Hsiang-Hung
Hsiang-Hung Chang, Hsin Chu Hsien TW
Patent application number | Description | Published |
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20090014891 | Three-dimensional die-stacking package structure and method for manufacturing the same - This invention provides a substrate having at least one bottom electrode formed therein. A plurality of dice each having at least one opening formed therein are vertically stacked together one by one by a polymer insulating layer acting as an adhering layer between them, along with the openings thereof aligned to each other to form a through hole passing through said dice. The stacked dice are joined to a bottom of the substrate with the polymer insulating layer acting as an adhering layer, making the bottom electrode of the substrate contact the through hole. An electroplating process is performed with the bottom electrode serving as an electroplating electrode to form a conductive contact passing through the dice. | 01-15-2009 |
Hsiang-Hung Chang, Hsinchu TW
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20080308928 | Image sensor module with a three-dimensional die-stacking structure - This invention provides an image sensor module with a three-dimensional die-stacking structure. By filling a conductive material into through silicon vias within at least one image sensor die, and into via holes within an insulating layer, vertical electrical connections are formed between the image sensor die and an image processor buried in the insulating layer. A plurality of solder bumps is formed on a backside of the image sensor module so that the module can be directly assembled onto a circuit board. The image sensor module of this invention is characterized by a wafer-level packaging architecture and a three-dimensional die-stacking structure, which reduces electrical connection lengths within the module and thus reduces an area and height of the whole packaged module. | 12-18-2008 |
Hsiang-Hung Chang, Zhudong Township TW
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20150097259 | CONDUCTIVE VIA STRUCTURE, PACKAGE STRUCTURE, AND PACKAGE OF PHOTOSENSITIVE DEVICE - Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. Therefore, package structures such as photosensitive device packages using the conductive plug structures have superior electrical performance and reliability. | 04-09-2015 |
Hsiang-Hung Chen, Taipei Hsien TW
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20100226135 | WATER JET GUIDED LASER DEVICE HAVING LIGHT GUIDE PIPE - An exemplary water jet guided laser device includes a water-ejecting device and a hollow light guide pipe. The water-ejecting device has a water chamber, a light incident through hole and a water-ejecting through hole defined at opposite sides thereof. The light incident through hole and the water-ejecting through hole are in communication with the water chamber. The water-ejecting device is configured for ejecting water from the water chamber through the water-ejecting through hole. The light incident through hole is configured for introducing a laser beam in the water chamber. The hollow light guide pipe is mounted in the water chamber and aligned with the light incident through hole and the water-ejecting through hole. The light guide pipe is watertight and is configured for receiving and guiding the laser beam from the light incident through hole to the water-ejecting through hole. | 09-09-2010 |
Hsiang-Hung Hsieh, New Taipei City TW
Patent application number | Description | Published |
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20140115378 | SYSTEM AND METHOD FOR RESTORING NETWORK CONFIGURATION PARAMETERS - A system and a method for restoring network configuration parameters suitably adapted for automatically restoring the network configuration parameters to the ones before a power failure are provided. The method includes the following steps. A system chipset pre-stores network configuration parameters corresponding to a network unit. The system chipset executes a U-boot procedure when the power supply restores. Then the system chipset detects a status flag of the network unit. When the status flag is false, the system chipset writes the network configuration parameters into the network unit and sets the status flag to true. Then, the system chipset executes a shut-down procedure. | 04-24-2014 |