Patent application number | Description | Published |
20130271674 | DISPLAY DEVICE - A display device including a transmission display panel, a first backlight module, a first polarizer, and a reflective polarizer is provided. The first backlight module includes a first light guide plate and a light emitting unit. The first light guide plate has a first surface, a second surface opposite to the first surface, and a first light incident surface connecting the first surface and the second surface. The first surface is between the second surface and the transmission display panel. The light emitting unit is disposed beside the first light incident surface. The transmission display panel is between the first polarizer and the first surface. The second surface is between the first surface and the reflective polarizer. | 10-17-2013 |
20140241007 | REFLECTOR, LIGHT SOURCE MODULE, AND DISPLAY DEVICE - A reflector, a light source module, and a display device are disclosed. The reflector includes a substrate and slant reflecting surfaces disposed on the substrate and arranged from a first side to an opposite second side of the reflector. Each slant reflecting surface has an arc-shaped orthogonal projection on the substrate and is not parallel to the substrate. The light source module includes a light guide plate, a light emitting device, and the reflector, and the display device further includes a display panel. The light guide plate has a first surface, at least one opposite second surface, and a light incident surface connecting therebetween. The reflector is disposed at one side of the second surface. The slant reflecting surfaces are parallel to the second surface but not parallel to the first surface. The reflector offers improved luminous efficiency, and the light source module and the display device offer improved brightness. | 08-28-2014 |
Patent application number | Description | Published |
20110282624 | Method for Determining Incline Angle of Electromagnetic Pointer - A method for determining an incline angle of electromagnetic pointer is disclosed. The method comprises the following steps. First of all, an electromagnetic input pen/stylus is provided over antennas X | 11-17-2011 |
20120182199 | MULTI-ANTENNA LOOP LAYOUT - A multi-antenna loop layout which comprises an array of physical antenna loops, each antenna loop comprising first and second conductive ends. Each conductive end of each antenna loop in the array is coupled to an electrically common contact point that is electrically in common with one or more conductive ends of a subset of other antenna loops in the array. The cumulative total of electrically common contact points, each common contact point being shared by two or more conductive ends of two or more antenna loops in the array, equals a first value T, the first value T being equal to the sum of a second plural value M and a third plural value N. The number of physical antenna loops is equal to at least the product of M and N, and may be as great as T*(T−1)/2. | 07-19-2012 |
20120299836 | DIGITIZER WITH SPREAD SPECTRUM CIRCUIT - A digitizer with spread spectrum circuit is disclosed herein, and includes an emitting circuit, a processor, an antenna sensing board and a receiving circuit. The processor controls the spread spectrum circuit to determine the frequency bandwidth of the electromagnetic wave signal. The emitting circuit is electrically connected to the spread spectrum circuit and the spread spectrum circuit informs the emitting circuit the bandwidth of the electromagnetic wave signal to transmit. The antenna sensing board is electrically connected to the emitting circuit and configured to emit and receive the electromagnetic wave signal power. The receiving circuit is configured to receive an oscillating signal generated by an electromagnetic stylus and transmit the signal to the processor. | 11-29-2012 |
Patent application number | Description | Published |
20080246094 | Method for Manufacturing SRAM Devices with Reduced Threshold Voltage Deviation - A semiconductor device includes a semiconductor substrate; a gate dielectric layer disposed on the semiconductor substrate; a gate conductive layer doped with impurities selected from nitrogen, carbon, silicon, germanium, fluorine, oxygen, helium, neon, xenon or a combination thereof on the gate dielectric layer; and source/drain doped regions formed adjacent to the gate conductive layer in the semiconductor substrate, wherein the source and drain doped regions are substantially free of the impurities doped into the gate conductive layer. These impurities reduce the diffusion rates of the N-type of P-type dopants in the gate conductive layer, thereby improving the device performance. | 10-09-2008 |
20100006398 | SEGREGATING APPARATUS - An apparatus for segregating electronic components that engages and stops each of a plurality of electronic packages passing down a singulation tube is disclosed. In addition, the segregating apparatus is cable of segregating the electronic packages even though some of them had been linked together during the sealing process. The segregating apparatus includes a first swing arm to clip a electronic component, a second swing arm to clip another electronic component, and a third swing arm to depart the two electronic components, where all of components of the segregating apparatus are driven by a single driving force, reducing the size of the apparatus and the time needed for the segregating process. | 01-14-2010 |
20110222332 | Fully Balanced Dual-Port Memory Cell - The present disclosure provides a dual port static random access memory (SRAM) cell. The dual-port SRAM cell includes four sets of cascaded n-type metal-oxide-semiconductor field-effect transistors (NMOSFETs), each set of cascaded NMOSFETs having a pull-down device and a pass-gate device; and a first and second pull-up devices (PU | 09-15-2011 |
Patent application number | Description | Published |
20090209098 | Multi-Step Cu Seed Layer Formation for Improving Sidewall Coverage - A method of forming an integrated circuit structure includes forming a dielectric layer; forming an opening in the dielectric layer; performing a first deposition step to form a seed layer in a first chamber; and performing a first etch step to remove a portion of the seed layer. The method may further include performing a second deposition step to increase the thickness of the seed layer. At least one of the first etch step and the second deposition step is performed in a second chamber different from the first chamber. | 08-20-2009 |
20090209106 | In Situ Cu Seed Layer Formation for Improving Sidewall Coverage - A method of forming a seed layer of an interconnect structure includes forming a dielectric layer; forming an opening in the dielectric layer; performing a first deposition step to form the seed layer; and in-situ performing a first etch step to remove a portion of the seed layer. The method may further includes additional deposition and etch steps for forming the seed layer. | 08-20-2009 |
20090258487 | Method for Improving the Reliability of Low-k Dielectric Materials - A method for forming an integrated circuit structure includes providing a semiconductor substrate; forming a low-k dielectric layer over the semiconductor substrate; generating hydrogen radicals using a remote plasma method; performing a first hydrogen radical treatment to the low-k dielectric layer using the hydrogen radicals; forming an opening in the low-k dielectric layer; filling the opening with a conductive material; and performing a planarization to remove excess conductive material on the low-k dielectric layer. | 10-15-2009 |
20120322261 | Methods for Via Structure with Improved Reliability - Methods for forming a via structure are provided. The method includes depositing a first-layer conductive line over a semiconductor substrate, forming a dielectric layer over the first-layer conductive line, forming a via opening in the dielectric layer and exposing the first-layer conductive line in the via opening, forming a recess portion in the first-layer conductive line, and filling the via opening to form a via extending through the dielectric layer to the first-layer conductive line. The via has a substantially tapered profile and substantially extends into the recess in the first-layer conductive line. | 12-20-2012 |
20140027822 | Copper Contact Plugs with Barrier Layers - A device includes a conductive layer including a bottom portion, and a sidewall portion over the bottom portion, wherein the sidewall portion is connected to an end of the bottom portion. An aluminum-containing layer overlaps the bottom portion of the conductive layer, wherein a top surface of the aluminum-containing layer is substantially level with a top edge of the sidewall portion of the conductive layer. An aluminum oxide layer is overlying the aluminum-containing layer. A copper-containing region is over the aluminum oxide layer, and is spaced apart from the aluminum-containing layer by the aluminum oxide layer. The copper-containing region is electrically coupled to the aluminum-containing layer through the top edge of the sidewall portion of the conductive layer. | 01-30-2014 |
20150061141 | INTERCONNECT STRUCTURES AND METHODS OF FORMING SAME - A semiconductor device, an interconnect structure, and methods of forming the same are disclosed. An embodiment is a method of forming a semiconductor device, the method including forming a first dielectric layer over a substrate, forming a first conductive layer in the first dielectric layer, and removing a first portion of the first conductive layer to form at least two conductive lines in the first dielectric layer, the at least two conductive lines being separated by a first spacing. The method further includes forming a capping layer on the at least two conductive lines, and forming an etch stop layer on the capping layer and the first dielectric layer. | 03-05-2015 |
20150069620 | Semiconductor Devices and Methods of Forming Same - Embodiments of the present disclosure include a semiconductor device and methods of forming the same. An embodiment is a method for of forming a semiconductor device, the method including forming a first conductive feature over a substrate, forming a dielectric layer over the conductive feature, and forming an opening through the dielectric layer to the first conductive feature. The method further includes selectively forming a first capping layer over the first conductive feature in the opening, and forming a second conductive feature on the first capping layer. | 03-12-2015 |
20150072528 | Hard Mask Edge Cover Scheme - A method includes forming at least one trench in a dielectric layer using a hard mask. An edge cover layer is formed over the hard mask. The at least one trench is filled with a metal layer. | 03-12-2015 |
20150123279 | Structure and Method for Forming Interconnect Structure - A method for forming a semiconductor structure includes providing a semiconductor substrate and forming a dielectric layer over the semiconductor substrate. An opening is formed in the dielectric layer. A conductive line is formed in the opening, wherein the conductive line has an open void formed therein. A sealing metal layer is formed overlying the conductive line, the dielectric layer, and the open void, wherein the sealing metal layer substantially fills the open void. The sealing metal layer is planarized so that a top surface thereof is substantially level with a top surface of the conductive line. An interconnect feature is formed above the semiconductor substrate, wherein the interconnect feature is electrically coupled with the conductive line and the sealing metal layer-filled open void. | 05-07-2015 |
20150206798 | Interconnect Structure And Method of Forming - An interconnect structure of an integrated circuit and a method for forming the same are provided. The interconnect structure includes a conductive line, and optionally, a cap layer over the conductive line. A treatment is performed to remove impurities prior to forming a layer, e.g., an etch stop layer, ILD, or the like, over the conductive line and/or the cap layer. | 07-23-2015 |
Patent application number | Description | Published |
20150077714 | ILLUMINATION SYSTEM AND PROJECTION APPARATUS - An illumination system including at least one laser source, at least one anisotropic light expanding element and a wavelength conversion element is provided. The at least one laser source emits a laser beam. The at least one anisotropic light expanding element is disposed on the transmission path of the laser beam and causes the laser beam to expand along a light expanding direction. The light expanding direction is substantially parallel to the slow axis of the laser beam. The wavelength conversion element is disposed on the transmission path of the laser beam. A projection apparatus is also provided. | 03-19-2015 |
20150098070 | LIGHT WAVELENGTH CONVERSION MODULE, ILLUMINATION SYSTEM, AND PROJECTION APPARATUS - A light wavelength conversion module including a substrate, a first light wavelength conversion layer, and a first light transmissive layer is provided. The substrate has a light passing-through area and a first light wavelength conversion area. The first light wavelength conversion layer is located at the first light wavelength conversion area and between the first light transmissive layer and the substrate. The first light wavelength conversion layer is suitable for converting a coherent light beam into a first conversion light beam, wherein wavelengths of the coherent light beam and the first conversion light beam are different from each other. An illumination system and a projection apparatus are also provided. | 04-09-2015 |
20150185596 | WAVELENGTH CONVERSION DEVICE AND PROJECTOR - A wavelength conversion device including a main body and a transparent component is provided. The main body has at least one wavelength conversion region and a slot. The transparent component is disposed in the slot to form a light transmission region, wherein one of the main body and the transparent component has at least one groove, and another one of the main body and the transparent component is engaged with the groove, such that the main body and the transparent component are fixed together. In addition, a projector having the wavelength conversion device is also provided. | 07-02-2015 |
20150198809 | VIRTUAL IMAGE DISPLAY MODULE AND OPTICAL LENS GROUP - A virtual image display module, disposed in front of at least one eye of a user, including an image displaying unit and an optical lens group is provided. The image displaying unit provides an image beam. The optical lens group includes a reflecting unit, a first lens, a second lens and a diffractive optical element, which are disposed on the transmission path of the image beam. The first lens is disposed between the image displaying unit and the reflecting unit. The reflecting unit is disposed between the first lens and the second lens. The second lens is disposed between the reflecting unit and the eye. The diffractive optical element, the reflecting unit, the first lens and the second lens are independent optical elements, respectively. The image beam is transmitted to the eye through the first lens, the reflecting unit, the second lens and the diffractive optical element. | 07-16-2015 |
20150234458 | HEAD-UP DISPLAY - A head-up display including a display panel, a non-mechanical focusing lens, and a determining unit is provided. The display panel is configured to emit an image beam. The non-mechanical focusing lens is disposed on a transmission path of the image beam and generates an image of the image beam. The determining unit is electrically connected to the non-mechanical focusing lens and configured to adjust a focal length of the non-mechanical focusing lens according to a sensing signal, so as to change an image distance from the image to a user's eye. | 08-20-2015 |
20150316775 | ILLUMINATION SYSTEM AND PROJECTION APPARATUS - An illumination system includes a coherent light source, a first light-combining element, an optical wavelength conversion module, and a first auxiliary light source. The coherent light source emits a coherent light beam. The first light-combining element is disposed on a transmission path of the coherent light beam. The light wavelength conversion module is disposed on a transmission path of the coherent light beam transmitted from the first light-combining element and converts the coherent light beam into a first converted light beam, and reflects the first converted light beam back to the first light-combining element. The first auxiliary light source emits a first auxiliary light beam which is transmitted to the first light-combining element along the transmission path of the coherent light beam. The first light-combining element combines the first auxiliary light beam and the first converted light beam. A projection apparatus is also provided. | 11-05-2015 |
20150346579 | WAVELENGTH CONVERSION MODULE AND ILLUMINATION SYSTEM - A wavelength conversion module that includes a reflective substrate, a strip-shaped wavelength conversion layer, and a microstructure layer is provided. The strip-shaped wavelength conversion layer is located on the reflective substrate and includes a transparent base and a wavelength conversion material doped in the transparent base. The microstructure layer is located on the strip-shaped wavelength conversion layer and includes a plurality of microstructures. The microstructures are arranged on a surface of the microstructure layer in a close-packing manner. The wavelength conversion module satisfies n2−0.3≦n1≦n2+0.3, where n1 is a refractive index of the transparent base, and n2 is a refractive index of the microstructure layer. An illumination system is also provided. | 12-03-2015 |
20150362154 | ILLUMINATION APPARATUS - An illumination apparatus including an exciting light source, a reflective switching element, a first wavelength conversion element, and a second wavelength conversion element is provided. The exciting light source emits an exciting beam, and the reflective switching element is disposed on a transmission path of the exciting beam. When the reflective switching element is switched to a first state, the reflective switching element reflects the exciting beam to the first wavelength conversion element so as to excite the first wavelength conversion element to emit a first conversion beam. When the reflective switching element is switched to a second state, the reflective switching element reflects the exciting beam to the second wavelength conversion element so as to excite the second wavelength conversion element to emit a second conversion beam. | 12-17-2015 |
20160004138 | WAVELENGTH CONVERSION DEVICE AND PROJECTOR - A wavelength conversion device including a main body and a transparent element is provided. The main body has at least one wavelength conversion region, a containing recess portion, and a stop portion. The containing recess portion and the stop portion encircle a closed slot. The transparent element is disposed in the closed slot to construct a light penetration region. The stop portion stops the transparent element along a radial direction of the main body. Moreover, a projector using the wavelength conversion device is also mentioned. | 01-07-2016 |
20160004148 | PROJECTION APPARATUS AND ILLUMINATION SYSTEM - A projection apparatus including an illumination system, a light valve, and an image-forming system is provided. The illumination system includes a first dichroic unit, a second dichroic unit, a third dichroic unit, two wavelength conversion modules, two light sources respectively emitting a first beam and a second beam, and an excitation light source module emitting an excitation beam. The first dichroic unit and the second dichroic unit are disposed on a transmission path of the excitation beam. The two wavelength conversion modules respectively convert the corresponding partial excitation beam coming from the first dichroic unit and the second dichroic unit into two converted beams. The light valve converts the first beam, the two converted beams, and the second beam coming from the third dichroic unit into an image beam. The image-forming system is disposed on a transmission path of the image beam. | 01-07-2016 |
Patent application number | Description | Published |
20110240986 | PIXEL STRUCTURE OF ELECTROLUMINESCENT DISPLAY PANEL AND METHOD OF MAKING THE SAME - A pixel structure of an electroluminescent display panel includes a substrate, a first patterned conductive layer, an insulating layer, a second patterned conductive layer, an active layer, a first passivation layer and an electroluminescent device. The first patterned conductive layer includes a gate. The insulating layer, disposed on the substrate and the first patterned conductive layer, has at least a first contact hole partially exposing the gate. The second patterned conductive layer, disposed on the insulating layer, includes a first source, a first drain, and a second drain, where the second drain is electrically connected to the gate through the first contact hole of the insulating layer. | 10-06-2011 |
20110248245 | PIXEL STRUCTURE OF ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - A pixel structure of an organic light emitting diode display includes a first transistor and a second transistor. The first transistor includes a first drain electrode and a first source electrode. When a voltage difference is provided between the first drain electrode and the first source electrode, the first transistor has a first subthreshold slope (SS). The second transistor includes a second drain electrode and a second source electrode. When the voltage difference is provided between the second drain electrode and the second source electrode, the second transistor has a second SS, and the second SS is larger than the first SS. | 10-13-2011 |
20120162271 | PIXEL STRUCTURE OF ACTIVE MATRIX ORGANIC ELECTROLUMINESCENT DISPLAY PANEL AND METHOD OF MAKING THE SAME - A pixel structure of active matrix organic electroluminescent display panel includes a first light emitting device, a first driving switching device electrically connected to the first light emitting device for driving the first light emitting device, a second light emitting device, a second driving switching device electrically connected to the second light emitting device for driving the second light emitting device, and at least one addressing switching device electrically connected to at least one of the first driving switching device and the second driving switching device. | 06-28-2012 |
20130015448 | SEMICONDUCTOR DEVICE AND ELECTROLUMINESCENT DEVICE AND METHOD OF MAKING THE SAMEAANM Yang; Chao-ShunAACI Hsin-ChuAACO TWAAGP Yang; Chao-Shun Hsin-Chu TWAANM Hsieh; Hsing-HungAACI Hsin-ChuAACO TWAAGP Hsieh; Hsing-Hung Hsin-Chu TW - A semiconductor device, disposed on a substrate, includes a first channel layer, a patterned doped layer, a gate insulating layer, a conducting gate electrode, a second channel layer, a first electrode and a second electrode, and a third electrode and a fourth electrode. The first channel layer is disposed on the substrate and in a first region. The patterned doped layer includes a doped gate electrode disposed in a second region, and two contact electrodes electrically connected to two sides of the first channel layer, respectively. The conducting gate electrode is disposed on the gate insulating layer in the first region. The second channel layer is disposed on the gate insulating layer in the second region. The first electrode and the second electrode are electrically connected to the contact electrodes, respectively. The third electrode and the fourth electrode are electrically connected to two sides of the second channel layer, respectively. | 01-17-2013 |
20130049640 | MIRROR ELECTROLUMINESCENT DISPLAY PANEL - A mirror electroluminescent display panel includes an array substrate, a plurality of driving devices, a plurality of electroluminescent devices, and a cover substrate. The driving devices and the electroluminescent devices are disposed on the array substrate. Each electroluminescent device includes a first electrode electrically connected to the corresponding driving device, a light-emitting layer disposed on the first electrode, and a second electrode disposed on the light-emitting layer. The cover substrate and the array substrate are disposed oppositely. The cover substrate has a plurality of transmission regions, and a reflection region disposed between adjacent transmission regions, and each of the transmission regions is corresponding to each of the light-emitting layers, respectively. | 02-28-2013 |
Patent application number | Description | Published |
20120237861 | PHOTOMASK AND PHOTOMASK SUBSTRATE WITH REDUCED LIGHT SCATTERING PROPERTIES - A mask substrate, photomask and method for forming the same are provided. The photomask includes a substantially light transparent substrate and a circuitry pattern disposed over the light transparent substrate. The circuitry pattern includes a phase shifting layer disposed over the substantially light transparent substrate. A substantially light shielding layer is disposed over the phase shifting layer. At least one barrier layer is disposed over the substantially light shielding layer. An uppermost portion of the substantially light shielding layer does not comprise anti-reflective properties and the at least one barrier layer comprises an uppermost hardmask layer and an underlying anti-reflective layer. | 09-20-2012 |
20130207163 | Semiconductor Devices and Manufacturing Methods Thereof - Semiconductor devices and manufacturing methods thereof are disclosed. In one embodiment, a semiconductor device includes a workpiece with a first region having a plurality of first features and a second region having a plurality of second features proximate the first region. The first region and the second region share a patterning overlap region disposed between the first region and the second region. The patterning overlap region includes a residue feature with an aspect ratio of about 4 or less. | 08-15-2013 |
20130260573 | METHOD OF MAKING A LITHOGRAPHY MASK - A method of making a lithography mask with a stress-relief treatment is disclosed. The method includes providing a substrate and depositing an opaque layer on the substrate. The opaque layer is patterned to form a patterned mask. A stress-relief treatment is applied to the patterned mask by using an radiation exposure. | 10-03-2013 |
20130270667 | Metal Grid in Backside Illumination Image Sensor Chips and Methods for Forming the Same - A method includes forming a plurality of image sensors on a front side of a semiconductor substrate, and forming a dielectric layer on a backside of the semiconductor substrate. The dielectric layer is over the semiconductor substrate. The dielectric layer is patterned into a plurality of grid-filling regions, wherein each of the plurality of grid-filling regions overlaps one of the plurality of image sensors. A metal layer is formed on top surfaces and sidewalls of the plurality of grid-filling regions. The metal layer is etched to remove horizontal portions of the metal layer, wherein vertical portions of the metal layer remain after the step of etching to form a metal grid. A transparent material is filled into grid openings of the metal grid. | 10-17-2013 |
20150108551 | Method Of Making A FinFET Device - A method of fabricating a fin-like field-effect transistor (FinFET) device is disclosed. The method includes forming a mandrel features over a substrate, the mandrel feature and performing a coarse cut to remove one or more mandrel features to form a coarse space. After the coarse cut, the substrate is etched by using the mandrel features, with the coarse space as an etch mask, to form fins. A spacer layer is deposited to fully fill in a space between adjacent fins and cover sidewalls of the fins adjacent to the coarse space. The spacer layer is etched to form sidewall spacers on the fins adjacent to the coarse space. A fine cut is performed to remove a portion of one or more mandrel features to form an end-to-end space. An isolation trench is formed in the end-to-end space and the coarse space. | 04-23-2015 |
20150111362 | Method Of Making A FinFET Device - A method of fabricating a fin-like field-effect transistor device is disclosed. The method includes forming mandrel features over a substrate and performing a first cut to remove mandrel features to form a first space. The method also includes performing a second cut to remove a portion of mandrel features to form a line-end and an end-to-end space. After the first and the second cuts, the substrate is etched using the mandrel features, with the first space and the end-to-end space as an etch mask, to form fins. Depositing a space layer to fully fill in a space between adjacent fins and cover sidewalls of the fins adjacent to the first space and the end-to-end space. The spacer layer is etched to form sidewall spacers on the fins adjacent to the first space and the end-to-end space and an isolation trench is formed in the first space and the end-to-end space. | 04-23-2015 |
Patent application number | Description | Published |
20110215019 | Package Box Module - A package box module for packaging an object is disclosed, which includes a package box having a sidewall and plural first coupling structures disposed on the sidewall, and a common cushion disposed between the object and the sidewall. The common cushion includes plural second coupling structures and plural flexible structures disposed between the second coupling structures. The common cushion can be enlarged by extending the flexible structures, so that the first coupling structures couple to the second coupling structures, thus a gap between the object and the package box is filled by the common cushion. | 09-08-2011 |
20120275139 | BACKLIGHT MODULE - A backlight module is disclosed, which includes plural light sources, a light guide plate, a light scattering device, a high-reflectance microstructure formed on the light guide plate, and a high-diffusion microstructure formed on the light guide plate. The light guide plate has a first surface and a second surface opposite to the first surface. The first surface faces the light sources. The light scattering device is disposed between the light sources and the light guide plate. The high-reflectance microstructure is formed on the second surface. The high-diffusion microstructure is formed on or indented inwardly from the first surface. | 11-01-2012 |
20150085220 | DISPLAY DEVICE - A display device includes a flexible display panel, a light module and an optical film. The flexible display panel has a first axis and curving about the first axis as an axis of curvature. The light module is located on one side of the flexible display panel. The optical film is located between the flexible display panel and the light module. The optical film includes a substrate and multiple first strip microstructures. The substrate has a first side and a second side that are opposite to each other. The first side faces the light module while the second side faces the flexible display panel. The first strip microstructures are located on the first side of the substrate, and the first strip microstructures extend along a second axis. | 03-26-2015 |
Patent application number | Description | Published |
20130231161 | AUTOMATIC DETECTION METHOD AND PORTABLE ELECTRONIC DEVICE USING THE SAME - There is provided a portable electronic device including a backlight module, an ambient light sensor, a proximity sensor and a processing unit. The backlight module illuminates with backlight brightness. The ambient light sensor is configured to detect ambient light intensity. The proximity sensor is configured to detect an object. The processing unit is configured to activate the proximity sensor when the ambient light intensity detected by the ambient light sensor is lower than a predetermined value or decreases more than a predetermined range, and to maintain or reduce the backlight brightness according to a detection result of the proximity sensor. There is further provided an automatic detection method. | 09-05-2013 |
20130342443 | GESTURE DETECTING APPARATUS AND METHOD FOR DETERMINING GESTURE ACCORDING TO VARIATION OF VELOCITY - The present invention discloses a gesture detecting apparatus which includes an image capturing device and a processing unit. The image capturing device is for capturing an object light beam reflected by an object and outputting corresponding image information accordingly. The processing unit is for processing the image information and generating a first command or a second command accordingly. The steps of generating the first command and the second command by the processing unit include: outputting a first command if an image size of the image information increases with a relatively higher velocity and decreases with a relatively lower velocity in a sequential time series; and outputting a second command if the image size of the image information increases with a relatively lower velocity and decreases with a relatively higher velocity in the sequential time series. | 12-26-2013 |
20130342705 | BACKGROUND MODEL UPDATE METHOD FOR IMAGE PROCESS - The present invention relates to a background model update method for image process. The accuracy of distinguishing a foreground image from the background model can be improved by adjusting the background model update level according to image variations such as brightness variation, motion variation, color variation, etc. | 12-26-2013 |
20140009623 | GESTURE RECOGNITION SYSTEM AND GLASSES WITH GESTURE RECOGNITION FUNCTION - Glasses with gesture recognition function include a glasses frame and a gesture recognition system. The gesture recognition system is disposed on the glasses frame and configured to detect hand gestures in front of the glasses thereby generating a control command. The gesture recognition system transmits the control command to an electronic device to correspondingly control the electronic device. | 01-09-2014 |
20140022371 | PUPIL DETECTION DEVICE - A pupil detection device includes an active light source, an image sensor and a processing unit. The active light source emits light toward an eyeball. The image sensor captures at least one image frame of the eyeball to be served as an image to be identified. The processing unit is configured to calculate a minimum gray value in the image to be identified and to identify a plurality of pixels surrounding the minimum gray value and having gray values within a gray value range as a pupil area. | 01-23-2014 |
20140111632 | PUPIL DETECTION DEVICE - There is provided a pupil tracking device including an active light source, an image sensor and a processing unit. The active light source emits light toward an eyeball alternatively in a first brightness value and a second brightness value. The image sensor captures a first brightness image corresponding to the first brightness value and a second brightness image corresponding to the second brightness value. The processing unit identifies a brightest region at corresponding positions of the first brightness image and the second brightness image as an active light image. | 04-24-2014 |
20140278216 | DISPLACEMENT DETECTING DEVICE AND POWER SAVING METHOD THEREOF - The present invention discloses a displacement detecting device including a displacement sensing module, an input module, a distance sensing module, and a processing module, and a power saving method thereof. The processing module is electrically connected to each module. The input module is used to supply non-contact operation. The distance sensing module is used to detect the distance between a body and the displacement detecting device, and then produces a sensing value. The processing module selectively control the displacement sensing module and the input module to be turned on or turned off according to the sensing result of the distance sensing module. The displacement detecting device turns on the displacement sensing module when the sensing value is less than a first default value, and turns on the input module and turns off the displacement sensing module when the sensing value is greater than a second default value. | 09-18-2014 |
Patent application number | Description | Published |
20120105438 | THREE-DIMENSIONAL IMAGE INTERACTIVE SYSTEM AND POSITION-BIAS COMPENSATION METHOD OF THE SAME - A position-bias compensation method, applied to a three-dimensional image interactive system, includes steps of: displaying a three-dimensional image and setting a trigger position in a preset interactive coordinate system according to a default position of a user; obtaining a position-bias of a user's position from the default position; and resetting the trigger position according to the position-bias. | 05-03-2012 |
20120113163 | DISPLAY INTEGRATED CIRCUIT CHIP - A display IC chip includes a plurality of sides, a plurality of output terminals, two first color short-circuit lines, one second color short-circuit line, one third color short-circuit line, and conductive wires. The two first color short-circuit lines are parallel disposed in the IC chip and coupled to a first output terminal group of the output terminals. The second color short-circuit line is disposed between and parallel with the first color short-circuit lines. The second color short-circuit line is coupled to a second output terminal group of the output terminals. The third color short-circuit line is disposed between and parallel with the first color short-circuit lines. The third color short-circuit line is coupled to a third output terminal group of the output terminals. The conductive wires are coupled the first color short-circuit lines with the first output terminal group do not cross the second and third color short-circuit lines. | 05-10-2012 |
20140328084 | Electronic Device and Display Module with Sensing Antenna - An electronic device and a display module used therein are provided. The display module includes a display panel, a backlight module and a sensing antenna. The backlight module has a light exit surface and a reflective plate opposite to the light exit surface, and the display panel is stacked on the light exit surface. The sensing antenna is disposed on a surface of the reflective plate opposite to the light exit surface and has a body and two signal connecting terminals connecting the body. The electronic device includes the display module, a system circuit module, and a conductive device. The system circuit module is disposed on a back side of the display module and has a signal connecting parts corresponding to and connecting the signal connecting terminals. | 11-06-2014 |
Patent application number | Description | Published |
20110090199 | Display Panel Driving Circuit, Display Panel, and Driving Method thereof - By following properties that there is coupled noise, which is coupled from a display panel, within at least one common voltage used on the display panel, the at least one common voltage is fed-back into a pixel electrode driving module, and driving voltages are generated accordingly, so that the generated driving voltages carry noises closes to coupled noises of the display panel. As a result, while the driving voltages carrying noises from the at least one common voltage, the pixel electrode driving module is capable of driving a corresponding pixel electrode with a stable voltage difference, and thereby capable of relieving horizontal crosstalk and raising a display quality of the display panel. | 04-21-2011 |
20120105338 | SHIFT REGISTER AND TOUCH DEVICE - A touch device includes gate lines, pixels, sense control lines and sense units. Each pixel is connected to one of the gate lines and is decided whether to receive data according to a voltage on the gate line. Each the sense unit is connected to one of the sense control lines and is decided whether to perform a touch sense operation according to a voltage on the sense control line. The touch device further includes a shift register string including cascade-connected shift registers. Each shift register has first and second output terminals. The first output terminal provides an output to one of the gate lines according to a first clock signal to control the voltage on the gate line. The second output terminal provides an output to one of the sense control lines according to a second clock signal to control the voltage on the detection control line. | 05-03-2012 |
20120169629 | Display panel and operation method thereof - A display panel comprises a plurality of scan lines, a plurality of data lines and a plurality of display pixels. The scan lines are enabled for a corresponding scan period in sequence. Each of the display pixels is electrically coupled to a corresponding scan line and a corresponding data line respectively, and each of the display pixels is controlled by the corresponding scan line to determine whether receiving data provided from the corresponding data line. At least one of the display pixels is also used as a touch pixel. The scan period is divided into a touch period and a display period. A data line corresponding to the touch pixel provides touch-charging data to the touch pixel in the touch period, and provides image-displaying data to the touch pixel in the display period. | 07-05-2012 |
Patent application number | Description | Published |
20100110045 | Data Line Driving Method - A data line driving method adapted in a display panel driver circuit is provided. The display panel driver circuit comprises a plurality rows of gate lines and a plurality of data driver stages each corresponding to a data line group, wherein the data line driving method comprises the steps of: turning on the data driver stages in a first sequential order to input a first frame data in the data line groups corresponding to the data driver stages in each gate line activation time within a first frame period; and turning on the data driver stages in a second sequential order which is opposed to the first sequential order to input a second frame data in the data line groups corresponding to the data driver stages in each gate line activation time within a second frame period; wherein the first and the second frame period are two interlaced periods next to each other. | 05-06-2010 |
20120062542 | Liquid crystal display panel with function of compensating feed-through effect - An LCD panel with function of compensating feed-through effect includes plural groups of pixels, a gate-driving circuit, a data-driving circuit, and a gamma voltage generator. Each group of pixels includes first pixel and second pixel. The first pixel and the second pixel share a data line, and are respectively coupled to first gate line and second gate line. When the gate-driving circuit drives the first gate line, the gamma voltage generator provides un-compensated gamma voltages for the data-driving circuit writing data to the first pixel. When the gate-driving circuit drives the first and the second gate lines at the same time, the gamma voltage generator provides gamma voltages compensated by a compensating voltage level for the data-driving circuit writing data to the second pixel. In this way, the feed-through effect suffered by the second pixel is compensated, so that each pixel of the LCD panel can display with correct brightness. | 03-15-2012 |
20120120117 | DRIVING METHOD OF HALF-SOURCE-DRIVING (HSD) DISPLAY DEVICE - A HSD display device is adapted to receive data from a signal source and includes multiple pixel sets. Each pixel sets includes first pixel and second pixel. The first pixel is electrically coupled to a first data line and a first gate line. The second pixel is electrically coupled to the first pixel and a second gate line. The first gate line and the second gate line respectively are for controlling the first pixel and the second pixel whether to receive the data. In a driving method of the HSD display device, a common voltage is provided to the first and second pixels, and the common voltage is modulated to have two different voltage levels at a same side of a data central voltage. The data central voltage is an average of data voltages with different polarities from the signal source for displaying a same gray level. | 05-17-2012 |
20130271682 | Liquid crystal display panel with function of compensating feed-through effect - An LCD panel with function of compensating feed-through effect includes plural groups of pixels, a gate-driving circuit, a data-driving circuit, and a gamma voltage generator. Each group of pixels includes first pixel and second pixel. The first pixel and the second pixel share a data line, and are respectively coupled to first gate line and second gate line. When the gate-driving circuit drives the first gate line, the gamma voltage generator provides un-compensated gamma voltages for the data-driving circuit writing data to the first pixel. When the gate-driving circuit drives the first and the second gate lines at the same time, the gamma voltage generator provides gamma voltages compensated by a compensating voltage level for the data-driving circuit writing data to the second pixel. In this way, the feed-through effect suffered by the second pixel is compensated, so that each pixel of the LCD panel can display with correct brightness. | 10-17-2013 |
Patent application number | Description | Published |
20140217604 | Package Structure and Methods of Forming Same - A semiconductor device includes a first die having a first active surface and a first backside surface opposite the first active surface, a second die having a second active surface and a second backside surface opposite the second active surface, and an interposer, the first active surface of the first die being electrically coupled to a first side of the interposer, the second active surface of the second die being electrically coupled to a second side of the interposer. The semiconductor device also includes a first connector over the interposer, a first encapsulating material surrounding the second die, the first encapsulating material having a first surface over the interposer, and a via electrically coupling the first connector and the interposer. A first end of the via is substantially coplanar with the first surface of the first encapsulating material. | 08-07-2014 |
20150162220 | Package Structure and Methods of Forming Same - A semiconductor device includes a first die having a first active surface and a first backside surface opposite the first active surface, a second die having a second active surface and a second backside surface opposite the second active surface, and an interposer, the first active surface of the first die being electrically coupled to a first side of the interposer, the second active surface of the second die being electrically coupled to a second side of the interposer. The semiconductor device also includes a first connector over the interposer, a first encapsulating material surrounding the second die, the first encapsulating material having a first surface over the interposer, and a via electrically coupling the first connector and the interposer. A first end of the via is substantially coplanar with the first surface of the first encapsulating material. | 06-11-2015 |
Patent application number | Description | Published |
20110241084 | Semiconductor Device with a Buried Stressor - A semiconductor device, such as a PMOS or NMOS device, having localized stressors is provided. Recesses are formed on opposing sides of a gate electrode. A stress-inducing region is formed along a bottom of the recess, and a stressed layer is formed over the stress-inducing region. By having a stress-inducing region with a larger lattice structure than the stressed layer, a tensile strain may be created in a channel region of the semiconductor device and may be suitable for an NMOS device. By having a stress-inducing region with a smaller lattice structure than the stressed layer, a compressive strain may be created in the channel region of the semiconductor device and may be suitable for a PMOS device. Embodiments may be applied to various types of substrates and semiconductor devices, such as planar transistors and finFETs. | 10-06-2011 |
20130043507 | Semiconductor Device with a Buried Stressor - A semiconductor device, such as a PMOS or NMOS device, having localized stressors is provided. Recesses are formed on opposing sides of a gate electrode. A stress-inducing region is formed along a bottom of the recess, and a stressed layer is formed over the stress-inducing region. By having a stress-inducing region with a larger lattice structure than the stressed layer, a tensile strain may be created in a channel region of the semiconductor device and may be suitable for an NMOS device. By having a stress-inducing region with a smaller lattice structure than the stressed layer, a compressive strain may be created in the channel region of the semiconductor device and may be suitable for a PMOS device. Embodiments may be applied to various types of substrates and semiconductor devices, such as planar transistors and finFETs. | 02-21-2013 |
20140131812 | Source and Drain Dislocation Fabrication in FinFETs - A device includes a semiconductor fin over a substrate, a gate dielectric on sidewalls of the semiconductor fin, and a gate electrode over the gate dielectric. A source/drain region is on a side of the gate electrode. A dislocation plane is in the source/drain region. | 05-15-2014 |
20140138780 | FINFET HAVING UNIFORM DOPING PROFILE AND METHOD OF FORMING THE SAME - An embodiment fin field effect transistor (FinFET) device and method of forming the same. An embodiment method of forming a fin field effect transistor (FinFET) includes forming fins from a semiconductor substrate, forming a field oxide between the fins, forming a sacrificial gate over a channel region of the fins projecting from the field oxide, and implanting ions through the sacrificial gate to provide the channel region of the fins with a uniform doping profile. | 05-22-2014 |
Patent application number | Description | Published |
20130099355 | MEMS Structures and Methods for Forming the Same - A method includes forming a MEMS device, forming a bond layer adjacent the MEMS device, and forming a protection layer over the bond layer. The steps of forming the bond layer and the protection layer include in-situ deposition of the bond layer and the protection layer | 04-25-2013 |
20130140650 | MEMS Devices and Methods for Forming the Same - A method includes forming a Micro-Electro-Mechanical System (MEMS) device on a front surface of a substrate. After the step of forming the MEMS device, a through-opening is formed in the substrate, wherein the through-opening is formed from a backside of the substrate. The through-opening is filled with a dielectric material, which insulates a first portion of the substrate from a second portion of the substrate. An electrical connection is formed on the backside of the substrate. The electrical connection is electrically coupled to the MEMS device through the first portion of the substrate. | 06-06-2013 |
20130203199 | Methods of Bonding Caps for MEMS Devices - A method includes bonding a first bond layer to a second bond layer through eutectic bonding. The step of bonding includes heating the first bond layer and the second bond layer to a temperature higher than a eutectic temperature of the first bond layer and the second bond layer, and performing a pumping cycle. The pumping cycle includes applying a first force to press the first bond layer and the second bond layer against each other. After the step of applying the first force, a second force lower than the first force is applied to press the first bond layer and the second bond layer against each other. After the step of applying the second force, a third force higher than the second force is applied to press the first bond layer and the second bond layer against each other. | 08-08-2013 |
20140191341 | Method and Apparatus for a Semiconductor Structure - A semiconductor structure may include a first device having first surface with a first bonding layer formed thereon and a second device having a first surface with a second bonding layer formed thereon. The first bonding layer may provide an electrically conductive path to at least one electrical device in the first device. The second bonding layer may provide an electrically conductive path to at least one electrical device in the second device. One of the first or the second devices may include MEMS electrical devices. The first and/or the second bonding layers may be formed of a getter material, which may provide absorption for outgassing. | 07-10-2014 |