| Patent application number | Description | Published |
|---|
| 20110110024 | COMPUTER SYSTEM - A computer system includes a motherboard, a power supply unit, an interconnect card, and a chassis. The motherboard includes a power connector capable of transmitting power to the motherboard. The power supply unit includes a power supply unit connector. The interconnect card includes a first connector and a second connector. The power supply unit and the motherboard are mounted in the chassis. The first connector is connected with the power supply unit connector, and the second connector connected with the power connector. | 05-12-2011 |
| 20110110033 | MOUNTING APPARATUS FOR PCI CARD - A mounting apparatus includes a mounting bracket, a mounting piece adapted to mount a PCI card to the mounting bracket, and a securing member. The mounting bracket includes a base and a blocking plate. The mounting piece includes an elongated body and a mounting end. The securing member includes a first pivoting portion pivotably attached to the mounting bracket, a pressing portion, and a mounting portion. The mounting portion includes a securing portion. The securing portion includes a handling portion and a second engaging portion extending from the handling portion. The second engaging portion engages the first engaging portion. The handling portion is configured to drive the second engaging portion to disengage the first engaging portion by pressing the handling portion. | 05-12-2011 |
| 20110110056 | MOUNTING APPARATUS FOR PCI CARD - A mounting apparatus for a PCI card includes a mounting bracket, a mounting piece for attaching the PCI card to the mounting bracket, and a securing member. The mounting bracket has a base and a blocking plate bent from the base. The mounting piece includes an elongated body and a mounting end bent from the elongated body. The elongated body adjoins the base and the mounting end abuts on the blocking plate. The securing member includes a first pivoting portion pivotably attached to the mounting bracket, a pressing portion extending from the pivoting portion, and a securing portion extending from the pressing portion. The pressing portion elastically abuts against the mounting end, thereby sandwiching the mounting end between the blocking plate and the pressing portion. The securing portion is for driving the pressing portion to move away from the mounting end by handling the securing portion. | 05-12-2011 |
| 20110116227 | COMPUTER SYSTEM WITH HEAT SINK - A computer system includes a chassis, a motherboard, an isolation component, and a block. The chassis includes a bottom wall, and a sidewall connected to the bottom wall. The motherboard is secured to the chassis. A heat sink is secured to the motherboard for cooling a chip mounted on the motherboard. An isolation component is secured to the chassis between the bottom wall and the motherboard. The isolation component includes a bent piece attached to the side wall and positioned between the heat sink and the sidewall. A distance is defined between the bent piece and the heat sink. The block is attached to the bent piece and positioned between the heat sink and the sidewall to span the distance. | 05-19-2011 |
| 20110116229 | ELECTRONIC DEVICE WITH EXPANSION CARD MODULES - An electronic device includes a chassis having a bottom wall, a rear wall, and a sidewall perpendicular to each other. A motherboard is secured on the chassis bottom wall. A first socket is disposed on the motherboard. A mounting bracket is secured in the chassis above the motherboard. The mounting bracket includes a first mounting wall and a second mounting wall. The first mounting wall is parallel to and spaced from the sidewall of the chassis, and the second mounting wall is parallel to and spaced from the rear wall. A first riser card is coupled to the first socket on the motherboard, and is secured to the first mounting wall of the mounting bracket. An expansion card module is accommodated in the mounting bracket and parallel to the bottom wall of the chassis. | 05-19-2011 |
| 20110121005 | ENCLOSURE WITH FLANGE - An enclosure includes a bottom panel and a side panel extending from the bottom panel. The side panel is substantially perpendicular to the bottom panel. The side panel has an opening and a flange surrounding the opening. A cross section of the flange includes a first side portion, a bent portion extending from the first side portion, and a second side portion. An angle is defined by the second side portion and the side panel is larger than 90 degrees. The flange is configured to prevent the opening to be deformed. | 05-26-2011 |
| 20110122564 | COMPUTER - A computer includes an enclosure, a platform, a motherboard and at least one disk drive. A receiving space is defined by the enclosure. The platform divides the receiving space into at least two housings. The motherboard and the at least one disk drive are located in different housings. | 05-26-2011 |
| 20110122566 | COMPUTER - A computer includes an enclosure, a heat sink and a fan. Two openings are defined at opposite sides of the enclosure. The heat sink is located in the enclosure. The fan is located at one opening of the enclosure. Air current generated from the fan travels through the enclosure for dissipating heat from the heat sink and entire computer. | 05-26-2011 |
| 20110122568 | COMPUTER - A computer includes an enclosure, at least one disk drive, a panel and a fan. The at least one disk drive is located in the enclosure. The panel is mounted to a side of the enclosure. The panel has different material relative to the enclosure. The fan is mounted to the panel. The vibration generated from fan is indirectly transferred to the at least one disk drive. | 05-26-2011 |
| 20110122576 | COMPUTER - A computer includes an integral enclosure, a front panel and a back panel. The enclosure is made of a single piece of extruded aluminum. The enclosure includes a top wall, a bottom wall and two side walls. The bottom wall parallels to the top wall. Two openings are defined at opposite sides of the enclosure. The front panel covers one opening of the enclosure. The back panel covers the other opening of the enclosure. | 05-26-2011 |
| 20110174955 | MOUNTING APPARATUS FOR STORAGE DEVICE - A mounting apparatus for a storage device comprises a chassis configured for receiving the storage device and a securing member configured for securing the storage device. The chassis defines a positioning pin, for engaging in a positioning slot defined in the storage device, and an elastic piece mounted on the chassis. The elastic piece is elastically deformed when the securing member is engaged with the storage device and capable of rebounding to drive the storage device to move away from the wall when the securing member is disengaged from the storage device. | 07-21-2011 |
| 20110269334 | CONNECTING MEMBER - A connecting member includes a cable used to transmit signal, a first connector and a second connector connected to the cable, and an elastic member mounted on the cable. The first connector and the second connector are configured for being electronically connected to two electronic components. The elastic member is elastically deformable between a first state, where the elastic member and the cable are constricted, and a second state, where the elastic member and the cable are extended. | 11-03-2011 |
| 20110275240 | CONNECTING MEMBER - A connecting member includes a cable configured to transfer signal, two securing members, and a resilient component. The two securing members secure the resilient component to the cable, the resilient component is elastically deformable between a first state, in which the resilient component and the cable are contracted, and a second state, in which the resilient component and the cable are extended. | 11-10-2011 |
| 20110281457 | CONNECTOR ASSEMBLY - A connector assembly includes a resilient mounting panel and a connector. The resilient mounting panel includes a panel body and a mounting protrusion. The connector includes a connector body and a mounting portion extending from the connector body. The connector body is configured to connect to an electronic device, and the mounting portion is configured to be secured to the mounting protrusion and to space the connector from the panel body. | 11-17-2011 |
| 20110287660 | CONNECTING MEMBER - A connecting member includes a cable configured to transfer signal, and a resilient component secured to the cable. The cable includes a first connector and a second connector for being electronically connected to two electronic components. The resilient component is elastically deformable between a first state, in which the resilient component and the cable are contracted, spiraled about the second connector in a first direction up to the first connector, shortening a distance between the first and second connectors, and a second state, in which the resilient component and the cable are pulled away from the first connector, thus a greater distance between the first and second connectors. | 11-24-2011 |
| 20110297416 | CONNECTING MEMBER - A connecting member includes an elastic element and a cable assembly. The cable assembly includes a flexible cable. The flexible cable is attached to the elastic element along an extension direction of the elastic element. The elastic element is elastically deformable between an original state and an extended state. In the original state, the elastic element and the cable are in a spiral. In the extended state, the elastic element and the flexible cable are extended within a plane. | 12-08-2011 |
| 20110306233 | CONNECTING DEVICE - A connecting device includes a cable transmitting a signal, a carrier receiving the cable, a sliding member slidable on the carrier, and a resilient component. The carrier includes a first side plate and a second side plate opposite to the first side plate, and a fixing post is secured in the carrier adjacent to the first side plate. The resilient component is secured to the fixing post and the sliding member, and the cable runs between the fixing post and the sliding member, wherein the resilient component is elastically deformable between a first state and a second state. In the first state, the resilient component is in an original state, substantially all of the cable is in the carrier, and the sliding member abuts the second side plate. In the second state, the resilient component is in elastically deformed, substantially all of the cable is exposed from the carrier, and the sliding member slides adjacent to the first side plate. | 12-15-2011 |
| Patent application number | Description | Published |
|---|
| 20080304244 | Electrical connector having improved housing - An electrical connector ( | 12-11-2008 |
| 20090004905 | Electrical connector having locking mechanism - An electrical connector ( | 01-01-2009 |
| 20090047817 | Electrical contact having asymmetric dual-contact-engaging-arm - A contact ( | 02-19-2009 |
| 20090098753 | Electrical connector having wire type contacts - An electrical connector ( | 04-16-2009 |
| 20090130899 | Electrical connector assembly and clip mechanism thereof - A clip comprises two pieces of load plates. Each load plate has a pressing portion extending downwardly in a middle position thereof and two retention portions at two ends thereof, the two pieces of load plates across dispose when the load plates are secured. | 05-21-2009 |
| 20090203235 | Electrical connector having terminals with improved wiping capability - An electrical connector ( | 08-13-2009 |
| 20090221158 | Socket having engaing clump - A socket, for electrically connecting an IC package with gaps on two sides thereof and a printed circuit board, comprises an insulative housing, a plurality of contacts received in the insulative housing and a pair of engaging clumps. The insulative housing has a bottom wall and a plurality of sidewalls upwardly extending from the bottom wall, the sidewalls and the bottom wall together define a space for the IC package, two opposed sidewall further have engaging slots. The engaging clump is received in the engaging slot, and has a post entering into the space to engaging with the gap of the IC package and a transverse arm abutting against and position the IC package. | 09-03-2009 |
| 20110265103 | OPTICAL DISC PLAYER - An optical disc player includes a lower housing, an upper housing, and a tray. The upper housing is adapted to combine with the lower housing to form a receiving space. The tray is adapted to load an optical disc. The tray divides the receiving space into a lower space and an upper space. The tray defines at least one through hole for communicating the lower space and the upper space. | 10-27-2011 |
| 20110265104 | OPTICAL DISC PLAYER - An optical disc player includes a case, a tray received in the case, and a decelerating member. The tray is adapted to hold an optical disc. The decelerating member integrates with the case, and is capable of stopping the rotating optical disc by friction generated between the decelerating member and edge of the rotating optical disc. | 10-27-2011 |
| Patent application number | Description | Published |
|---|
| 20090243759 | LOW-PASS FILTER - A low-pass filter ( | 10-01-2009 |
| 20090262865 | CARRIER FREQUENCY OFFSET ESTIMATING DEVICE AND SYSTEM - A carrier frequency offset estimating device for estimating frequency offsets of a multi-carrier signal includes a transforming circuit, a cosine effect eliminating circuit, a model creating circuit, and an estimating circuit. The transforming circuit receives the multi-carrier signal and transforms the multi-carrier signal to single-carrier signals. The cosine effect eliminating circuit eliminates cosine effects in the single-carrier signals to form single-carrier signals without the cosine effects. The model creating circuit creates linear data models according to the single-carrier signals without the cosine effects. The estimating circuit estimates the frequency offsets of the multi-carrier signal according to the linear data models. A carrier frequency offset estimating system is also provided. | 10-22-2009 |
| 20090263994 | ELECTRONIC DEVICE - An electronic device includes an enclosure, a protecting member, and a power plug. The enclosure includes a top wall, a bottom wall, sidewalls, a socket, and a slot to receive an electronic card. The socket and the slot are defined in one of the sidewalls. The protecting member includes a receiving portion bounding the socket and the slot and a sliding plate capable of sliding to an open position and a closed position in the receiving portion. Movement of the sliding plate in the open position does not allow insertion of the power plug into the socket and allows the electronic card to be inserted into or removed from the slot, and movement of the sliding plate in the closed position allows insertion of the power plug into the socket and does not allow the electronic card to be inserted into or removed from the slot. | 10-22-2009 |
| 20100330916 | INTERFERENCE ELIMINATING CIRCUIT AND SIGNAL TRANSCEIVING SYSTEM EMPLOYING THE SAME - An interference eliminating circuit for removing an interference signal from a multi-carrier signal includes a training sequence generator, a first multiplier, a second multiplier, a phase shift circuit, a buffer, and an adder. The multi-carrier signal includes a first training sequence. The training sequence generator generates a second training sequence orthogonal to the first training sequence. The first multiplier attaches the second training sequence to the multi-carrier signal to obtain a new multi-carrier signal. The second multiplier attaches the second training sequence to the new multi-carrier signal to obtain the interference signal. The phase shift circuit shifts phase of the interference signal to obtain an adverse signal of the interference signal. The buffer buffers the multi-carrier signals. The adder adds the adverse signal of the interference signal to the buffered multi-carrier signals to remove the interference signal. | 12-30-2010 |
| Patent application number | Description | Published |
|---|
| 20090133855 | HEAT DISSIPATION DEVICE AND ASSEMBLY METHOD THEREOF - A heat dissipation device includes a heat pipe having a condenser section and a layer of solid-state solder film on an exterior surface of the condenser section, a heat sink having a plurality of spaced fins, each of which has an aperture. The condenser section of the heat pipe fits into the apertures of the fins. The heat sink with the condensing section received therein is heated and the solid-state solder film melts, filling gaps between the heat pipe and the fins. A method of assembling the device is also provided. | 05-28-2009 |
| 20090165990 | METHOD OF OBTAINING ACCURATELY A HEAT-DISSIPATING REQUIREMENT FOR ELECTRONIC SYSTEMS - A method of obtaining accurately a heat-dissipating requirement for electronic systems of a same kind uses a thermal analysis software, a passed thermal module with a fan, and a fan speed regulating device. The method includes steps of: (1) connecting the fan to the fan speed regulating device; | 07-02-2009 |
| 20090168365 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a circuit board ( | 07-02-2009 |
| 20100181048 | HEAT PIPE - A heat pipe includes a casing and a three-dimensional cross-linkage wick structure received in the casing. The three-dimensional cross-linkage wick structure has a plurality of pores therein for providing a capillary action and includes a bottom layer being attached to the casing and a plurality of protrusions extending from the bottom layer and spaced from each other. A groove is defined between two adjacent protrusions. The bottom layer has a connecting portion under the groove. The connection portion is formed between and connects with the two adjacent protrusions. The connection portions have a smaller pore size than the protrusions. | 07-22-2010 |
| 20100212871 | HEAT PIPE AND MANUFACTURING METHOD THEREOF - A heat pipe includes a sealed hollow casing, a wick structure lining an inner surface of the casing and a working medium contained in an interior of the casing. The casing includes an elongated main body having an elongated opening extending axially in the main body and a transparent cover fixed onto the main body and sealing the opening of the main body. The wick structure is provided by only lining an inner surface of the main body of the casing. | 08-26-2010 |
| 20100236760 | HEAT PIPE - A heat pipe includes a casing having an inner wall. A plurality of protrusions are radially formed on the inner wall of the casing. The plurality of protrusions are spaced from each other and extend longitudinally from one end of the casing to the other end of the casing. A main groove is defined between every two adjacent protrusions. The protrusions each define a plurality of first auxiliary grooves and a plurality of second auxiliary grooves being alternatively arranged with respect to each other along a longitudinal direction of the casing. The first auxiliary and the second auxiliary grooves each communicate two adjacent main grooves. The first auxiliary grooves each are inclined at an angle with respect to a longitudinal axis of the casing, and the second auxiliary grooves each are inclined at another different angle with respect to the longitudinal axis of the casing. | 09-23-2010 |
| 20110048679 | HEAT DISSIPATION DEVICE - A heat dissipation apparatus includes a flat heat pipe and a plurality of fins stacked together. Each fin defines a substantially rectangular-shaped receiving hole therein for receiving a condenser section of the flat heat pipe and a small-sized accommodating hole therein for accommodating a solder paste. A combining sidewall extends from an edge of the receiving hole, and includes elongated top and bottom planar plates, and a short plate extending from one end of the bottom planar plate towards the top planar plate. The accommodating hole is located at a junction of the top planar plate and the short plate. The solder paste accommodated in the accommodating hole is melted to flow into the receiving hole to fill up a clearance between the flat heat pipe and the combining sidewall to combine the flat heat pipe and the fins together. | 03-03-2011 |
| 20110235280 | HEAT DISSIPATION APPARATUS AND ELECTRONIC ASSEMBLY WITH SAME - A heat dissipation apparatus includes a heat sink and fasteners. The heat sink defines a plurality of through holes therein. An inner thread is formed on an inner surface of each through hole. Each fastener includes a bolt and a spring around the bolt. The bolt includes a main post, a cap formed on a top of the main post, and a engaging portion formed on a bottom of the main post. A retaining thread is formed on an outer surface of the main post near the engaging portion. The retaining thread matches the inner thread of the through hole. The retaining thread of the main post is configured to pass through the through hole by threading the retaining thread though the inner thread of the through hole. After the retaining thread has passed through the through hole, the retaining thread abuts a bottom surface of the heat sink. | 09-29-2011 |
| 20110235301 | HEAT DISSIPATION APPARATUS AND ELECTRONIC ASSEMBLY WITH SAME - A heat dissipation apparatus includes a base plate and a plurality of fasteners. A plurality of mounting arms extends outwardly from the base plate. Each mounting arm defines a through hole therein. An inner thread is formed on an inner surface of each through hole. Each fastener includes a main post, a cap formed at a top of the main post, and an engaging portion formed at a bottom of the main post. A retaining thread is formed on an outer surface of the main post adjacent the engaging portion. The retaining thread matches the inner thread of the through hole of the corresponding mounting arm. The retaining thread is passable through the through hole of the mounting arm by threadingly passing the retaining thread through the inner thread of the through hole of the mounting arm whereupon the fastener remains preassembled in the through hole. | 09-29-2011 |
| 20110297356 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe. | 12-08-2011 |
