and a second polarized antenna unit. The polarized direction of first polarized antenna unit is perpendicular to the polarized direction of second polarized antenna unit, such that when the transportation device moves along a first direction, the first and the second polarized antenna units are coupling to each other, and each has an 8-shaped radiation pattern. The longitudinal direction of the radiation pattern of the first polarized antenna unit and the longitudinal direction of the radiation pattern of the second polarized antenna unit are parallel to a second direction, and the second direction is not parallel to the first direction. Thus, the instant disclosure provides the antenna system capable of restraining the multipath fading of mobile communication. | 02-05-2015 |