Hsiang-Hung

Hsiang-Hung Chang, Hsin Chu Hsien TW

Patent application number	Description	Published
20090014891	Three-dimensional die-stacking package structure and method for manufacturing the same - This invention provides a substrate having at least one bottom electrode formed therein. A plurality of dice each having at least one opening formed therein are vertically stacked together one by one by a polymer insulating layer acting as an adhering layer between them, along with the openings thereof aligned to each other to form a through hole passing through said dice. The stacked dice are joined to a bottom of the substrate with the polymer insulating layer acting as an adhering layer, making the bottom electrode of the substrate contact the through hole. An electroplating process is performed with the bottom electrode serving as an electroplating electrode to form a conductive contact passing through the dice.	01-15-2009

Patent application number	Description	Published
20080308928	Image sensor module with a three-dimensional die-stacking structure - This invention provides an image sensor module with a three-dimensional die-stacking structure. By filling a conductive material into through silicon vias within at least one image sensor die, and into via holes within an insulating layer, vertical electrical connections are formed between the image sensor die and an image processor buried in the insulating layer. A plurality of solder bumps is formed on a backside of the image sensor module so that the module can be directly assembled onto a circuit board. The image sensor module of this invention is characterized by a wafer-level packaging architecture and a three-dimensional die-stacking structure, which reduces electrical connection lengths within the module and thus reduces an area and height of the whole packaged module.	12-18-2008

Patent application number	Description	Published
20100226135	WATER JET GUIDED LASER DEVICE HAVING LIGHT GUIDE PIPE - An exemplary water jet guided laser device includes a water-ejecting device and a hollow light guide pipe. The water-ejecting device has a water chamber, a light incident through hole and a water-ejecting through hole defined at opposite sides thereof. The light incident through hole and the water-ejecting through hole are in communication with the water chamber. The water-ejecting device is configured for ejecting water from the water chamber through the water-ejecting through hole. The light incident through hole is configured for introducing a laser beam in the water chamber. The hollow light guide pipe is mounted in the water chamber and aligned with the light incident through hole and the water-ejecting through hole. The light guide pipe is watertight and is configured for receiving and guiding the laser beam from the light incident through hole to the water-ejecting through hole.	09-09-2010