Patent application number | Description | Published |
20140152509 | Embedding Low-K Materials in Antennas - A device includes a patch antenna, which includes a feeding line, and a ground panel over the feeding line. The ground panel has an aperture therein. A low-k dielectric module is over and aligned to the aperture. A patch is over the low-k dielectric module. | 06-05-2014 |
20140253262 | RF CHOKE DEVICE FOR INTEGRATED CIRCUITS - Among other things, one or more techniques and systems for selectively filtering RF signals within one or more RF frequency band are provided. In particular, an RF choke, such as a 3D RF choke or a semi-lumped RF choke, configured to selectively filter such RF signals is provided. The RF choke comprises a metal connection line configured as an inductive element for the RF choke. In an example, one or more metal lines, such as a metal open stub, are formed as capacitive elements for the RF choke. In another example, one or more through vias are formed as capacitive elements for the RF choke. In this way, the RF choke allows DC power signals to pass through the metal connection line, while impeding RF signals within the one or more RF frequency bands from passing through the metal connection line. | 09-11-2014 |
20150123759 | Inductor For Semiconductor Integrated Circuit - An inductor includes a plurality of first conductive lines, a plurality of second conductive lines and a plurality of contacts. Each of the first conductive lines is spaced apart from one another. Each of the second conductive lines is spaced apart from one another, and each of the second conductive lines crosses over each of the first conductive lines. Each of the contacts electrically interconnects one of the first conductive lines and one of the second conductive lines. These contacts are arranged in a way such that at least parts of the first conductive lines and at least parts of the second conductive lines form an electric current path serving as an inductor. | 05-07-2015 |
20150228577 | SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF - One or more techniques for forming a semiconductor arrangement and resulting structures formed thereby are provided herein. The semiconductor arrangement includes a power divider comprising a transmission line and a resistor, where the transmission line is over and connected to an active area input, a first active area output and a second active area output. The semiconductor arrangement has a smaller chip size than a semiconductor arrangement where the transmission line is not over the active area input, the first active area output and the second active area output. The smaller chip size is due to the active area input, the first active area output and the second active area output being formed closer to one another than would be possible in a semiconductor arrangement where the transmission line is formed between at least one of the active area input, the first active area output or the second active area output. | 08-13-2015 |
Patent application number | Description | Published |
20120270811 | CONFORMATIONS OF DIVERGENT PEPTIDES WITH MINERAL BINDING AFFINITY - A series of peptides with divergent confirmations including structures of formula (1A), (1B), (2) and (3) are provided. In the formula, wherein U, G, A, B, R1, R2 and T are as defined in the specification. The divergent peptides disclosed in the present invention are characterized in a mineral binding affinity function. | 10-25-2012 |
20140377212 | CONFORMATIONS OF DIVERGENT PEPTIDES WITH MINERAL BINDING AFFINITY - A series of peptides with divergent confirmations including structures of formula (1A), (1B), (2) and (3) are provided. In the formula, wherein U, G, A, B, R1, R2 and T are as defined in the specification. The divergent peptides disclosed in the present invention are characterized in a mineral binding affinity function. | 12-25-2014 |
20150320876 | CONFORMATIONS OF DIVERGENT PEPTIDES WITH MINERAL BINDING AFFINITY - A series of peptides with divergent confirmations including structures of formula (1A), (1B), (2) and (3) are provided. In the formula, wherein U, G, A, B, R1, R2 and T are as defined in the specification. The divergent peptides disclosed in the present invention are characterized in a mineral binding affinity function. | 11-12-2015 |
Patent application number | Description | Published |
20140055226 | VARIABLE COUPLED INDUCTOR - A variable coupled inductor includes a first core, two conducting wires, a second core and a magnetic structure. The first core includes two first protruding portions, a second protruding portion and two grooves, wherein the second protruding portion is located between the two first protruding portions and each of the grooves is located between one of the first protruding portions and the second protruding portion. Each of the conducting wires is disposed in one of the grooves. The second core is disposed on the first core. A first gap is formed between each of the first protruding portions and the second core and a second gap is formed between the second protruding portion and the second core. The magnetic structure is disposed between the second protruding portion and the second core and distributed symmetrically with respect to a centerline of the second protruding portion. | 02-27-2014 |
20140097931 | Choke - An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. An area of the top board is smaller than an area of the bottom board. A winding space is formed among the top board, the bottom board and the pillar. The wire is winded around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a metallic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 μm. | 04-10-2014 |
20150089795 | CHOKE - A method to form a choke is disclosed, wherein the method comprises: encapsulating a hollow coil by a molding body; forming a first core, wherein the first core comprises a pillar; and disposing at least one first portion of the pillar inside the encapsulated hollow coil. The method avoids the overflow or vertical flow issue during a molding process for encapsulating a coil that has been wound on a core already. | 04-02-2015 |
20150310975 | Choke - A choke includes a single-piece core made of a same material, the single-piece core having a first board, a second board, and a pillar located between the first and second boards, a winding space located among the first board, the second board and the pillar, wherein the pillar has a non-circular and non-rectangular cross section having a first axis and a second axis substantially perpendicularly intersecting with each other at a center of the cross section of the pillar, and wherein a circumference of the cross section of the pillar includes two arc edges, four first substantially straight edges substantially parallel to the first axis, and two second substantially straight edges substantially parallel to the second axis, each of the first substantially straight edges being a joint of and in direct contact with one of the arc edges and one of the second substantially straight edges. | 10-29-2015 |
20160099099 | VARIABLE COUPLED INDUCTOR - A variable coupled inductor includes a first core, two conducting wires, a second core and a magnetic structure. The first core includes two first protruding portions, a second protruding portion and two grooves, wherein the second protruding portion is located between the two first protruding portions and each of the grooves is located between one of the first protruding portions and the second protruding portion. Each of the conducting wires is disposed in one of the grooves. The second core is disposed on the first core. A first gap is formed between each of the first protruding portions and the second core and a second gap is formed between the second protruding portion and the second core. The magnetic structure is disposed between the second protruding portion and the second core and distributed symmetrically with respect to a centerline of the second protruding portion. | 04-07-2016 |