Patent application number | Description | Published |
20120024580 | EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant; (F) an optional toughening agent; and (G) an optional inorganic filler. | 02-02-2012 |
20120059096 | Stable Solution of the Polymer Prepared from N,O-Heterocycles and its Preparation Method and Use - A stable solution of the polymer prepared from N,O-heterocyclic compound and its preparing method are provided, wherein the stable solution is prepared by making the N,O-heterocyclic compound of formulae I or II carry out a ring-opening polymerization: | 03-08-2012 |
20120097437 | Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the Same - A resin composition is provided. The resin composition comprises:
| 04-26-2012 |
20120263955 | RESIN COMPOSITION AND USES OF THE SAME - A resin composition is provided. The resin composition comprises an epoxy resin and a hardener, wherein the amount of the hardener is about 10 parts by weight to about 200 parts by weight per 100 parts by weight of the epoxy resin and the hardener comprises a first styrene-maleic anhydride copolymer (SMA) copolymer and a second SMA copolymer, the first SMA copolymer has a molar ratio of styrene to maleic anhydride m1, the second SMA copolymer has a molar ratio of styrene to maleic anhydride m2, and m1−m2≧3. | 10-18-2012 |
20120279769 | RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME - A resin composition is provided. The resin composition comprises an epoxy resin, a hardener, and a modifier, wherein the modifier is a polymer solution obtainable from the following steps:
| 11-08-2012 |
20120329912 | FUSED FILLER AND ITS MANUFACTURING METHOD AND USE - A fused filler and method for manufacturing the same are provided. The fused filler comprises about 50 wt % to about 60 wt % SiO | 12-27-2012 |
20130143046 | EPOXY RESIN COMPOSITION, AND PREPREG AND METAL-CLAD LAMINATE USING THE SAME - Disclosed is an epoxy resin composition, which includes (A) an epoxy resin having at least two epoxy groups in one molecule; (B) a curing agent; and (C) polystyrene. | 06-06-2013 |
20140044973 | RESIN COMPOSITION AND USES OF THE SAME - A resin composition is provided. The resin composition comprises an epoxy resin, a zinc oxide powder and a hardener, wherein the zinc oxide powder has a Mohs hardness ranging from about 4 to about 5 and a diameter ranging from about 0.1 μm to about 50 μm, and the amount of the zinc oxide powder is more than 0.5 parts by weight and less than 10 parts by weight per 100 parts by weight of the epoxy resin. | 02-13-2014 |
20140072807 | RESIN COMPOSITIONS AND USES OF THE SAME - A resin composition is provided. The resin composition comprises an epoxy resin, a first filler containing calcium carbonate and hydrated magnesium silicate and a hardener, wherein the first filler has a diameter ranging from about 0.1 μm to about 100 μm; and the amount of the first filler is about 1 part by weight to about 150 parts by weight per 100 parts by weight of the epoxy resin. | 03-13-2014 |