Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Hsiao, Hsinchu County
Chih-Chun Hsiao, Hsinchu County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100108232 | METHOD FOR FABRICATING ELECTROWETTING DISPLAYS - A method for fabricating an electrowetting display is provided. The method includes forming a plurality of hydrophilic ribs on a first substrate, forming a retaining wall surrounding the hydrophilic ribs, filling a non-polar solution within the hydrophilic ribs, forming a polar solution over the non-polar solution and the hydrophilic ribs within the retaining wall, providing a second substrate and assembling the first substrate and the second substrate. | 05-06-2010 |
Chih-Wen Hsiao, Hsinchu County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100118617 | MEMORIES WITH IMPROVED WRITE CURRENT - A memory with improved write current is provided, including a bit line, a write switch and a control circuit. The write switch is coupled between a voltage source and the bit line, and has a control terminal. Based on a bit line select signal, the control circuit controls the electric conductance of the write switch and discharges/charges the parasitic capacitors of the write switch. The voltage source is turned on after the control terminal of the write switch reaches a pre-determined voltage level. | 05-13-2010 |
| 20100153043 | MONITORING METHOD FOR THROUGH-SILICON VIAS OF THREE-DIMENSIONAL INTERGRATED CIRCUIT (3D IC) AND APPARATUS USING THE SAME - A monitoring method for Through-Silicon Vias (TSVs) of a three-dimensional integrated circuit (3D IC) is provided, wherein the 3D IC includes a plurality of TSVs, and the method includes: providing a plurality of inverters; connecting the inverters with the TSVs as a circuit; enabling the circuit to oscillate; measuring an output signal on an output end of one of the inverters; and determining the characteristic of TSVs of the 3D IC based on the output signal. | 06-17-2010 |
| 20100237386 | ELECTROSTATIC DISCHARGE STRUCTURE FOR 3-DIMENSIONAL INTEGRATED CIRCUIT THROUGH-SILICON VIA DEVICE - An electrostatic discharge (ESD) structure for a 3-dimensional (3D) integrated circuit (IC) through-silicon via (TSV) device is provided. The ESD structure includes a substrate, a TSV device which is formed through the substrate and is equivalent to a resistance-inductance-capacitance (RLC) device, and at least one ESD device which is disposed in the substrate and electrically connected to one end of the TSV device. The ESD structure can protect the 3D IC TSV device. | 09-23-2010 |
Ching-Fang Hsiao, Hsinchu County TW
| Patent application number | Description | Published |
|---|---|---|
| 20110228168 | Real-Time image processing circuit capable of enhancing brightness contrast and color saturation - A real-time image processing circuit includes: a first converting unit for converting an input image frame into hue data, first saturation data and first luminance data; a saturation processing unit operable to adjust the first saturation data based on saturation mapping information to generate second saturation data corresponding to the input image frame and having a saturation distribution range larger than that of the first saturation data; a luminance processing unit operable to adjust the first luminance data based on luminance mapping information to generate second luminance data corresponding to the input image frame and having a luminance distribution range larger than that of the first luminance data; and a second converting unit for converting the hue data, the second saturation data and the second luminance data into an output image frame corresponding to the input image frame and outputting the output image frame. | 09-22-2011 |
Chung-Li Hsiao, Hsinchu County TW
| Patent application number | Description | Published |
|---|---|---|
| 20090134464 | STATIC RANDOM ACCESS MEMORY AND FABRICATING METHOD THEREOF - A static random access memory at least includes: pluralities of transistors disposed on a substrate, each transistor at least includes a gate, a gate dielectric layer, a source doped region and a drain doped region, in which some of the source doped regions are used for connecting with a Vss voltage or a Vdd voltage, and a salicide layer disposed on the gates, the source doped regions except those source doped regions used for connecting a Vss voltage and a Vdd voltage and the drain doped regions. | 05-28-2009 |
Hsin-Hsin Hsiao, Hsinchu County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100065943 | METHOD FOR INCLUDING DECOUPLING CAPACITORS INTO SEMICONDUCTOR CIRCUIT HAVING LOGIC CIRCUIT THEREIN AND SEMICONDUCTOR CIRCUIT THEREOF - A method for including decoupling capacitors into a semiconductor circuit having at least a logic circuit therein, includes: arranging a first decoupling capacitor and a second decoupling capacitor into a first area and a second area around the logic circuit respectively, wherein a gate oxide thickness of the first decoupling capacitor is different from a gate oxide thickness of the second decoupling capacitor. | 03-18-2010 |
Jung-Lee Hsiao, Hsinchu County TW
| Patent application number | Description | Published |
|---|---|---|
| 20090083475 | APPARATUS AND METHOD FOR UPDATING FIRMWARE STORED IN A MEMORY - The invention provides a method for updating firmware stored in a memory. In one embodiment, the memory is divided into a plurality of blocks, and the firmware to be updated with a new image version. First, a first data block is obtained from the new image version, and a second data block is obtained from a target block selected from the memory. Whether the first data block is different from the second data block is then checked. The first data block is then written into the target block when the first data block is different from the second data block. Finally, the aforementioned steps are repeated until all of the blocks are processed. | 03-26-2009 |
| 20090262450 | DATA READING MODULE AND METHOD FOR READING OPTICAL DISC - Disclosed is a data reading module for reading an optical disc with data regions and undesired regions, wherein at least one of the undesired regions is located between the data regions. The data reading module includes: a decoder arranged to decode the optical disc to generate decoded data; a data transferring device arranged to transfer the decoded data; and a controller arranged to control the decoder according to a recorded map indicating the locations of the data regions and the undesired regions; wherein the controller controls the decoder to skip the undesired regions and does not decode the undesired regions while decoding the optical disc. | 10-22-2009 |
Kun Yuan Hsiao, Hsinchu County TW
| Patent application number | Description | Published |
|---|---|---|
| 20110105026 | COMBO WIRELESS SYSTEM AND METHOD USING THE SAME - A combo wireless system comprises a Bluetooth module, a wireless fidelity (WiFi) module, a single pole triple throw (SP3T) switch and an antenna. The antenna is utilized to transmit/receive Bluetooth signals for the Bluetooth module and to transmit/receive WiFi signals for the WiFi module. The SP3T switch is coupled between the antenna, the Bluetooth module and the WiFi module. The SP3T switch is controlled to select a path for the Bluetooth module to transmit/receive Bluetooth signals through the antenna, to select another path for the WiFi module to transmit WiFi signals through the antenna or to select another path for the WiFi module to receive the WiFi signals through the antenna. | 05-05-2011 |
Shen-Li Hsiao, Hsinchu County TW
| Patent application number | Description | Published |
|---|---|---|
| 20120000066 | Method for Manufacturing Alloy Resistor - An alloy resistor and a fabrication method thereof are provided. A fabrication method of an alloy resistor includes: providing an alloy sheet having a plurality of openings spacing apart from each other and going through the alloy sheet and a plurality of alloy resistor units located between any two adjacent openings, wherein each of the alloy resistor units has an insulating cover area and a plurality of electrode ends on both sides of the insulating cover area; forming an insulating layer on a surface of the insulating cover area of the alloy resistor units by an electrodeposition coating process; cutting the alloy along a connecting portion, so as to obtain separated alloy resistor units; and forming a conductive adhesion material on the electrode ends of the alloy resistor units. An alloy resistor having an insulating layer with a smooth surface can be obtained by performing an electrodeposition coating process. | 01-05-2012 |
| 20120001212 | Light-Emitting Diode Packaging Structure and Substrate Therefor - A light-emitting diode (LED) packaging structure and a substrate for the packaging structure are provided. The light-emitting diode packaging structure includes a metal substrate having a first surface and a second surface opposite to the first surface, and the first surface has a concave portion with a sidewall and a bottom, allowing an anode film to be formed on the metal substrate; a plurality of electrically conductive pads formed on the bottom of the concave portion; an optical treatment layer formed on the sidewall of the concave portion; and an LED die mounted on the bottom of the concave portion and electrically connected to the electrically conductive pads. Desired electrical insulating property between any two adjacent electrically conductive pads can be obtained by the anode film formed on the metal substrate, while a good thermal conductivity of the metal substrate is maintained. | 01-05-2012 |
Wei-Tien Hsiao, Hsinchu County TW
| Patent application number | Description | Published |
|---|---|---|
| 20110100975 | CARRIER FOR HEATING AND KEEPING WARM - A carrier for heating and keeping warm used for directly carrying food to-be kept warm is provided. The carrier for heating and keeping warm includes a carrier and at least a high melt point-electric heating alloy pattern. The carrier has a first surface and a second surface opposite to the first surface. The food is suitable for being directly placed on the first surface. A material of the second surface is ceramics or glass so that the second surface | 05-05-2011 |
Yun-Chiao Hsiao, Hsinchu County TW
| Patent application number | Description | Published |
|---|---|---|
| 20080297026 | APPARATUS OF FIELD EMISSION LIGHT SOURCE - An apparatus of the field emission light source having a luminous area and a non-luminous area includes a first plate, a second plate, cathode structures, gate structures, emission sources, an anode layer, a fluorescent layer, a getter, a retaining device and a sealant. The cathode structures are disposed in the luminous area and on the first plate. The emission sources are disposed on the cathode structures. The anode layer is disposed on the second plate. The fluorescent layer is disposed on the anode layer. The getter is disposed in the non-luminous area and on one of the first and the second plates. The retaining device is disposed between the luminous area and the non-luminous area. The sealant is sandwiched between the first plate and the second plate. When activating the getter, the retaining device can prevent metal ions gushed from the getter from entering the luminous area. | 12-04-2008 |
Zhi-Cheng Hsiao, Hsinchu County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100163897 | FLEXIBLE LIGHT SOURCE DEVICE AND FABRICATION METHOD THEREOF - A flexible light source device including a substrate, a light emitting device, a molding compound, a dielectric layer, and a metal line is provided. The substrate has a first surface, a second surface opposite to the first surface, and a first opening. The light emitting device is disposed on the first surface of the substrate and covers the first opening. The molding compound is located above the first surface and covers the light emitting device. The dielectric layer is disposed on the second surface and covers a sidewall of the first opening. The dielectric layer has a second opening which exposes part of the light emitting device. The metal line is disposed on the dielectric layer, wherein the metal line is electrically connected to the light emitting device via the second opening in the dielectric layer. Additionally, a fabrication method of the flexible light source device is also provided. | 07-01-2010 |