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Hsieh, Taoyuan Hsien
Chen-Hui Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090184520 | Turbine ventilator for generating electricity - A turbine ventilator includes a housing having a hub, a tube having a lower segment secured to the hub, a seat disposed on an upper portion of the tube, an electric generator disposed on the seat and having a rotor and an extension secured to the rotor and extended out of the generator, a carrier rotatably attached to the tube, and a number of blades each having a lower portion secured to the carrier and an upper portion secured to the extension of the rotor for rotating the extension of the rotor relative to the generator in order to generate an electric energy. The extension of the rotor includes a relatively shorter length for allowing the rotor to be effectively rotated relative to the generator by the blades. | 07-23-2009 |
Chen-Tsai Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090293260 | CONDUCTIVE WINDING STRUCTURE, THE FABRICATING METHOD THEREOF, AND THE MAGNETIC DEVICE HAVING THE SAME - A conductive winding structure, the fabricating method thereof, and the magnetic device having the same are disclosed. The method for fabricating the conductive winding structure comprises steps of: (a) providing a mold; (b) performing an electroforming procedure to form a conductive layer on partial surface of the mold; and (c) stripping the conductive layer from the mold, so as to obtain the conductive winding structure. | 12-03-2009 |
| 20100117780 | CONDUCTIVE WINDING ASSEMBLY AND FABRICATING METHOD THEREOF - A method for fabricating a conductive winding module of a magnetic element includes the following steps. Firstly, a non-insulated winding structure including multiple conductive units is provided, wherein the conductive units have respective conductive bodies, and one or more of the conductive units have pins. Then, an insulating varnish layer is formed on surfaces of the conductive bodies, thereby producing the conductive winding module. | 05-13-2010 |
Chia-Han Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20100001298 | LED-packaging arrangement and light bar employing the same - An LED-packaging arrangement, comprising: a first connection block with an enclosure groove at the bottom thereof; a second connection block with an enclosure groove at the bottom thereof; a light-emitting chip positioned at the top of the first connection block and via connection wires electrically coupled to the first and second connection blocks; a positioning/packaging body, and a transparent packaging body. Alternatively, a third connection block is provided with an enclosure groove at the bottom thereof. In this case, the electrical connection originally to the first connection block via the connection wire is changed to the third connection block. The first and second connection blocks are enclosed by the lower part of the positioning/packaging body in position such that the bottom surfaces of the first and second connection blocks are exposed. The upper part of the positioning/packaging body encloses the light-emitting chip so as to create a reflection cap. The transparent packaging body is employed to seal and fix the light-emitting chip and the connection wires in position for an optimal protection. In this way, the problem of the prior art is resolved that the heat generated by the light-emitting chip is not easily dissipated. Moreover, the heat-dissipating efficiency and the structural strength can be considerably enhanced. | 01-07-2010 |
| 20110156092 | SMT ENCAPSULATION BODY OF A LIGHT-EMITTING DIODE WITH A WIDE-ANGLE ILLUMINATION LIGHT SHAPE - An SMT encapsulation body of a light-emitting diode with a wide-angle illumination light shape, comprising: a) a substrate; b) an LED die mounted on the substrate by use of SMT; and c) an encapsulation body positioned around the LED die in the shape of a double dome at the top thereof with the center at a lower position such that the illumination light shape of the light-emitting diode becomes to be a wide-angle and elongated body. The encapsulation body may be formed either in the shape of a batwing or in the shape of a double batwing symmetrically positioned in a cross way. In this way, the light-emitting diode achieves a wide-angle illumination light shape fulfilling the requirements of a certain purpose without the use of the double optical effect of the lens. Meanwhile, the drawbacks of the conventional structure are resolved. Moreover, an increased efficiency in using the light source is ensured. | 06-30-2011 |
Chi-Hao Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090180727 | FAN AND BEARING STRUCTURE - The present invention provides a fan including a stator and a rotor coupled to the stator. The stator has a base and a bearing disposed inside the base. The rotor has a shaft supported by the bearing. Furthermore, the shaft has a concave structure formed on a surface thereof, or the bearing has a groove structure formed on a surface thereof. | 07-16-2009 |
Hsieh-Shen Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20080217787 | MICRO-ELECTROMECHANICAL DEVICE AND MANUFACTURING METHOD THEREOF - A micro-electromechanical device includes a substrate, a first patterned conductive layer, a second patterned conductive layer and a first patterned blocking layer. The first patterned conductive layer is disposed on the substrate. The second patterned conductive layer is disposed on the first patterned conductive layer. The first patterned blocking layer is connected with the first patterned conductive layer and the second patterned conductive layer. In addition, a method of manufacturing the micro-electromechanical device is also disclosed. | 09-11-2008 |
| 20120056223 | LED PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF - A LED package structure includes a supporting substrate, a first electrically-conductive structure, a LED chip, an insulating layer and a second electrically-conductive structure. The supporting substrate includes a top surface, a bottom surface and a first channel. The first electrically-conductive structure is filled in the first channel and partially formed on the top and bottom surfaces of the supporting substrate. The LED chip is disposed over the supporting substrate. The insulating layer is formed over the supporting substrate and on bilateral sides of the LED chip. The insulating layer has a second channel corresponding to the first electrically-conductive structure. The second electrically-conductive structure is filled in the second channel and partially formed on the insulating layer, and connected with an electrode of the LED chip. The LED chip and the top and bottom surfaces of the supporting substrate are connected with each other through the first and second electrically-conductive structures. | 03-08-2012 |
Hung-Chang Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20100003844 | ELECTRICAL CONNECTOR HAVING LATCHING MECHANISM - An electrical connector includes a plurality of pins, an isolation body and a latching mechanism. The isolation body includes a receiving part. The receiving part is arranged at a front edge of the isolation body and has a first engaging element. The latching mechanism has a second engaging element engaged with the first engaging element, so that the latching mechanism is fixed onto the isolation body. | 01-07-2010 |
| 20100271785 | HEAT-DISSIPATING AND FIXING MECHANISM OF ELECTRONIC COMPONENT AND PROCESS FOR ASSEMBLING SAME - A heat-dissipating and fixing mechanism of an electronic component includes a heat-dissipating element, a circuit board and a thermally-conductive adhesive interface. The circuit board has multiple insertion holes. The pins of the electronic component are inserted into corresponding insertion holes of the circuit board. The thermally-conductive adhesive interface has a first surface bonded with the heat-dissipating element and a second surface bonded with the electronic component. As a consequence, the electronic component is fixed on the heat-dissipating element through the thermally-conductive adhesive interface, and the heat generated by the electronic component is transmitted to the heat-dissipating element through the thermally-conductive adhesive interface. | 10-28-2010 |
Ken Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20120094533 | COAXIAL CABLE END CONNECTOR - The present invention relates to a coaxial cable end connector, which includes an insulating housing, a signal terminal, and a shielding housing. The insulating housing includes a hollow hole, a terminal cavity, and an insulating plate. The signal terminal is disposed in the terminal cavity. The signal terminal includes a flat portion, wherein the flat portion of the signal terminal is electrically connected with an end of an internal conductive wire of the coaxial cable. A through hole is formed on a central region of the flat portion of the signal terminal, and two limiting pillars is disposed around an edge of the through hole of the signal terminal for positioning the internal conductive wire of the coaxial cable. The shielding housing includes a circular portion and a cover, wherein the circular portion of the shielding housing surrounds the insulating housing. | 04-19-2012 |
Ming-Hsien Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090101388 | FLAT CABLE ASSEMBLY FOR USE IN POWER SUPPLY APPARATUS - A flat cable assembly includes a plurality of power cables and a bonding medium. The plurality of power cables are parallel with each other, wherein every two adjacent power cables are separated from each other. The bonding medium is used for boding every two adjacent power cables together, thereby cooperatively forming the flat cable assembly having a first surface and a second surface. A first gap is formed between the first surface and the bonding medium and a second gap is formed between the second surface and the bonding medium. | 04-23-2009 |
Ming-Kai Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20080219845 | FAN - A fan includes an impeller, a motor, a plurality of first engaging members and a plurality of second engaging members. The impeller includes a hub and a plurality of blades disposed around the hub. The motor includes a rotor housing coupled with the hub, and the motor is for driving the impeller to rotate. The first engaging members are disposed on an inner side of the top surface of the hub, and the second engaging members are disposed on the top surface of the housing. When the impeller and the rotor housing are assembled, the second engaging members are disposed corresponding to the first engaging members, so that parts of the first engaging members are engaged into and assembled with the second engaging members. | 09-11-2008 |
Ping-Hsun Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20100283807 | Liquid Crystal Display Panel and Display Devices - A liquid crystal display panel includes a substrate and a plurality of display units. Each display unit includes a first sub-display unit and a second sub-display unit. The first sub-display unit includes a first sub-pixel unit corresponding to a first color, a second sub-pixel unit corresponding to a second color, a third sub-pixel unit corresponding to a third color, and a fourth sub-pixel unit corresponding to a fourth color. The second sub-display unit includes a fifth sub-pixel unit corresponding to the third color, a sixth sub-pixel unit corresponding to the fourth color, a seventh sub-pixel unit corresponding to the first color, and a eighth sub-pixel unit corresponding to the second color. | 11-11-2010 |
Shang-Pei Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090128065 | FAN WITH SOFT START FUNCTION - A bathroom ventilator fan with the soft-start function includes an impeller and a motor. The motor is coupled to the impeller for driving the impeller to rotate. The motor has a control module for driving and controlling the rotation speed of the motor according to a soft-start signal. The soft-start signal includes a soft-start section and a target-driving section. The control module slowly increases the rotation speed of the motor from the soft-start section to reach the target-driving section. | 05-21-2009 |
Sheng-Fan Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20120013219 | POWER GENERATION DEVICE - A power generation device is disclosed, which includes a plurality of thermomagnetic generator and a flow controller. The thermomagnetic generators can acquire first fluids respectively. The flow controller can control flow rates of the second fluids flowing into the thermomagnetic generators respectively, wherein a fluid temperature of the first fluid is different from a fluid temperature of the second fluid. | 01-19-2012 |
Shin-Chih Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090093160 | FILTER AND HOUSING THEREOF - A filter includes a housing and a filter device. The housing includes a base and an outer case. The base includes a main body, an accommodating part, a power-inputting terminal, a first grounding terminal and a second grounding terminal. The second grounding terminal has a flexible portion disposed on the periphery of the main body and a connecting portion connected to the first grounding terminal. The filter device disposed in the accommodating part of the base of the housing includes at least one filtering device. The outer case partially covers the periphery of the main body and the accommodating part and contacts the flexible portion of the second grounding terminal. | 04-09-2009 |
| 20110080231 | POWER LINE FILTER - A power line filter including a socket, a housing, a plurality of filter elements and a ground inductor is disclosed. The socket includes at least one power pin and a ground pin. The housing is assembled with the socket, and includes a first receptacle and a second receptacle. The opening direction of the first receptacle is opposite to the opening direction of the second receptacle. The plurality of filter elements is disposed in the first receptacle. At least one of the filter elements is electrically connected to the power pin. The ground inductor is disposed in the second receptacle and electrically connected to the ground pin. | 04-07-2011 |
Shin-Chung Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090116201 | CIRCUIT BOARD MODULE AND METHOD FOR REINFORCING STRUCTURE THEREOF - A circuit board module includes a circuit board and a reinforcing substrate. At least one electronic element is disposed on one surface of the circuit board. The reinforcing substrate is connected to a portion of the surface and disposed around the electronic element. A method for reinforcing the structure of the circuit board module is also disclosed. | 05-07-2009 |
Shu-Pin Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090015097 | PIEZOELECTRIC MICRO-PUMP AND DRIVING CIRCUIT THEREOF - The present invention is a driving circuit applied to a piezoelectric activation element, which comprises: a driving period generation unit and a switch circuit unit. The driving period generation unit further comprises: a driving indication signal and a programmable micro-controller, in which the programmable micro-controller is to receive the driving indication signal, and to generate a programmable driving period signal in response to the driving indication signal; and, the switch circuit unit is connected to the driving period generation unit and the piezoelectric activation element, and to receive the driving period signal, and generate an alternate driving voltage in response to the driving period signal; in which, the half-wave leading edge of the alternate driving voltage has the waveform of a parabolic curve waveform, and the half-wave trailing edge of the alternate driving voltage has the waveform of approximately a vertical line waveform, and the alternate driving voltage is connected to the piezoelectric activation element. | 01-15-2009 |
| 20100068080 | WIRING STRUCTURE FOR USE IN MICRO PIEZOELECTRIC PUMP - An electrical connection structure for use in a micro piezoelectric pump is disclosed. The electrical connection structure includes a driving circuit board and a multilayered wiring structure. The electrical connection structure includes the driving circuit board, the wiring structure, and a piezoelectric element arranged from top to bottom. The driving circuit board is provided with a driving circuit for driving the piezoelectric element and at least an electrical contact, wherein the electrical contacts are electrically connected to the driving circuit. A first electrode contact region and a second electrode contact region electrically insulated from each other are defined on the same surface of the piezoelectric element. The wiring structure sends a signal from the electrical contacts to the first electrode contact region and the second electrode contact region. | 03-18-2010 |
| 20110168805 | ATOMIZATION STRUCTURE AND MANUFACTURING METHOD THEREOF - The present invention discloses an atomization structure comprising a carrier, a cover plate, a piezoelectric driving device and an atomization piece. The carrier includes at least one first support portion, the cover plate comprises at least one second support portion, and the carrier is covered by the plate covers. The piezoelectric driving device is disposed between the carrier and the cover plate, the atomization piece is clamped by one end of the piezoelectric driving device. The actuating effect of the piezoelectric driving device would not be absorbed but kept by point contacting the first support portions and the second support portions to clamp and support the piezoelectric driving device. | 07-14-2011 |
So-Huang Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090289801 | INTELLIGENT POWER SUPPLY APPARATUS - An intelligent power supply apparatus includes a power converting circuit, one or more sensors, an audio processor, an operating status processor, a storage unit and a loudspeaker. The power converting circuit is used for converting an input voltage into a regulated DC output voltage. The sensors detect operating statuses of the intelligent power supply apparatus, thereby generating corresponding sensing signals. The audio data are processed by the audio processor. The operating status processor is electrically connected to the sensors and the audio processor for controlling the audio processor to generate corresponding output audio signals in response to the sensing signals. The storage unit is electrically connected to the audio processor and/or the operating status processor for storing therein audio data. The loudspeaker is electrically connected to the audio processor for generating audio prompts corresponding to the output audio signals. | 11-26-2009 |
Tsung-Jung Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20100164420 | BRUSHLESS DIRECT CURRENT MOTOR AND DRIVING UNIT THEREOF - A brushless direct current (DC) motor includes a rotor, a stator and a driving unit. The rotor includes a plurality of magnetic poles. The stator includes a plurality of upper pole arms and a plurality of lower pole arms. The driving unit includes at least two coils wound on the upper pole arms and the lower pole arms respectively, and the driving unit generates an alternating magnetic field on the stator for driving the rotor. | 07-01-2010 |
| 20120068650 | DRIVING DEVICE OF BRUSHLESS DC MOTOR FOR FAN AND DRIVING METHOD THEREOF - A driving device of a brushless DC motor for a fan includes a protection circuit, a storage circuit, a control circuit and a bridge circuit. The protection circuit is electrically connected with an auxiliary power. The storage circuit electrically connected with the protection circuit receives the auxiliary power. The control circuit is electrically connected with the protection circuit and the storage circuit. The bridge circuit electrically connected with the control circuit has a first switching unit, a second switching unit, a third switching unit and a fourth switching unit. The first and second switching units are coupled with one end of a motor coil. The third switching unit and the fourth switching unit are coupled with the other end of the motor coil. The first switching unit is electrically connected with the third switching unit, and the second switching unit is electrically connected with the fourth switching unit. | 03-22-2012 |
Wen-Sen Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090167473 | TRANSFORMER STRUCTURE - The present invention discloses a transformer structure, which has a winding reel. The winding reel has an iron-core frame. A first primary winding, a second primary winding and at least one secondary winding are wound on the iron-core frame. The first primary winding is electrically connected to the second primary winding. The secondary winding is arranged in between the first primary winding and the second primary winding. In the present invention, a plurality of the secondary windings may be arranged in between the first primary winding and the second primary winding and surrounded by the first primary winding and the second primary winding so that the transformer can drive a plurality of loads. | 07-02-2009 |
Yi-Hwa Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20110192568 | MODULAR HEAT-DISSIPATING DEVICE - A modular heat-dissipating device includes an electronic device, a cold plate and a heat-dissipating base. The electronic device includes a casing, a covering plate and a circuit board. The circuit board is disposed within the casing. Plural electronic components are disposed on the circuit board. The cold plate, the casing and the covering plate are combined together to define a sealed space. The cold plate includes plural first fixing structures. The heat-dissipating base is selected from an air-cooling member or a liquid-cooling member. Each of the air-cooling member and the liquid-cooling member includes a first slab under the cold plate and plural second fixing structures corresponding to the first fixing structures. The air-cooling member and the liquid-cooling member are normalized. The heat generated by the electronic device is transmitted to the first slab through the cold plate, and then dissipated away by the air-cooling member or the liquid-cooling member. | 08-11-2011 |
| 20110222246 | HEAT-DISSIPATING MODULE AND ELECTRONIC DEVICE USING SAME - A heat-dissipating module for use in an electric device includes a circuit board, at least one heat-generating element, and at least one heat-conducting element. The circuit board has a first surface, a second surface and at least one perforation. The heat-conducting element is disposed in the perforation. The heat-conducting element includes a base and a sidewall. The heat-generating element is disposed on the base or the sidewall of the heat-conducting element so that the heat by the heat-generating element is conducted to the second surface of the circuit board through the heat-conducting element. | 09-15-2011 |
Yu-Chen Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090160580 | COIL LEADING STRUCTURE AND FILTER THEREOF - A filter includes a coil leading structure and at least one coil. The coil leading structure includes a board and at least one pin. The pin is disposed at a side of the board and formed integrally with the board as a monolithic piece. The core is disposed on the board and has at least one end to be coupled with the pin. | 06-25-2009 |
Yu-Ping Hsieh, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20080295888 | CONCENTRATION PHOTOVOLTAIC MODULE - A concentration photovoltaic module includes a substrate, a first electrode, a second electrode, a solar cell, at least one electrical connecting element and a frame. The first electrode and the second electrode are disposed in different predetermined positions of the substrate to form a first electrode and a second electrode, respectively. The solar cell is disposed on the first electrode. The electrical connecting element electrically interconnects the second electrode and the solar cell. The frame straddles on the substrate, wherein the solar cell is located in the frame. | 12-04-2008 |
| 20090034275 | Light-emitting device and heat-dissipating module thereof - A light-emitting device is provided and includes a circuit, at least one heat-conducting member, a plurality of light-emitting elements, at least one heat-dissipating member and a power supply. The circuit board has at least one trench for the heat-conducting member to be disposed. The plurality of light-emitting element is disposed on the heat-conducting member. The heat dissipating member is disposed on the circuit board and connected to the heat-conducting member. The power supply, is electrically connected with the circuit board to provide the power of the light-emitting elements. | 02-05-2009 |
| 20090053487 | CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A ceramic circuit board and a manufacturing method thereof are disclosed. The method includes the steps of providing a first pre-mold plate and a first ceramic thin plate, stacking the first ceramic thin plate and the first pre-mold plate, and co-firing the first ceramic thin plate and the first pre-mold plate to commonly form the ceramic circuit board. | 02-26-2009 |
| 20090053531 | MULTI-LAYER CERAMIC SUBSTRATE WITH EMBEDDED CAVITY AND MANUFACTURING METHOD THEREOF - A multi-layer ceramic substrate with an embedded cavity and a manufacturing method thereof are disclosed. The method includes the steps of: providing at least one ceramic thin plate and at least one ceramic pre-mold plate having a surface formed with a conductive layer; stacking the ceramic thin plate and the ceramic pre-mold plate to form a stacked structure with at least one embedded cavity; and sintering the stacked structure. | 02-26-2009 |
| 20090091020 | CO-FIRED CERAMIC MODULE - A co-fired ceramic module includes a ceramic substrate and at least one heat-emitting device. The ceramic substrate has at least one high thermal conductivity material. The heat-emitting device is disposed on the ceramic substrate. The substrate further includes a cavity and the heat-emitting device is disposed in the cavity. | 04-09-2009 |