| Patent application number | Description | Published |
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| 20090148048 | INFORMATION CLASSIFICATION DEVICE, INFORMATION CLASSIFICATION METHOD, AND INFORMATION CLASSIFICATION PROGRAM - A table record estimation device includes: a table element string extraction unit having a function of extracting text data from input data and acquiring a series of keywords as an element of a table (table data) from the extracted text data; a table element labeling unit having a function of labeling the individual keywords acquired by the table element string extraction unit for each type based on correspondence information stored in a classification rule storage unit; and a label appearance pattern estimation unit having a function of estimating a label permutation constituting one-unit record from a label string attached for the each type by the table element labeling unit and outputting the label permutation as a record estimation result. | 06-11-2009 |
| 20100121885 | ONTOLOGY PROCESSING DEVICE, ONTOLOGY PROCESSING METHOD, AND ONTOLOGY PROCESSING PROGRAM - To provide a technique for structuralizing ontology in a prescribed form to a structure to which features of data are reflected. An ontology processing device has a structuralizing device for structuralizing properties of the ontology in the prescribed form generated from a set of instance data containing a combination of a subject, a property, and an object expressed with a character string according to the features of the object, and has a ontology storage device which stores the ontology structuralized by the structuralizing device. With this structure, the properties of the ontology in the prescribed form are corrected or expressed as an ontology structure by reflecting the characteristics of a set of the objects obtained from the data. | 05-13-2010 |
| 20110153615 | DATA CLASSIFIER SYSTEM, DATA CLASSIFIER METHOD AND DATA CLASSIFIER PROGRAM - A data classifier system of the present invention selects a plurality of classifications correlated to data groups so as to output classification axes based on hierarchical classifications and data groups. The data classifier system includes a basic category accumulation means, a classification axis candidate reduction means and a priority calculation means. The basic category accumulation means accumulates classifications serving as basic categories used for desired classifications in advance. The classification axis candidate reduction means selects a plurality of classifications from among classifications descendant from each basic category so as to create classification axis candidates, thus reducing classification axis candidates subjected to calculations based on data quantity of classifications and hierarchical distances of classifications. The priority calculation means calculates priority in displaying classification axis candidates, the number of which is reduced by the classification axis candidate reduction means. | 06-23-2011 |
| Patent application number | Description | Published |
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| 20080254300 | Resin Composition, Resin-Attached Metal Foil, Base Material-Attached Insulating Sheet and Multiple-Layered Printed Wiring Board - A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy. The present invention is directed to a resin composition, capable of being employed for forming a resin layer of a resin-attached metal foil or an insulating sheet of a base material-attached insulating sheet, and comprises: a cyanate resin and/or a prepolymer thereof; an epoxy resin substantially containing no halogen atom; a phenoxy resin substantially containing no halogen atom; an imidazole compound; and an inorganic filler, and also directed to a resin-attached metal foil formed by cladding a metal foil with such resin composition, a base material-attached insulating sheet formed by cladding an insulating base material therewith, and a multiple-layered printed wiring board, formed by laying such resin-attached metal foil(s) or such base material-attached insulating sheet(s) on a single side or both sides of an internal layer circuit board, and hot pressure forming thereof. | 10-16-2008 |
| 20090039487 | SEMICONDUCTOR DEVICE - A semiconductor device comprises a source frame having a die pad; a linear gate frame having a bonding pad; a semiconductor chip mounted on the die pad; wires which electrically connect a source terminal of the semiconductor chip to the die pad and electrically connect a gate terminal of the semiconductor chip to the bonding pad; and resin which seals the die pad, the bonding pad, the semiconductor chip, and the wires. The die pad is spaced from the bonding pad and diagonal to an extending direction of the gate frame, in the vicinity of the bonding pad. | 02-12-2009 |
| 20090126974 | Manufacturing Process for a Prepreg with a Carrier, Prepreg with a Carrier, Manufacturing Process for a Thin Double-Sided Plate, Thin Double-Sided Plate and Manufacturing Process for a Multilayer-Printed Circuit Board - A process for manufacturing a prepreg with a carrier exhibiting excellent impregnating properties and thickness precision, which is particularly suitably used for preparing a build-up type multilayer-printed circuit board is provided. Also, a prepreg with a carrier prepared by the manufacturing process and a process for manufacturing a multilayer-printed circuit board utilizing the prepreg with a carrier are provided. There is provided a process for continuously manufacturing a prepreg with a carrier comprising an insulating resin layer having a backbone material of a textile fabric, (a) laminating the insulating resin layer side of a first and a second carriers comprising an insulating resin layer on one side on the both sides of the textile fabric, respectively, to form a laminate and bonding them under a reduced pressure, and (b) after the bonding, heating the laminate at a temperature equal to or higher than a melting point of the insulating resin. | 05-21-2009 |
| 20090166060 | Insulating Resin Layer, Insulating Resin Layer With Carrier And Multiple-Layered Printed Wiring Board - An insulating resin layer, which is capable of being employed for forming a multiple-layered printed wiring board via a thermal compression forming process, comprising: at least one first layer and at least one second layer being stacked, wherein a specific dielectric constant of the first layer at a frequency of 1 MHz after the thermal compression forming is not more than 3.2, and wherein a linear expansion coefficient of the second layer at a temperature within a range of from not lower than 35 degree C. to not higher than 85 degree C. after the thermal compression forming is not more than 40 ppm/degree C. A multiple-layered printed wiring board, formed by disposing the aforementioned insulating resin layer over at least one side of an internal layer circuit board, and then conducting a thermal compression forming process. | 07-02-2009 |
| 20090302462 | Prepreg, Method for Manufacturing Prepreg, Substrate, and Semiconductor Device - A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided. The prepreg according to the present invention includes a core layer including a sheet-shaped base member and having one surface and the other surface which is opposite to the one surface, the first resin layer provided on the one surface of the core layer and formed of a first resin composition, and the second resin layer provided on the other surface of the core layer and formed of a second resin composition, wherein at least one of a requirement that a thickness of the first resin layer is different from that of the second resin layer and a requirement that a constitution of the first resin composition is different from that of the second resin composition is satisfied. | 12-10-2009 |
| 20090321919 | SEMICONDUCTOR DEVICE - The semiconductor device | 12-31-2009 |
| 20100300619 | PREPREG, METHOD FOR MANUFACTURING PREPREG, SUBSTRATE, AND SEMICONDUCTOR DEVICE - A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided. The prepreg according to the present invention includes a core layer including a sheet-shaped base member and having one surface and the other surface which is opposite to the one surface, the first resin layer provided on the one surface of the core layer and formed of a first resin composition, and the second resin layer provided on the other surface of the core layer and formed of a second resin composition, wherein at least one of a requirement that a thickness of the first resin layer is different from that of the second resin layer and a requirement that a constitution of the first resin composition is different from that of the second resin composition is satisfied. | 12-02-2010 |
| 20110120630 | MANUFACTURING PROCESS FOR A PREPREG WITH A CARRIER, PREPREG WITH A CARRIER, MANUFACTURING PROCESS FOR A THIN DOUBLE-SIDED PLATE, THIN DOUBLE-SIDED PLATE AND MANUFACTURING PROCESS FOR A MULTILAYER-PRINTED CIRCUIT BOARD - A process for manufacturing a prepreg with a carrier exhibiting excellent impregnating properties and thickness precision, which is particularly suitably used for preparing a build-up type multilayer-printed circuit board is provided. Also, a prepreg with a carrier prepared by the manufacturing process and a process for manufacturing a multilayer-printed circuit board utilizing the prepreg with a carrier are provided. There is provided a process for continuously manufacturing a prepreg with a carrier comprising an insulating resin layer having a backbone material of a textile fabric, (a) laminating the insulating resin layer side of a first and a second carriers comprising an insulating resin layer on one side on the both sides of the textile fabric, respectively, to form a laminate and bonding them under a reduced pressure, and (b) after the bonding, heating the laminate at a temperature equal to or higher than a melting point of the insulating resin. | 05-26-2011 |
