Hsi-Chen
Hsi-Chen Hsihe, Sinjhuang City TW
Patent application number | Description | Published |
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20080296604 | LIGHT-EMITTING DIODE LEAD FRAME AND MANUFACTURE METHOD THEREOF - The invention discloses an LED lead frame and the manufacture method thereof. First, a press-formed strip including a guide strip, a first metal frame, and a second metal frame is provided. The first metal frame and the second metal frame are connected to the guide strip and are connected to each other via a connection part. The first metal frame includes a first region. The second metal frame includes a second region. The connection part includes a third region. Then, the press-formed strip is clipped by a fixture such that the first region and the second region are exposed. Then, the press-formed strip is put in an electroplate solution and an electroplate layer is plated on the first region and the second region, but not on the third region. At last, the fixture is removed. The LED lead frame is then obtained. | 12-04-2008 |
Hsi-Chen Wang, San Jose, CA US
Patent application number | Description | Published |
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20120086866 | HYBRID ARCHITECTURE OF TV RECEIVING DEVICES - A hybrid architecture of a television (TV) receiving system is disclosed. The architecture includes two portions, a hardware portion and a software portion. The hardware portion includes a minimum amount of hardware to achieve operations of receiving a RF signal, producing an IF signal and outputting data representing the IP signal. The software portion, taking advantage of available computing power (e.g., high-speed microprocessor and a lot of memory) in a computing device and executed therein, includes one or more demodulators, all implemented in software. Each of the demodulators is implemented in accordance with one type of TV standard. Thus depending on the received data, a corresponding demodulator is activated to demodulate the received data and subsequently produces audio and video data. One of the advantages, benefits and objects in the present invention is to have a band of software-based demodulators, any of which may be updated or expanded whenever there is a new TV standard or modification to an existing standard. | 04-12-2012 |
Hsi-Chen Yang, Houli Township TW
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20080285784 | Package structure of a microphone - A kind of microphone package structure includes at least of a substrate, a sound processing unit, an upper cap and other devices. There would be at least one trench set on the substrate, and a separation gap between the trench and the bonding pad of the substrate is maintained. After connective paste is smeared on the surface of the substrate, the trench would be assembled with other devices. This kind of package structure could prevent a short circuit being caused by the overflowing of the connective paste. | 11-20-2008 |
Hsi-Chen Yang, Taichung City TW
Patent application number | Description | Published |
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20120273931 | Integrated circuit chip package and manufacturing method thereof - The present invention discloses an integrated circuit (IC) chip package and a manufacturing method thereof. The IC chip package includes: a lead frame, including a lead frame array having plural conductive cells, wherein some of the conductive cells are respectively electrically connected with corresponding first extended wires; at least one redistribution layer, wherein each redistribution layer includes plural second extended wires, which are respectively electrically connected to the first extended wires or the second extended wires of another redistribution layer; and a solder array, including plural solder balls, which are electrically connected to the lead frame array. | 11-01-2012 |