Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Hsien-Ming
Hsien-Ming Chen US
| Patent application number | Description | Published |
|---|---|---|
| 20100106956 | BIOS SWITCHING SYSTEM AND A METHOD THEREOF - A BIOS switching system applicable to a computer system is provided. The BIOS switching system includes an input module and a memory module, and the memory module further includes a plurality of BIOS's, an option recording block, and a boot-up management block. The input module produces a switching signal according to a user input. The boot-up management block determines whether replacing an execution option block's data in the option recording block is necessary or not based on the switching signal. The data of the execution option block is identification data of one of the BIOS's. The boot-up management block executes the BIOS indicated by the data of the execution option block while the computer system boots up. | 04-29-2010 |
Hsien-Ming Lee, Changhua TW
| Patent application number | Description | Published |
|---|---|---|
| 20080286965 | Novel approach for reducing copper line resistivity - A method for fabricating an integrated circuit structure and the resulting integrated circuit structure are provided. The method includes forming a low-k dielectric layer; form an opening in the low-k dielectric layer; forming a barrier layer covering a bottom and sidewalls of the low-k dielectric layer; performing a treatment to the barrier layer in an environment comprising a treatment gas; and filling the opening with a conductive material, wherein the conductive material is on the barrier layer. | 11-20-2008 |
| 20090047780 | Method for forming composite barrier layer - Provided is a method for forming a composite barrier layer with superior barrier qualities and superior adhesion properties to both dielectric materials and conductive materials as the composite barrier layer extends throughout the semiconductor device. The composite barrier layer may be formed in regions where it is disposed between two conductive layers and in regions where it is disposed between a conductive layer and a dielectric material. The composite barrier layer may consist of various pluralities of layers and the arrangement of layers that form the composite barrier layer may differ as the barrier layer extends throughout different sections of the device. Amorphous layers of the composite barrier layer generally form boundaries with dielectric materials and crystalline layers generally form boundaries with conductive materials such as interconnect materials. | 02-19-2009 |
Hsien-Ming Lee, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20110126613 | WATERPROOF ELECTRONIC DEVICE WITH TEST STRUCTURE AND WATER-LEAK TEST FIXTURE AND METHOD THEREOF - The present invention is directed to a waterproof electronic device with a test structure, including a test opening, a sealing structure and a fixation structure. The test opening is arranged on a housing of the waterproof electronic device, and is used for injecting a test fluid for detecting water leak. The sealing structure is arranged on the housing or a test fixture, and is used for holding a sealing element such that the waterproof electronic device and the test fixture may be sealed to each other when performing a leak test. The fixation structure is used for fixing the test fixture on the waterproof electronic device. | 06-02-2011 |
Hsien-Ming Wu, Tai Chung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110293870 | COMPOSITE COVER SHEET AND COVER SHEET ASSEMBLY - A composite cover sheet includes a first protective film, a first adhesive layer, a second protective film and a second adhesive layer. The first protective film has a first sticking part and a first movable part. The first protective film is attached to a base sheet through the first adhesive layer, and the first protective film is removed from the base sheet through the first movable part. The second protective film has a second sticking part and a second movable part, and the second protective film and the first protective film are separately formed. The second protective film is attached to the first protective film through the second adhesive layer, and the second protective film is removed from the first protective film through the second movable part. | 12-01-2011 |