Patent application number | Description | Published |
20100003399 | ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING THE SAME AND METHOD FOR MANUFACTURING CIRCUIT BOARD - Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. | 01-07-2010 |
20100181104 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - The present invention is directed to a method for manufacturing a printed circuit board in which a plurality of conductive layers forming a wiring pattern are laminated in the state where they are put between insulating layers, and a printed circuit board formed thereby. The printed circuit board manufacturing method for the present invention includes a step of forming a via fill ( | 07-22-2010 |
20100243149 | METHOD FOR FORMING A CIRCUIT PATTERN - A method for forming a circuit pattern is disclosed. A circuit pattern that forms an electrically conductive layer ( | 09-30-2010 |
20110259373 | METHOD AND AGENT FOR SURFACE PROCESSING OF PRINTED CIRCUIT BOARD SUBSTRATE - A surface processing method and a surface processing agent for effectively removing smear produced in a via or the like are disclosed. The smear is to be removed without etching an inner metalized layer without using expensive permanganates that might impose a greater load on an environment and operators. By removing the smear, the tightness in adhesion between an inner metalized circuit layer and plating metal as well as reliability in electrical connection may be improved. To this end, a surface processing method for a resin-containing substrate of a printed circuit board is provided in which the smear left in an opening, such as a blind via, a through-hole or a trench, formed in the substrate, may be removed without etching a metalized inner layer. The surface processing method immerses the interconnect substrate in a weakly acidic to weakly alkaline first processing solution at least containing hydrogen peroxide and subsequently in a second processing solution at least containing an alkali compound and an organic solvent. | 10-27-2011 |
20120058254 | ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING THE SAME AND METHOD FOR MANUFACTURING CIRCUIT BOARD - Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. | 03-08-2012 |
20130056362 | MANUFACTURE METHOD OF BUILDUP CIRCUIT BOARD - A manufacturing method of a buildup circuit board includes forming a wiring layer on an organic polymer insulating layer by copper electroplating and building up other organic polymer insulating layer on the wiring layer, wherein in a final step of the copper electroplating, a surface of the wiring layer is roughened by copper electroplating and the organic polymer insulating layer is formed directly on the roughened surface of the wiring layer. According to the invention, a specific etching step that is essential for enhancing adhesion between the organic polymer insulating layer and the wiring layer can be omitted and no expensive etching apparatus is necessary, thus being good in economy. In addition, if various types of copper sulfate plating baths containing different types of additives used for via fill plating are used as they are, irregularities on the surface can be made in various forms and roughnesses. Thus, it is necessary to select a specific type of etching solution depending on film characteristics ascribed to types of additives. Moreover, it is easy to form surface irregularities in conformity with the type of material and physical properties of the organic polymer insulating layer being built up. | 03-07-2013 |
20130295294 | ELECTROLESS COPPER PLATING BATH AND ELECTROLESS COPPER PLATING METHOD - Provided are an electroless copper plating bath and an electroless copper plating method using the electroless copper plating bath, the electroless copper plating bath not containing formaldehyde; being usable under approximately neutral pH conditions; improving plating bath stability; and capable of forming a plating film with a good thickness while controlling deposition outside a pattern. The electroless copper plating bath according to the present invention contains a water-soluble copper salt, and amine borane or a substituted derivative thereof as a reducing agent; does not contain formaldehyde; and has a pH of 4 to 9, wherein polyaminopolyphosphonic acid as a complexing agent, an anionic surface-active agent, an antimony compound, and a nitrogen-containing aromatic compound are contained. | 11-07-2013 |
20140053774 | SURFACE TREATING APPARATUS - A tank body | 02-27-2014 |
20140116334 | SURFACE TREATING APPARATUS - An tank such as an electroless copper plating tank | 05-01-2014 |