| Patent application number | Description | Published |
|---|
| 20080197485 | Module comprising a semiconductor chip comprising a movable element - The invention relates to a module comprising a carrier, a first semiconductor chip applied to the carrier and having a movable element and a second semiconductor chip applied to the first semiconductor chip, wherein an active first main surface of the first semiconductor chip faces the carrier and a first cavity is formed between the two semiconductor chips. | 08-21-2008 |
| 20080227235 | Sensor Component And Method For Producing A Sensor Component - A device for detecting a measured quantity has a sensor chip for detecting the measured quantity, a supply for providing a power supply, and an injection-molded enclosure for accommodating the sensor chip and the supply, the injection-molded enclosure including integrated conductive traces providing an electrical connection between the sensor chip and the supply. | 09-18-2008 |
| 20080236278 | Electrical device with covering - The invention relates to a device comprising a sensor chip and a structure housing the sensor chip. The structure is covered by a mold compound and is fabricated from a ceramic or a glass material. | 10-02-2008 |
| 20080251904 | CURING LAYERS OF A SEMICONDUCTOR PRODUCT USING ELECTROMAGNETIC FIELDS - A semiconductor product including a substrate, a semiconductor chip fitted to the substrate, and a layer, which contains coated particles, located adjacent to the semiconductor chip, wherein the coated particles have a ferromagnetic, ferrimagnetic or paramagnetic core and a coating. | 10-16-2008 |
| 20080298621 | MODULE INCLUDING A MICRO-ELECTRO-MECHANICAL MICROPHONE - A module including a micro-electro-mechanical microphone is disclosed. One embodiment provides a substrate having a trough-shaped depression and a micro-electro-mechanical microphone. The micro-electro-mechanical microphone is mounted into the trough-shaped depression of the substrate. | 12-04-2008 |
| 20080315399 | Semiconductor Device Having Through Contacts Through a Plastic Housing Composition and Method for the Production Thereof - The invention relates to a semiconductor device comprising through contacts through a plastic housing composition and a method for the production thereof. For this purpose, the wiring substrate has a solder deposit on which through contact elements are arranged vertically with respect to the wiring substrate and extend as far as the top side of the semiconductor device. | 12-25-2008 |
| 20090026560 | SENSOR PACKAGE - A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface. Contact elements are electrically connecting the carrier with the semiconductor sensor. A protective layer made of an inorganic material covers at least the active surface and the contact elements. | 01-29-2009 |
| 20090057885 | SEMICONDUCTOR DEVICE - A semiconductor device is disclosed. One embodiment provides a semiconductor chip having a main surface, wherein a first molding compound accommodates the semiconductor chip. The first molding compound has a surface that is substantially coplanar to the main surface of the semiconductor chip. A second molding compound is arranged in a space between the first molding compound and the semiconductor chip. | 03-05-2009 |
| 20090080138 | FLUIDIC ELECTROSTATIC ENERGY HARVESTER - One embodiment of the present invention relates to a variable capacitor that operates without moving mechanical parts. In this capacitor electrically conductive electrodes are separated by an enclosed chamber filled with an electrically conductive material. The electrically conductive material can freely vary its position within the chamber. The capacitance of the device will vary as position of the conductive material changes due to external mechanical motion (ex: rotation vibration, etc.) of the device. Other embodiments of this device are also disclosed. | 03-26-2009 |
| 20090085704 | CHIP INDUCTOR - A chip inductor includes a first substrate and a second substrate. The first substrate includes at least one first conductive strip line having end terminals at a surface of the first substrate and the second substrate includes at least one second conductive strip line having end terminals at a surface of the second substrate, wherein a pitch of the end terminals on the first substrate corresponds to a pitch of the end terminals on the second substrate. Furthermore, conductive studs are provided which connect the end terminals on the first substrate with the end terminals on the second substrate to form an inductor loop. | 04-02-2009 |
| 20090102054 | SEMICONDUCTOR PACKAGE - A semiconductor package is disclosed. One embodiment provides a semiconductor package singulated from a wafer includes a chip defining an active surface, a back side opposite the active surface, and peripheral sides extending between the active surface and the back side; a contact pad disposed on the active surface; and a metallization layer extending from the contact pad onto a portion of the peripheral sides of the chip. | 04-23-2009 |
| 20090127638 | ELECTRICAL DEVICE AND METHOD - An electrical device and method is disclosed. One embodiment provides a substrate, a sensor chip disposed completely above a plane section of a surface of the substrate. A structurally homogeneous material layer is disposed above the substrate and the sensor chip. A cavity is formed between the substrate and the material layer. The sensor chip is disposed inside the cavity. | 05-21-2009 |
| 20090153138 | SENSOR MODULE AND METHOD FOR MANUFACTURING A SENSOR MODULE - A method of manufacturing a sensor module includes providing a substrate comprising an array of magnetically sensitive elements on a first main face of the substrate. An array of conducting lines is applied over the first main face of the substrate. An array of electrical interconnects is applied over the first main face of the substrate. The substrate is singulated after application of the electrical interconnects. | 06-18-2009 |
| 20090212645 | ELECTRONIC DEVICE FOR HARVESTING ENERGY - An electrical device for harvesting energy includes a container, a magnet situated in the container, a fluid partially filling the container, and a conductive member coiled around the container, wherein oscillation of the magnet through the coil induces an electrical signal. | 08-27-2009 |
| 20090243595 | SENSOR MODULE WITH MOLD ENCAPSULATION FOR APPLYING A BIAS MAGNETIC FIELD - A method of manufacturing a sensor module includes providing a substrate comprising a magnetically sensitive sensor element. The sensor element and the substrate are encapsulated with at least one mold material that is configured to apply a bias magnetic field to the sensor element. | 10-01-2009 |
| 20090256361 | ENERGY HARVESTER - An energy harvesting system and method includes a rotatable member with an electrically conductive coil mounted to the rotatable member and adapted to move with the rotatable member such that the movement of the coil through a magnetic field induces a voltage in the coil. An energy storage device is coupled to the coil. | 10-15-2009 |
| 20090295381 | MAGNETIC SENSOR INTEGRATED CIRCUIT DEVICE AND METHOD - An sensor includes a substrate with a magnetic field sensor mounted on the substrate. The magnetic field sensor has a first surface defining a plane. A magnetic flux conducting member has a second surface that is not parallel to the first surface. A non-magnetic member is situated between the magnetic field sensor and the magnetic flux conducting member. | 12-03-2009 |
| 20090309191 | SEMICONDUCTOR DEVICE - A semiconductor device includes a wafer having a first surface opposite a second surface, and at least one laser irradiated region between the first and second surfaces. The laser irradiated region includes a laser-induced stress that is configured to minimize curvature of at least one of the first and second surfaces. | 12-17-2009 |
| 20090313817 | SENSOR MODULE - A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane. | 12-24-2009 |
| 20100072626 | WAFER LEVEL PACKAGED MEMS INTEGRATED CIRCUIT - A wafer-level packaged integrated circuit includes a semiconductor substrate including a first silicon layer. A micro-electromechanical system (MEMS) device is integrated into the first silicon layer. A thin-film deposited sealing member is deposited over the first silicon layer and is configured to seal a cavity in the first silicon layer. At least one additional layer is formed over the sealing member. At least one under bump metallization (UBM) is formed over the at least one additional layer. | 03-25-2010 |
| 20100078832 | SENSOR NODE MODULE - A method of manufacturing a sensor node module includes forming a protruding structure on a carrier. A sensor die is applied onto the protruding structure with an active sensing surface of the sensor die facing the carrier. The sensor die is encapsulated with mold material, wherein the protruding structure prevents the mold material from covering the active sensing surface. The carrier and the protruding structure are removed from the sensor die. | 04-01-2010 |
| 20100127355 | SEMICONDUCTOR DEVICE AND METHOD - A semiconductor device and method. One embodiment provides a semiconductor substrate having a plurality of cut regions. A metal layer is located within a cut region. The metal layer includes a recess, the recess having a slit-like shape. | 05-27-2010 |
| 20100181687 | SEMICONDUCTOR DEVICE INCLUDING SINGLE CIRCUIT ELEMENT - A semiconductor device includes a chip. The chip includes a single circuit element formed in a semiconductor substrate, a first metal layer on a first face of the semiconductor substrate, and a second metal layer on a second face of the semiconductor substrate opposite the first face. The first metal layer and the second metal layer are configured for accessing the single circuit element. A smaller of a first width of the first face of the semiconductor substrate and a second width of the first face of the semiconductor substrate perpendicular to the first width is less than or equal to a distance between an exposed face of the first metal layer parallel to the first face of the semiconductor substrate and an exposed face of the second metal layer parallel to the second face of the semiconductor substrate. | 07-22-2010 |
| 20100203676 | CHIP ASSEMBLY - A method of manufacturing an array of semiconductor devices comprises providing a first carrier having multiple chip alignment regions. Multiple chips are placed over the multiple chip alignment regions. Then, alignment of the chips to the multiple chip alignment regions is obtained. The multiple chips are then placed on a second carrier. The first carrier is detached from the multiple chips. An encapsulation material is applied to the multiple chips to form an encapsulated array of semiconductor chips. The second carrier is then detached from the encapsulated array of semiconductor devices. | 08-12-2010 |
| 20100221854 | SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes attaching a first semiconductor substrate to a support substrate, and thinning the first semiconductor substrate to form a thinned semiconductor layer. The method additionally includes integrating a functional element with the thinned semiconductor layer, and forming at least one through-connect through the thinned semiconductor layer. | 09-02-2010 |
| 20100230766 | SENSOR DEVICE AND METHOD - A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element. | 09-16-2010 |
| 20100264523 | Panel, Semiconductor Device and Method for the Production Thereof - A panel has a baseplate with an upper first metallic layer and a multiplicity of a vertical semiconductor components. The vertical semiconductor components in each case have a first side with a first load electrode and a control electrode and an opposite second side with a second load electrode. The second side of the semiconductor components is in each case mounted on the metallic layer of the baseplate. The semiconductor components are arranged in such a way that edge sides of adjacent semiconductor components are separated from one another. A second metallic layer is arranged in separating regions between the semiconductor components. | 10-21-2010 |
| 20100276769 | SEMICONDUCTOR DEVICE - A semiconductor device includes a magnetic sensor chip, an electrically conducting layer wafer-level patterned in contact with the magnetic sensor chip, encapsulation material disposed on the magnetic sensor chip, and an array of external contact elements electrically coupled with the magnetic sensor chip through the electrically conducting layer. | 11-04-2010 |
| 20100295140 | SEMICONDUCTOR DEVICE - A semiconductor device includes a housing defining a cavity, a magnetic sensor chip disposed in the cavity, and mold material covering the magnetic sensor chip and substantially filling the cavity. One of the housing or the mold material is ferromagnetic, and the other one of the housing or the mold material is non-ferromagnetic. | 11-25-2010 |
| 20100300191 | ACTIVE AND ADAPTIVE TIRE SYSTEMS - An active and adaptive tire system is disclosed. The active and adaptive tire system comprises a tire and an active material configured to alter at least one characteristic of the tire in response to at least one condition. Also disclosed are an intelligent tire system and a method of monitoring a condition. | 12-02-2010 |
| 20110001493 | FLUIDIC ELECTROSTATIC ENERGY HARVESTER - One embodiment of the present invention relates to a variable capacitor that operates without moving mechanical parts. In this capacitor electrically conductive electrodes are separated by an enclosed chamber filled with an electrically conductive material. The electrically conductive material can freely vary its position within the chamber. The capacitance of the device will vary as position of the conductive material changes due to external mechanical motion (ex: rotation, vibration, etc.) of the device. Other embodiments of this device are also disclosed. | 01-06-2011 |
| 20110012214 | MICROELECTROMECHANICAL SEMICONDUCTOR COMPONENT WITH CAVITY STRUCTURE AND METHOD FOR PRODUCING THE SAME - One aspect of the invention relates to a semiconductor component with cavity structure and a method for producing the same. The semiconductor component has an active semiconductor chip with the microelectromechanical structure and a wiring structure on its top side. The microelectromechanical structure is surrounded by walls of at least one cavity. A covering, which covers the cavity, is arranged on the walls. The walls have a photolithographically patterned polymer. The covering has a layer with a polymer of identical type. In one case, the molecular chains of the polymer of the walls are crosslinked with the molecular chains of the polymer layer of the covering layer to form a dimensionally stable cavity housing. | 01-20-2011 |
| 20110027942 | SEMICONDUCTOR PACKAGE - A semiconductor package is disclosed. One embodiment provides a semiconductor package singulated from a wafer includes a chip defining an active surface, a back side opposite the active surface, and peripheral sides extending between the active surface and the back side; a contact pad disposed on the active surface; and a metallization layer extending from the contact pad onto a portion of the peripheral sides of the chip. | 02-03-2011 |
| 20110127998 | GMR SENSOR WITHIN MOLDED MAGNETIC MATERIAL EMPLOYING NON-MAGNETIC SPACER - An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die. | 06-02-2011 |
| 20110147930 | Semiconductor Component of Semiconductor Chip Size with Flip-Chip-Like External Contacts - A semiconductor component and a method for its production in semiconductor chip size, can have a semiconductor chip, which has external contacts of the semiconductor component that are arranged in the manner of a flip-chip on its active upper side. The semiconductor chip can be encapsulated by a plastic compound at least on its rear side and its side edges. The outer contacts, which can be arranged on external contact connecting areas, can project from the active upper side. | 06-23-2011 |
| 20110163440 | SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes providing a carrier and attaching a plurality of semiconductor chips to the carrier. The semiconductor chips have a first electrode pad on a first main face and at least a second electrode pad on a second main face opposite to the first main face, whereby the first electrode pad is electrically connected to the carrier. A plurality of first bumps are formed on the carrier, the first bumps being made of a conductive material. The carrier is then singulated into a plurality of semiconductor devices, wherein each semiconductor device includes at least one semiconductor chip and one first bump. | 07-07-2011 |
