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Hsieh, Kaohsiung City
Chi-Chen Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110009588 | COUPLED POLYMERS AND MANUFACTURING METHOD THEREOF - A coupled copolymer is provided. The coupled copolymer is coupled by reacting a silane coupling agent with a copolymer, where the copolymer is polymerized by a conjugated diene monomer and a vinyl aromatics monomer, and the silane coupling agent has an alkenyl group and a alkoxy group, and has a chemical Formula (I) as follows: | 01-13-2011 |
| 20110105694 | HYDROGENATION CATALYST COMPOSITION AND HYDROGENATION METHOD THEREOF - A hydrogenation catalyst composition for hydrogenating a polymer of conjugated diene is provided. The polymer of conjugated diene is a homopolymer of conjugated diene or a copolymer of conjugated diene and vinyl aromatics. The hydrogenation catalyst composition includes: (a) a titanium compound, (b) a compound of formula (II), | 05-05-2011 |
Chi Hau Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100139757 | PHOTOVOLTAIC CELL STRUCTURE - A photovoltaic cell structure includes a substrate, a metal layer, a high resistivity layer, a p-type semiconductor layer, an n-type semiconductor layer and a transparent conductive layer. The metal layer may include molybdenum and be formed on the substrate to be a back contact metal layer of the cell. The high resistivity layer (e.g., V | 06-10-2010 |
| 20100139758 | PHOTOVOLTAIC CELL STRUCTURE AND MANUFACTURING METHOD THEREOF - A photovoltaic cell structure includes a substrate, a metal layer, a p-type semiconductor layer, an n-type semiconductor layer and a transparent conductive layer. The substrate has a rough surface. The metal layer may include molybdenum and be formed on the rough surface. The p-type semiconductor layer is formed on the metal layer and may include CIGSS, CIGS, CIS, or compound of two or more of copper, selenium, sulfur. The n-type semiconductor layer is formed on the p-type semiconductor layer thereby forming a rough p-n junction surface. The n-type semiconductor layer may include CdS. The transparent conductive layer is formed on the n-type semiconductor layer. In an embodiment, the roughness Ra of the rough surface is between 0.01 to 100 μm. | 06-10-2010 |
| 20100243044 | PHOTOVOLTAIC CELL STRUCTURE - A photovoltaic cell structure includes a substrate, a metal layer, a p-type semiconductor layer, an n-type semiconductor layer, a transparent conductive layer and a high resistivity layer. The metal layer is formed on the substrate. The p-type semiconductor layer is formed on the metal layer and may include a compound of copper indium gallium selenium sulfur (CIGSS), copper indium gallium selenium (CIGS), copper indium sulfur (CIS), copper indium selenium (CIS) or a compound of at least two of copper, selenium or sulfur. The n-type semiconductor layer exhibits photo catalyst behavior that can increase carrier mobility by receiving light, and is formed on the p-type semiconductor layer, thereby forming a p-n junction. The transparent conductive layer is formed on the n-type semiconductor layer. The high resistivity layer is formed between the metal layer and the transparent conductive layer. | 09-30-2010 |
| 20100258167 | PHOTOVOLTAIC CELL STRUCTURE AND MANUFACTURING METHOD - A photovoltaic cell structure includes a substrate, a metal layer, a p-type semiconductor layer, an n-type semiconductor layer, a high resistivity layer, an assistant electrode layer, and a transparent conductive layer. The metal layer is formed on the substrate, and comprises a plurality of p-type electrode units separated from each other. The p-type semiconductor layer is formed on the metal layer. The n-type semiconductor is formed on the p-type semiconductor layer, thereby forming a p-n junction. The high resistivity layer is formed on the n-type semiconductor layer. The assistant electrode layer is formed on the high resistivity layer and the p-type electrode units. The transparent conductive layer is formed on the assistant electrode layer, the high resistivity layer and the p-type electrode units. Accordingly, at least one cell is formed on each of the p-type electrode units. The assistant electrode layer and the transparent conductive layer are connected to the cells in series. | 10-14-2010 |
Chi Hua Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110297225 | PHOTOVOLTAIC CELL STRUCTURE - A photovoltaic cell structure includes a substrate, a metal layer, a p-type semiconductor layer, an n-type semiconductor layer, a transparent conductive layer and a high resistivity layer. The metal layer is formed on the substrate. The p-type semiconductor layer is formed on the metal layer and may include a compound of copper indium gallium selenium sulfur (CIGSS), copper indium gallium selenium (CIGS), copper indium sulfur (CIS), copper indium selenium (CIS) or a compound of at least two of copper, selenium or sulfur. The n-type semiconductor layer exhibits photo catalyst behavior that can increase carrier mobility by receiving light, and is formed on the p-type semiconductor layer, thereby forming a p-n junction. The transparent conductive layer is formed on the n-type semiconductor layer. The high resistivity layer is formed between the metal layer and the transparent conductive layer. | 12-08-2011 |
Chin-Tang Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120074545 | THIN FLIP CHIP PACKAGE STRUCTURE - A thin flip chip package structure comprises a substrate, a chip and a heat dissipation paste, wherein the substrate comprises an insulating layer and a trace layer. The insulating layer comprises a first insulating portion and a second insulating portion, the first insulating portion comprises a first upward surface, a first downward surface, a first thickness and a recess formed on the first downward surface, wherein the recess comprises a bottom surface. The second insulating portion comprises a second upward surface, a second downward surface and a second thickness larger than the first thickness. The trace layer is at least formed on the second insulating portion, the chip disposed on top of the substrate is electrically connected with the trace layer and comprises a plurality of bumps, and the heat dissipation paste is disposed at the recess. | 03-29-2012 |
| 20120080783 | THIN FLIP CHIP PACKAGE STRUCTURE - A thin flip chip package structure comprises a substrate, a chip and a heat dissipation paste, the substrate comprises an insulating layer and a trace layer. The insulating layer comprises a top surface, a bottom surface and a plurality of apertures formed at the bottom surface, wherein the bottom surface of the insulating layer comprises a disposing area and a non-disposing area. Each of the apertures is located at the disposing area and comprises a lateral wall and a base surface. A first thickness is formed between the base surface and the insulating layer, a second thickness is formed between the top surface and the bottom surface, and the second thickness is larger than the first thickness. The chip disposed on the top surface comprises a chip surface and a plurality of bumps. The heat dissipation paste at least fills the apertures and contacts the base surface. | 04-05-2012 |
Chuehan Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110018118 | Semiconductor Device Packages, Redistribution Structures, and Manufacturing Methods Thereof - Described herein are semiconductor device packages and redistribution structures including alignment marks and manufacturing methods thereof. | 01-27-2011 |
| 20110018124 | Semiconductor Device Packages, Redistribution Structures, and Manufacturing Methods Thereof - Described herein are semiconductor device packages and redistribution structures including alignment marks and manufacturing methods thereof. | 01-27-2011 |
Chueh-An Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100314746 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A semiconductor package and a manufacturing method thereof are provided. A carrier having an adhesion layer is provided. A plurality of chips are disposed on the adhesion layer, wherein an active surface of each chip faces the adhesion layer. A molding compound is formed for encapsulating the chips to form a chip-redistribution encapsulant having a first surface and a second surface, wherein the first surface has a chip area and a peripheral area. The carrier and the adhesion layer are removed, so that the chip-redistribution encapsulant exposes the active surface of each chip. A plurality of solder balls are uniformly formed in the chip area and the peripheral area. The second surface of the chip-redistribution encapsulant is grinded to reduce the thickness of the chip-redistribution encapsulant, wherein the solder balls provide the chip-redistribution encapsulant with a uniform support. The chip-redistribution encapsulant is sawn to form a plurality of packages. | 12-16-2010 |
Chun-Shu Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120031277 | DRINK CAN - A drink can includes a can body with a resilient portion, a cap located on a bottle mouth of the can body and a separated holding portion coupled with the cap. The resilient portion is coupled with one set of pressure guards. The separated holding portion connected to the cap holds concentrate of a brewing stuff with a taste different from that held in the can body. The resilient portion formed on the belly of the can body can be squeezed to make a conical portion at the bottom of the can body to dislocate and open a sealing plate at the distal end of the separated holding portion, so that the concentrate of the brewing stuff can quickly drop into the can body to be diluted by the brewing liquid held in the can body to quickly mix the brewing liquid and brewing stuff. | 02-09-2012 |
Der-Fong Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100058798 | COOLANT-CIRCULATION COOLING DEVICE FOR COMPUTER SERVO - A coolant-circulation cooling device is provided for cooling a plurality of computer servos, including a compressor, a condenser, a coolant reservoir, an evaporation coil, a cooling head, and a pump. The coolant reservoir is provided with the evaporation coil in a wound condition and connected to the compressor and the condenser to form a closed refrigeration circulation system. The cooling head is connected via piping to the coolant reservoir and can be directly attached to a heat generation element to remove heat therefrom by a circulation of a coolant from the coolant reservoir to the cooling head by being driven by the pump. The coolant circulating back to the coolant reservoir | 03-11-2010 |
Hong-Ming Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080294922 | MATCHING SYSTEM OF ELECTRONIC DEVICE AND PERIPHERAL DEVICE AND MATCHING METHOD THEREOF - A matching system of an electronic device and a peripheral device and a matching method thereof are described. The system includes an electronic device, having an identification mechanism for identifying a specific identification code and generating a control signal or a control instruction according to an identification result; and a peripheral device, electrically coupled to the electronic device selectively. The peripheral device includes an identification code unit for storing a group identification code; and a power control unit, for controlling an operation state of the peripheral device according to the control signal or the control instruction, when the peripheral device is electrically coupled to the electronic device. If the identification result is that the specific identification code is consistent with the group identification code, the power control unit controls the entire peripheral device to work normally according to the control signal or the control instruction. | 11-27-2008 |
Hong Yean Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080252373 | Low Flicker Noise Operational Amplifier - A low flicker noise operational amplifier comprises two circuit branches of the same topology and a plurality of current source pairs. For each current source pair, the two current sources are commutatively steered into the two circuit branches via two sets of differential pair in a manner controlled by a pair of complementary logical signal. | 10-16-2008 |
| 20080268805 | High Linearity Passive Mixer and Method Thereof - A high linearity mixer circuit includes a commutation network comprising four switches to provide an electrical coupling between a first pair of circuit nodes and a second pair of circuit nodes, whereas the coupling has two states and is controlled by a pair of complementary logical signals. The mixer circuit further comprises a first pair of current-sourcing devices coupled to the first pair of circuit nodes and a second pair of current-sourcing devices coupled to the second pair of circuit nodes. The mixer circuit further includes a pair of capacitors to provide AC coupling, either between the first pair of circuit nodes and a first external circuit, or between the second pair of circuit nodes and a second external circuit. | 10-30-2008 |
| 20090029668 | LOW FLICKER NOISE ACTIVE MIXER AND METHOD THEREOF - A low flicker noise active mixer comprises a trans-conductance section, a switching quad, and a load section. The trans-conductance section converts a voltage signal pair into a first current signal pair. The switching quad converts the first current signal pair into a second signal pair in a manner controlled by a LO (local oscillator) signal pair. The load section provides a loading to the second current signal pair using a pair of commutative active loads to convert the second current signal pair into an output voltage signal pair. | 01-29-2009 |
Hsi-Yi Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100237158 | PRECAST CONCRETE COMPONENT MATERIAL MIXTURE AND METHOD OF PRECASTING - A precast concrete component material mixture and method of precasting, which is used to manufacture sleepers for transportation tracks, and related precast concrete components, are provided. The precast concrete component material mixture include: 891 to 963 kg/m | 09-23-2010 |
Jung-Hung Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100232170 | HEADLIGHT OF MOTORCYCLE - A headlight of motorcycle includes a dashboard, a connection member, a headlight, a bracket, and front support racks. The dashboard is coupled to the headlight by the connection member in a modularized manner. The headlight forms coupling holes for mounting to the front support racks. The bracket carries signal lights thereon. By coupling the headlight and the dashboard together in a modularized manner and mounting the bracket that carries the signal lights to the opposite sides of the headlight, and further fixing the front support racks to the opposite sides of the headlight, a headlight module is formed. The headlight module can be easily attached between upper and lower beams of a steering handlebar by using the front support racks so as to simplify the assembling operation and to conceal the front support racks between the bracket and the steering handlebar for improving the outside appearance of the headlight. | 09-16-2010 |
Jung-Lin Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110176900 | SUCTION HEAD AND TRANSPORTING MACHINE APPLYING THE SAME - A suction head including a first transmission part, a second transmission part and a suction nozzle is provided. The second transmission part is magnetically attracted by the first transmission part to permit a displacement of the second transmission part relative to the first transmission part. The suction nozzle is disposed on the second transmission part and transmitted by the first transmission part via the second transmission part. Additionally, a transporting machine including a shuttle, a transporting mechanism and the aforementioned suction nozzle is provided. The shuttle is capable of carrying an object being transported, and the suction head is driven by the transporting mechanism to take the object being transported. The suction head and the transporting machine applying the same provide high transporting efficiency and ensuring a normal operation in transporting process. | 07-21-2011 |
Kun-Hung Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120092593 | FRAME, BACKLIGHT MODULE AND LIQUID CRYSTAL DISPLAY MODULE - A frame formed by cutting and bending a plate base is provided. The maximum thickness of the frame is T, the thickness of the plate base is t, and 1.5t≦T≦2.5t. The frame includes a first plate element, a second plate element, and a bending portion. The second plate element is directly contacted to the first plate element, and the first plate element is substantially parallel to the second plate element. The bending portion is connected between the first plate element and the second plate element. A backlight module using the above-mentioned frame and a liquid crystal display (LCD) module using the backlight module are also provided. | 04-19-2012 |
Lan-Chin Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100182114 | METHOD FOR ADJUSTING INDUCTANCE OF CHOKE AND METHOD FOR DESIGNING CHOKE - A method for adjusting the inductance of a choke is provided by the present invention. The method includes with an unchanged structure and unchanged dimensions of the core of the choke, changing the kind of the magnetic materials composing the cores so as to adjust the magnetic permeability of the magnetic material. In addition, the present invention also provides a method for designing a choke, the method includes determining the structure of a first choke and a second choke, determining the dimensions of the cores of the chokes, and selecting magnetic materials composing the cores. | 07-22-2010 |
| 20100182115 | WIRE WOUND TYPE CHOKE COIL - A choke coil including a drum-core and at least one wire is provided. The drum-core includes a pillar, a first board and a second board. Two ends of the pillar are respectively connected to the first board and the second board. A material of the drum-core includes ferrous alloy. The wire has a winding portion wrapped around the pillar. | 07-22-2010 |
| 20100219924 | CHOKE - An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. An area of the top board is smaller than an area of the bottom board. A winding space is fanned among the top board, the bottom board and the pillar. The wire is winded around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a metallic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 μm. | 09-02-2010 |
| 20100308950 | CHOKE - A choke including a core and a hollow coil is provided. The core includes a first core body and a second core body. The first core body includes a pillar. The second core body is a flat plate and has an opening. An end of the pillar is suitable to be disposed in the opening and joined to the same. The hollow coil is fitted on the pillar. | 12-09-2010 |
| 20120086534 | CHOKE HAVING A CORE WITH A PILLAR HAVING A NON-CIRCULAR AND NON-RECTANGULAR CROSS SECTION - A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis. | 04-12-2012 |
Ming-Da Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100105205 | CLEANING SOLUTION AND SEMICONDCUTOR PROCESS USING THE SAME - A semiconductor process is provided. First, a metal layer, a dielectric layer and a patterned hard mask layer are sequentially formed on a substrate. Thereafter, a portion of the dielectric layer is removed to form an opening exposing the metal layer. Afterwards, a cleaning solution is used to clean the opening. The cleaning solution includes a triazole compound with a content of 0.00275 to 3 wt %, sulfuric acid with a content of 1 to 10 wt %, hydrofluoric acid with a content of 1 to 200 ppm and water. | 04-29-2010 |
| 20110130008 | METHOD TO CONTROL CRITICAL DIMENSION - A method to control a critical dimension is disclosed. First, a material layer and a composite patterned layer covering the material layer are provided. The composite patterned layer has a pattern defining a first critical dimension. Later, an etching gas is used to perform an etching step to etch the composite patterned layer and a pattern-transferring step is carried out so that thereby the underlying material layer has a transferred pattern with a second critical dimension which is substantially smaller than the first critical dimension. | 06-02-2011 |
| 20110244678 | SEMICONDUCTOR PROCESS - A semiconductor process is provided. First, a metal layer, a dielectric layer and a patterned hard mask layer are sequentially formed on a substrate. Thereafter, a portion of the dielectric layer is removed to form an opening exposing the metal layer. Afterwards, a cleaning solution is used to clean the opening. The cleaning solution includes a triazole compound with a content of 0.00275 to 3 wt %, sulfuric acid with a content of 1 to 10 wt %, hydrofluoric acid with a content of 1 to 200 ppm and water. The semiconductor process can reduce the possibility of having an incomplete turning on, a leakage or a short, so that the yield of the product is increased. | 10-06-2011 |
Ming-Deng Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090164877 | MEMO VOICE RECORDING/PLAYBACK METHOD AND DIGITAL PHOTO FRAME USING THE SAME - A memo voice recording/playback method and a digital photo frame using the method are provided. The method is suitable for a digital image playback apparatus. The digital image playback apparatus has memo voice recording function and memo voice playback function and includes a display unit for image displaying. The method includes: displaying an image; judging whether memo voice recording function of the digital image playback apparatus is enabled or not; and executing a memo voice recording procedure to edit the recorded memo voice into a memo voice file associated with the image if it is judged that the memo voice recording function is enabled. | 06-25-2009 |
Min-Ju Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090167285 | RESONANCE CIRCUIT FOR USE IN H-BRIDGE DC-DC CONVERTER - The present invention discloses a resonance circuit for use in an H-bridge DC-DC converter, the resonance circuit comprising: an H-bridge converter, capable of converting unstable DC power into stable DC power; a first resonance circuit, disposed on a buck side of the H-bridge converter for reducing the turn-off loss of a first active switching element; and a second resonance circuit, disposed on a boost side of the H-bridge converter for reducing the turn-on loss of a second active switching element. The H-bridge converter comprises: a first active switching element and a second active switching element; a coupled inductor with dual windings capable of storing energy; and a first passive switching element and a second passive switching element. The first resonance circuit comprises: a first inductor, a second inductor, a first auxiliary inductor, a first passive switching element, a second passive switching element and a first auxiliary capacitor, wherein the second inductor comprises a primary winding and an auxiliary winding. The second resonance circuit comprises: a second auxiliary inductor, a third active switching element, a first auxiliary inductor, a first passive switching element, a fourth passive switching element, a third capacitor, a fourth capacitor and a second auxiliary capacitor. | 07-02-2009 |
| 20090168460 | APPARATUS FOR CONTROLLING H-BRIDGE DC-AC INVERTER - The present invention discloses an apparatus for controlling an H-bridge DC-AC inverter, comprising an H-bridge DC-DC converting circuit capable of converting unstable DC power into stable DC power and a full-bridge DC-AC inverting circuit capable of inverting DC power output from the H-bridge DC-DC converting circuit into AC power. The H-bridge DC-DC converting circuit comprises: a first active switching element and a second active switching element; an inductor capable of storing energy; a first passive switching element and a second passive switching element; and a first capacitor and a second capacitor. The full-bridge DC-AC inverting circuit comprises: a third active switching element, a fourth active switching element, a fifth active switching element and a sixth active switching element; an output inductor; and an output capacitor. | 07-02-2009 |
| 20110103107 | RESONANCE CIRCUIT FOR DC-LINK VOLTAGE CONTROL IN DC-TO-AC INVERTER - The present disclosure relates to a resonance circuit for DC-link voltage control in a DC-to-AC inverter. The resonance circuit comprises two active switches. Before the active switches of the DC-to-AC inverter are turned on, a DC-link voltage is isolated by the active switches and the active switches of the DC-to-AC inverter are discharged by the resonance circuit to zero voltage at both ends. Then, the active switches of the DC-to-AC inverter are turned on again after the DC-link voltage is charged by the resonance circuit until the DC-link voltage restores to a normal voltage value. Hence, the active switches of the DC-to-AC inverter achieve zero-voltage switching. Not only the switching loss can be reduced to enhance the conversion efficiency, but also the electro-magnetic interference as well as the RF interference due to dynamic transient changes of the voltage (dv/dt) and of the current (di/dt) can be lowered. | 05-05-2011 |
Pei-Shan Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120031277 | DRINK CAN - A drink can includes a can body with a resilient portion, a cap located on a bottle mouth of the can body and a separated holding portion coupled with the cap. The resilient portion is coupled with one set of pressure guards. The separated holding portion connected to the cap holds concentrate of a brewing stuff with a taste different from that held in the can body. The resilient portion formed on the belly of the can body can be squeezed to make a conical portion at the bottom of the can body to dislocate and open a sealing plate at the distal end of the separated holding portion, so that the concentrate of the brewing stuff can quickly drop into the can body to be diluted by the brewing liquid held in the can body to quickly mix the brewing liquid and brewing stuff. | 02-09-2012 |
Ping-Cheng Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120002343 | Multi-function electroshock gun - A multi-function electroshock gun includes a gun body that includes a barrel and a grip extending from the barrel, and a firing mechanism mounted in the gun body and operable to propel a projectile that is fired through the barrel. The multi-function electroshock gun further includes an electroshock unit that includes a battery mounted in the gun body, a set of exposed electrodes fixedly mounted to the gun body, and a discharge module. The discharge module is coupled electrically to the battery and the exposed electrodes and is capable of being activated to generate an electrical output signal at the exposed electrodes for administering electric shock by contact. The multi-function electroshock gun also includes a trigger mechanism mounted on the gun body and operable to activate the discharge module. | 01-05-2012 |
Shu-Chen Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100227079 | METHOD FOR PATTERNING POLYMER SURFACE - The invention provides a method for patterning a polymer surface. A polymer layer is formed on a substrate. A conductive grid with a mesh pattern is placed on the polymer layer. The mesh pattern is transferred to the polymer layer by a plasma treatment. The conductive grid is then removed. | 09-09-2010 |
Te-Chuan Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090172382 | Multi-function computer system - A multi-function computer system includes a host apparatus, a display and a boot mode switching unit. The display is electrically connected to the host apparatus. The boot mode switching unit electrically connected to the host apparatus may be switched between a first mode and a second mode. In the first mode, the boot mode switching unit controls the host apparatus to boot into a first operation environment. In the second mode, the boot mode switching unit controls the host apparatus to boot into a second operation environment different from the first operation environment. | 07-02-2009 |
Tusty-Jiuan Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110159127 | EXTRACT OF TOONA SINENSIS FROM SUPERCRITICAL FLUID EXTRACTION FOR TREATING DIABETES AND METABOLIC DISEASES, THE PREPARATION METHOD AND THE USE THEREOF | 06-30-2011 |
Wei-Lun Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100321099 | EFFICIENCY AND THERMAL IMPROVEMENT OF A CHARGE PUMP BY MIXING DIFFERENT INPUT VOLTAGES - For a charge pump, a control circuit switches two or more input voltages to apply to one or more pumping capacitors under auto-sensing control to modulate a maximum pumping voltage as close as to a demanded output voltage to thereby reduce the difference between the maximum pumping voltage and the output voltage for efficiency and thermal improvement of the charge pump. The maximum pumping voltage is produced by mixing the different input voltages and the charge pump may provide more operation modes. | 12-23-2010 |
Wen-Hung Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110175763 | DIGITAL-TO-ANALOG CONVERTER - The present invention relates to a digital-to-analog converter comprising a differentiation circuit, a conversion circuit, and an integration circuit. The differentiation circuit receives and differentiates a digital signal for producing a differentiation signal. The conversion circuit is coupled to the differentiation circuit. It receives the differentiation signal and produces a conversion signal according to a clock signal and the differentiation signal. The integration circuit is coupled to the conversion circuit. It receives and integrates the conversion signal for producing an analog signal. Thereby, the purpose of reducing distortion noises can be achieved. | 07-21-2011 |
Yi-Hsien Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080311090 | Methods for inhibition of proliferative disease, including hepatocellular carcinoma - The present invention is related to a method for modulating expression of protein kinase C-alpha associated with proliferative diseases. The invention further relates to a screening method utilizing the association between transcription factors (MZF-1 and Elk-1) and their DNA binding element (PKC-.alpha. promoter) to identify novel anticancer agents. | 12-18-2008 |
Yi-Hung Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090177852 | DATA BLOCK RECEIVER AND METHOD FOR DECODING DATA BLOCK - A data block receiver for decoding a data block. The data block has a block sequence number (BSN). The data block receiver includes two de-interleavers, a memory circuitry, a combiner, a decoder, and an error detector. A first de-interleaver interleaves the data block to obtain a first de-interleaved data block. A stored data block with a BSN same with the data block is retrieved from the memory circuitry when the data block is not the newest data block. The second de-interleaver interleaves the retrieved data block to obtain a second de-interleaved data block. The second and the first de-interleaved data blocks are combined to form a combined data block. The decoder decodes the combined data block. The data block is stored when an error in the decoded data block is detected. | 07-09-2009 |
Yi-Zeng Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110063073 | TACTILE REMOTE CONTROL SYSTEM - The present invention discloses a tactile remote control system, which uses a processor to integrate the operation selection items of controlled devices and arrange the selection items into a graphic user interface, and which uses a microswitch to output instructions. The processor arranges the graphic user interfaces of a controlled device hierarchically. Therefore, the graphic user interfaces have organizationality, logicality and continuity. The user watches the display and operates the microswitches to remotely control the controlled devices. The present invention integrates the control functions to assist the user to control the daily-life electronic devices and household appliances. The present invention enables any one, who has been briefly instructed, to remotely control the linked devices by his will. | 03-17-2011 |
Yu-An Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100056313 | LIMITED SLIP DIFFERENTIAL - A limited slip differential includes a driving plate, backing plates, differential gear assemblies, and a transmission assembly engaged together inside a sealed casing where fluid is pumped. The driving plate has pairs of communicated openings for interlocking two gears of each gear assembly, which extend by opposite directions from the driving plate for separately engaging with the transmission assembly. While synchronously rotating the plates, the gear assemblies are alternatively soaked into the fluid and each permits the fluid passing among the gears for adjusting the rotational speed. In the event that the rotational speed difference of axle shafts of the vehicle exceeds a threshold value, the LSD applies at least one gear assembly to generate a back pressure and efficiently block the fluid passing through the gears for limiting mutual rotational speed difference, hence achieving a limited-slip effect. | 03-04-2010 |
Yu-Chen Hsieh, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100251971 | Pet Leash and Rope Used Therein - A pet leash includes a connector, a handle, and a rope. The connector is for connecting with a collar; the handle is for being held; and the rope connecting with the connector and the handle by two ends respectively. The pet leash is characterized in that the rope includes a plurality of strands forming a core of the rope and a sheath wrapping and binding up the said core, with the strands being of an elastic material. Therefore, the present invention can avoid a widen crack or sudden snap derived from an initially formed crack while providing a high elasticity. | 10-07-2010 |