Horimoto, JP
Akihiro Horimoto, Tokyo JP
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20090023840 | LATENT CATALYST FOR EPOXY RESIN, EPOXY RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE - The present invention provides a latent catalyst for epoxy resin, comprising: a cation moiety having an activity of accelerating curing reaction of epoxy resin; and a silicate anion moiety of suppressing the curing reaction-accelerating activity. Also disclosed are an epoxy resin composition comprising the latent catalyst and a semiconductor device using the epoxy resin composition. | 01-22-2009 |
Akira Horimoto, Nasushiobara-Shi JP
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20090184518 | COUPLING APPARATUS - A coupling apparatus includes projections projecting axially from circumferential positions on a distal part of an annular body, each projection having an engaging hook projecting in one circumferential direction at an end part thereof. The body and the projections are formed independently of each other, and the apparatus includes a fixing structure for fixing the projections to the positions on the distal part. After inner peripheries of the projections are placed on the outer periphery of the distal part adjacent to an outward overhang, the fixing structure is detachably fixed on the outer periphery in a side of the projections axially opposing to the overhang and has an inward tapering surface fitted on an outward tapering surface of each projection to fix the projections at the predetermined positions on the outer periphery, and includes a cutout exposing the outward tapering surface of at least one projection. | 07-23-2009 |
Akira Horimoto, Nasu-Gun JP
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20090087256 | Coupling Apparatus for Structural Members - The coupling apparatus for structural members includes a paired couplers for coupling structural members with each other, and each coupler includes a cylindrical main body, engaging projections spaced apart from each other at predetermined intervals in a circumferential direction at an end of the body and projecting along the center line of the body, and engaging hooks projecting in one circumferential direction at the projecting end portions of the projections. At least one coupler further includes a coupling direction changing mechanism which couples the at least one coupler with a predetermined position of a structural member corresponding thereto so that the center line of the body of the at least one coupler can be orientated in a desired direction. | 04-02-2009 |
Hiroki Horimoto, Tokyo JP
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20100137043 | PORTABLE TERMINAL DEVICE - Disclosed herein is a portable terminal device including an antenna, a casing, and an operation unit. The casing at least part of which is formed from a metallic material is disposed so that the antenna is exposed. The operation unit is formed from a resin material and mounted to the casing so as to cover the exposed antenna. | 06-03-2010 |
Katsuhisa Horimoto, Tokyo JP
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20130237435 | GENE CLUSTER, GENE SEARCHING/IDENTIFICATION METHOD, AND APPARATUS FOR THE METHOD - The present invention provides a method for searching for or identifying a useful gene logically, systematically, and efficiently in an extremely short time without largely relying on searcher's knowledge, experience, or the like and even without sequentially conducting gene disruption experiments as in conventional techniques of searching for a useful gene. The present invention also provides an apparatus for the method. Virtual gene clusters each comprising two or more genes are individually scored by summing the respective pieces of differential expression information (obtained using, for example, microarrays) of genomic genes on a per-cluster basis. On the basis of the obtained scores of the virtual gene clusters, a gene cluster containing a useful gene and the useful gene contained in the cluster are searched for. | 09-12-2013 |
Kazuhide Horimoto, Hachioji JP
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20090094467 | Multiple Computer Equipment and Management Method Thereof - An object of the present invention is to provide a management technique for managing power supply modules. In multiple computer equipment | 04-09-2009 |
Kazutoyo Horimoto, Kyoto JP
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20090302241 | X-RAY OPAQUE FILAMENT, X-RAY OPAQUE COVERED FILAMENT AND FIBER STRUCTURE USING SAID X-RAY OPAQUE FILAMENT AND/OR X-RAY OPAQUE COVERED FILAMENT - An X-ray opaque filament is provided, which is constituted of a filament formed of a thermoplastic resin containing an X-ray opaque agent and has a dry heat shrinkage of 3.5 to 0% at 130° C. An X-ray opaque covered filament is provided, which is formed by covering the periphery of the X-ray opaque filament with a covering fiber. Furthermore, an X-ray opaque filament is provided, which is constituted of a fiber formed of a thermoplastic resin containing an X-ray opaque agent and has an oil containing an ionic surfactant in a ratio of 0 to 10% by mass added thereto. An X-ray opaque covered filament is provided, which has a covering fiber formed of a thermoplastic resin having a lower melting point than the thermoplastic resin constituting the X-ray opaque filament. A fiber structure is provided which includes the X-ray opaque filament and/or the X-ray opaque covered filament. | 12-10-2009 |
Keiichi Horimoto, Sakura-Shi JP
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20090001258 | OPTICAL SENSOR - An optical sensor includes a light source, a sensing unit, a first optical fiber transmitting light from the light source to the sensing unit, second and third optical fibers transmitting the light from a reflecting surface of the sensing unit to light-receiving portions, and a calculation unit calculating physical quantities from electrical signals from the light-receiving portions. End surfaces of these fibers opposed to the reflecting surface are fixed so that the longitudinal direction thereof and the normal line of the reflecting surface form an angle θ, the second and third optical fibers are parallel to each other, and the fixing angles of the first optical fiber and the second and third optical fibers are symmetric about the normal line. These optical fibers have a single mode in the wavelength of which the optical fibers are used. A depolarizer is interposed between the light source and the first optical fiber. | 01-01-2009 |
20090199646 | OPTICAL FIBER THERMOMETER AND TEMPERATURE-COMPENSATED OPTICAL FIBER SENSOR - This optical fiber thermometer includes one optical fiber for projection that relays light from the light source to a measuring unit, two optical fibers for light-reception that relay light reflected from a reflecting face of a mirror provided at the measuring unit to two light-receiving units, and an arithmetic processing circuit that calculates the pressure of the measuring unit from the ratio of electrical signals from the two light-receiving units; end surfaces of three optical fibers arranged to face the reflecting face being fixed such that an angle θ between the longitudinal direction of the optical fibers and the normal to the reflecting face is not zero, the two optical fibers for light-reception being parallel, fixing angles between each of them and the optical fiber for projection being symmetrical based on the normal to the reflecting face as a reference, and each of the optical fibers being a single-mode fiber at the wavelength being used, According to this invention, it is possible to provide an optical fiber thermometer that is inexpensive and can measure temperature with high precision, and a temperature-compensated optical fiber sensor that uses the optical fiber thermometer in compensating measurement error due to temperature-change, and can achieve highly precise measuring. | 08-13-2009 |
20090257705 | OPTICAL SENSOR - An optical sensor includes a light source, a sensing unit, a first optical fiber transmitting light from the light source to the sensing unit, second and third optical fibers transmitting the light from a reflecting surface of the sensing unit to light-receiving portions, and a calculation unit calculating physical quantities from electrical signals from the light-receiving portions. End surfaces of these fibers opposed to the reflecting surface are fixed so that the longitudinal direction thereof and the normal line of the reflecting surface form an angle θ, the second and third optical fibers are parallel to each other, and the fixing angles of the first optical fiber and the second and third optical fibers are symmetric about the normal line. These optical fibers have a single mode in the wavelength of which the optical fibers are used. A depolarizer is interposed between the light source and the first optical fiber. | 10-15-2009 |
Manabu Horimoto, Kobe-Shi JP
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20090202024 | Reducing Apparatus and Method, and Receiving Apparatus - An object of the invention is to allow receiving a radio wave signal in a comfortable manner by overcoming defects in technique and performance according to the related art in reducing a multipath noise by use of an adaptive digital filter. In a multipath noise reducing apparatus ( | 08-13-2009 |
Masaki Horimoto, Daito-Shi JP
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20120134643 | Image Display Equipment - A TV receiver which is connected to a BD player via a HDMI cable. The TV receiver comprises a display and a BD loader. When the BD player receives the command to perform a reproduction, the BD player transmits the CEC command for instructing the TV receiver to turn the power on. The TV receiver detects whether or not a BD disc is put in the BD loader. As a result of the detection, when the BD disc is put in the BD loader and also when the display can display a superimposed image, the TV receiver displays image contents read out from the BD disc on the display. Subsequently, the TV receiver displays a message which prompts the user to select whether or not to eject the BD disc. When “YES” is selected, the TV receiver ejects the BD disc. | 05-31-2012 |
Masaki Horimoto, Osaka JP
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20090237571 | VIDEO DISPLAY DEVICE - This video display device includes a maker name table and a device type table. Moreover, this video display device includes a communication means which, when some external input channel is selected, receives from a device upon that external input channel the logical address and the vendor ID which are allocated in advance to that device on that external input channel. This video display device also includes a conversion means which converts the vendor ID which has been received by the communication unit to a letter string representing a maker's name, on the basis of the maker name table. The conversion means also converts the logical address which has been received by the communication unit to a letter string representing the device type of the device, on the basis of the device type table. Furthermore, this video display device also includes a display means which displays those letter strings. | 09-24-2009 |
Masanobu Horimoto, Chiyoda-Ku JP
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20160126626 | THREE-AXIS CONTROL ANTENNA DEVICE - A vertical axis driver drives a vertical axis for azimuth angle tracking. A horizontal axis driver drives a horizontal axis for elevation angle tracking. A cross horizontal axis driver drives a cross horizontal axis to which an antenna is attached, that is rotatable around an axis orthogonal to the horizontal axis. An arithmetic processing controller generates a drive signal of a constant azimuth angle the vertical axis when a maximum elevation angle of the antenna is greater than or equal to a set angle in a path of the target object in a single time of continuous tracking. When the maximum elevation angle of the antenna is less than the set angle in the path of the target object in the single time of continuous tracking, the controller issues a drive command of an azimuth angle direction to the vertical axis. | 05-05-2016 |
Masashi Horimoto, Ukyo-Ku JP
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20150380976 | MOBILE DEVICE - A mobile device is configured such that it can be charged using an electric power signal S | 12-31-2015 |
Masashi Horimoto, Kyoto JP
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20150076906 | POWER SUPPLY CIRCUIT, CONTROL CIRCUIT THEREOF, AND ELECTRONIC APPARATUS - A power supply circuit including a DC/DC converter having switching elements and configured to receive an input voltage in an input line and generate an output voltage in an output line; and a linear regulator configured to receive the output voltage and supply a stabilized voltage to a load. The DC/DC converter switches between a switching mode to switch the switching elements and a bypass mode to put a switching element existing on a path from the input line to the output line, of the switching elements, in a full-on state and stop switching of the other switching element. | 03-19-2015 |
Masayuki Horimoto, Tokyo JP
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20140246126 | METHOD FOR PRODUCING STEEL COMPONENT - A method for producing a steel component by performing the treatments of the following sequentially steps 1 and 2 to a steel material containing, by mass %, C: 0.15 to 0.25%, Si: 0.01 to 0.10%, Mn: 0.50 to 0.80%, S: 0.003 to 0.030%, Cr: 0.80 to 1.20%, Mo: 0.30 to 0.45%, Al: 0.015 to 0.050%, and N: 0.010 to 0.025%, wherein Cr/Mn is 1.3 to 2.4, the balance being Fe and impurities, and contents of P and O among the impurities are P: not more than 0.010%, and O: not more than 0.0020%: | 09-04-2014 |
20140366992 | PROCESS FOR PRODUCING CARBONITRIDED PART - A process for producing a carbonitrided part comprising the steps of preparing a base steel part, having a composition comprising, in mass percent, C: 0.10 to 0.24%, Si: 0.15 to 1.0%, Mn: 0.30 to 1.0%, Cr: 0.40 to 2.0%, S: 0.05% or less, with the balance being Fe and impurities and performing the following steps 1-4 in sequence. Step 1 is carburizing the base steel part under a carburizing atmosphere at a temperature of 900 to 950° C. Step 2 is carbonitriding the base steel part carburized according to step 1 under a carbonitriding atmosphere at a temperature of 800 to 900° C. with a nitrogen potential of 0.2 to 0.6%. Step 3 is quenching the base steel part carbonitrided according to step 2. Step 4 is tempering the base steel part quenched according to step 3 at a temperature of more than 250° C. to not more than 350° C. | 12-18-2014 |
20150027591 | STEEL MATERIAL FOR NITRIDING AND NITRIDED COMPONENT - A steel material for nitriding has a composition comprising, by mass percent, C: more than 0.15% and not more than 0.35%, Si≦0.20%, Mn: 0.10 to 2.0%, P≦0.030%, S≦0.050%, Cr: 0.80 to 2.0%, V: 0.10 to 0.50%, Al: 0.01 to 0.06%, N≦0.0080%, O≦0.0030%, and optionally one or more elements of Mo, Cu, Ni, Ti, Nb, Zr, Pb, Ca, Bi, Te, Se and Sb, the balance being Fe and impurities. The composition satisfies the conditions of [20≦(669.3×log | 01-29-2015 |
20150059933 | STEEL FOR COLD FORGING/NITRIDING, STEEL MATERIAL FOR COLD FORGING/NITRIDING, AND COLD-FORGED/NITRIDED COMPONENT - A steel comprises, by mass percent, C: 0.10 to 0.15%, Si: not less than 0.02% and less than 0.10%, Mn: more than 0.90% and not more than 2.50%, P≦0.030%, S≦0.050%, Cr: 0.80 to 2.0%, V: 0.05 to 0.50%, Al: 0.01 to 0.07%, N≦0.0080%, O≦0.0030%, and one or more selected from Mo, Cu, Ni, Ti, Nb, Zr, Pb, Ca, Bi, Te, Se and Sb, the balance being Fe and impurities. The composition satisfies [35≦Mn/S≦200], [20≦(669.3×log | 03-05-2015 |
20150125339 | CASE HARDENING STEEL MATERIAL - A case hardening steel material having a chemical composition consists of, by mass percent, C: 0.15 to 0.23%, Si: 0.01 to 0.15%, Mn: 0.65 to 0.90%, S: 0.010 to 0.030%, Cr: 1.65 to 1.80%, Al: 0.015 to 0.060%, and N: 0.0100 to 0.0250%, further containing, as necessary, one or more kinds selected from Cu and Ni of predetermined amounts, the balance being Fe and impurities; 25≦Mn/S≦85, 0.90≦Cr/(Si+2Mn)≦1.20, and 1.16Si+0.70Mn+Cr≧2.20; P, Ti and O in the impurities being P≦0.020%, Ti≦0.005%, and O≦0.0015%; and having a structure consisting of 20 to 70% in an area ratio being ferrite; and the portion other than the ferrite being one or more kinds of pearlite and bainite. The steel material is used suitably as a raw material of the carburized part such as a CVT pulley shaft. | 05-07-2015 |
Masayuki Horimoto, Chiyoda-Ku JP
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20130243641 | ROLLED STEEL BAR OR WIRE FOR HOT FORGING - A rolled steel bar or a wire rod for hot forging capable of coping with both bending/surface fatigue strength of components and machinability at a high level includes: a composition containing, in mass %, C: 0.1 to 0.25%, Si: 0.01 to 0.10%, Mn: 0.4 to 1.0%, S: 0.003 to 0.05%, Cr: 1.60 to 2.00%, Mo: 0.10% or less (including 0%), Al: 0.025 to 0.05%, and N: 0.010 to 0.025%, where a value of fn1 represented in a following formula (1) satisfies 1.82≦fn1≦2.10: fn1=Cr+2×Mo (1); impurities containing P: 0.025% or less, Ti: 0.003% or less, and O (oxygen): 0.002% or less; and a cross section in which a maximum value/a minimum value of an average ferrite grain diameter is 2.0 or less when measurement by observation is randomly carried out in 15 visual fields with an area per visual field set to be 62500 μm | 09-19-2013 |
20140363329 | ROLLED STEEL BAR OR WIRE ROD FOR HOT FORGING - A rolled steel bar or wire rod having hot surface fatigue strength, wear resistance, and machinability even after hot forging has a composition containing C, Si, Mn, S, Cr, Mo (optional), Al, and N, with the balance being Fe and impurities. The chemical composition satisfies that fn1 defined by Formula (1) is 1.60 to 2.10. The structure of the rolled steel bar or wire rod for hot forging includes a ferrite-pearlite structure, a ferrite-pearlite-bainite structure, or a ferrite-bainite structure. A maximum value/a minimum value of average ferrite grain size, which is observed and measured randomly in 15 visual fields each having an area of 62500 μm | 12-11-2014 |
Masayuki Horimoto, Nishinomiya-Shi JP
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20120211122 | METHOD FOR PRODUCING CARBONITRIDED MEMBER - A method for producing a carbonitrided member comprising the steps of carburizing a steel part having a composition of, by mass percent, C: 0.10 to 0.35%, Si: 0.15 to 1.0%, Mn: 0.30 to 1.0%, Cr: 0.40 to 2.0%, S: 0.05% or less with the balance being Fe and impurities in a carburizing atmosphere of 900 to 950° C. The carburized steel part is carbonitrided in a carbonitriding atmosphere with the temperature of 800 to 900° C. and the nitrogen potential of 0.2 to 0.6%. The carbonitrided steel part is qhenched and then shot peened. The shot peening treatment may be further performed while heating to a temperature not higher than 350° C. or immediately after heating to a temperature not higher than 350° C. After quenching, the shot peening treatment may be further performed after tempering in the temperature range exceeding 250° C. and not higher than 350° C. | 08-23-2012 |
20130273393 | STEEL FOR COLD FORGING/NITRIDING, STEEL MATERIAL FOR COLD FORGING/NITRIDING, AND COLD-FORGED/NITRIDED COMPONENT - A steel for cold forging/nitriding has, by mass percent, C: 0.01 to 0.15%, Si≦0.35%, Mn: 0.10 to 0.90%, P≦0.030%, S≦0.030%, Cr: 0.50 to 2.0%, V: 0.10 to 0.50%, Al: 0.01 to 0.10%, N≦0.0080%, and O≦0.0030%, further according to need a specific amount of one or more elements selected from Mo, Cu, Ni, Ti, Nb, Zr, Pb, Ca, Bi, Te, Se and Sb, with the balance being Fe and impurities, and further satisfying the conditions of [399×C+26×Si+123×Mn+30×Cr+32×Mo+19×V≦160], [20≦(669.3×log | 10-17-2013 |
Masayuki Horimoto, Nishinomiya JP
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20110284133 | CARBONITRIDED PART AND PROCESS FOR PRODUCING CARBONITRIDED PART - A carbonitrided part, where a base steel contains, in mass percent, C: 0.10 to 0.35%, Si: 0.15 to 1.0%, Mn: 0.30 to 1.0%, Cr: 0.40 to 2.0%, S≦0.05%, and according to need further Mo≦0.50%, with the balance being Fe and impurities, and in the region to a position of effective hardening depth from the surface of a hardened layer of the carbonitrided part, iron nitride particles of ε-Fe | 11-24-2011 |
Sanaki Horimoto, Tokyo JP
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20090163122 | SYSTEM AND METHOD FOR POLISHING SURFACE OF TAPE-LIKE METALLIC BASE MATERIAL - A polishing system and a method are presented for uniformly polishing efficiently at a fast rate the surface of a tape-like metallic base material of several hundred meters in length. The polishing system is provided not only with devices for causing the base material to travel continuously and applying a specified tension in the base material but also with a first polishing device for randomly polishing the target surface and a second polishing device for carrying out a final polishing on the target surface in the direction of travel of the base material. Polishing marks are formed in the direction of travel on the target surface by the final polishing. | 06-25-2009 |
20100016169 | METHOD FOR POLISHING TAPE-SHAPED SUBSTRATE FOR OXIDE SUPERCONDUCTOR, OXIDE SUPERCONDUCTOR, AND BASE MATERIAL FOR OXIDE SUPERCONDUCTOR - An oxide superconductor member is composed of a tape-shaped substrate, an intermediate layer formed on this substrate and an oxide superconductor thin film layer formed on this intermediate layer. A surface of the tape-shaped substrate is polished by continuously running the tape-shaped substrate. The polishing step includes initial polishing process and finishing process which are carried out such that the average surface roughness Ra of the substrate becomes 2 nanometers or less and the in-plane directionality of the intermediate layer becomes 5° or less after the polishing step. | 01-21-2010 |
20100160170 | METHOD FOR POLISHING TAPE-SHAPED SUBSTRATE FOR OXIDE SUPERCONDUCTOR, OXIDE SUPERCONDUCTOR, AND BASE MATERIAL FOR OXIDE SUPERCONDUCTOR - A surface polishing method for enhancing crystal orientation on the surface of a tapelike metal substrate in order to enhance the critical current of a superconducting thin film. In an oxide superconductor comprising a tapelike substrate, an intermediate layer formed on the tapelike substrate, and an oxide superconducting thin film layer formed on the intermediate layer, the method for polishing a surface to be polished of the tapelike substrate comprises a step for polishing the surface to be polished while traveling the tapelike substrate continuously, wherein an initial polishing step and a finish polishing step are included. Ultimately, the average surface roughness Ra of the polished surface is 2 nanometer or less and the in-plane orientation Δφ is 5° or less. | 06-24-2010 |
Sanaki Horimoto, Akishima JP
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20090054243 | METHOD OF POLISHING TAPE-SHAPED SUBSTRATE AND SUBSTRATE FOR OXIDE SUPERCONDUCTOR - A target surface of a tape-shaped substrate of an oxide superconductor with an intermediate layer formed on this target surface and an oxide superconductor thin film is polished by causing the tape-shaped substrate to continuously run. The polishing step includes an initial polishing process for carrying out random polishing of the target surface and a finishing process that is carried out after the initial polishing process for forming grooves on the target surface along the running direction of the substrate. The intermediate layer has an in-plane directionality of 7° or less. The tape-shaped substrate is fabricated by rolling nickel, a nickel alloys or stainless steel. | 02-26-2009 |
Satsuki Horimoto, Fukuoka JP
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20110298955 | Clock multiplying circuit, solid-state imaging device, and phase-shift circuit - A clock multiplying circuit includes: first and second inverters being ON/OFF-controlled by a positive- or negative-phase signal, respectively, of a first clock signal and including current source and current sync terminals; a capacitive element provided between output ends of the inverters; a current supplying unit increasing, if a frequency of the first clock signal increases, the control current and supplying the control current to the current source terminals of the inverters and outputting, from the current sync terminals of the inverters, a control current the same current amount as that of a control current to the current source terminal; a differential detecting unit receiving input of a potential difference signal between both electrodes of the capacitive element and generating a second clock signal having a phase difference of 90 degrees; and a multiplied-signal generating unit generating a double signal of the first clock signal on the basis of the clock signals. | 12-08-2011 |
Shuhei Horimoto, Miyoshi City JP
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20140291696 | POWER ELECTRONICS MODULES WITH SOLDER LAYERS HAVING REDUCED THERMAL STRESS - Power electronics modules having solder layers with reduced thermal-stress are disclosed. In one embodiment, a power electronics module includes a power electronics device having a first surface, a second surface, a first edge, and a second edge opposite the first edge. The power electronics device has a device length measured from the first edge to the second edge. A first solder layer is adjacent to the first surface of the power electronics device, and a second solder layer is adjacent to the second surface. The first solder layer and the second solder layer have a maximum thickness T along a length that is less than the device length of the power electronics device. A first thermally conductive layer is adjacent to the first solder layer, and a second thermally conductive layer is adjacent to the second solder layer. In some embodiments, the first and second solder layers have tapered portions. | 10-02-2014 |
Shuhei Horimoto, Miyoshi JP
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20140346660 | POWER ELECTRONICS DEVICES HAVING THERMAL STRESS REDUCTION ELEMENTS - Power electronics devices having thermal stress reduction elements are disclosed. A power electronics device includes a heat source having a heat source perimeter, a first conduction member coupled to the heat source, and a substrate coupled to the first conduction member. The first conduction member includes a support portion that extends to at least the heat source perimeter and a plurality of finger portions extending from the support portion and separated from one another by web regions, where the plurality of finger portions have a finger thickness that is greater than a web thickness of the web regions. | 11-27-2014 |
Taisuke Horimoto, Bankyotan JP
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20160024479 | HIGH TITER RECOMBINANT INFLUENZA VIRUSES WITH ENHANCED REPLICATION IN VERO CELLS - The invention provides a composition useful to prepare high titer influenza viruses, e.g., in the absence of helper virus, which includes internal genes from an influenza virus vaccine strain or isolate, e.g., one that is safe in humans, for instance, one that does not result in significant disease, and genes from vaccine seed virus isolates which include a HA gene segment with a HA2 sequence encoding a HA2 that confers enhanced growth in cells in culture, such as Vero cells. | 01-28-2016 |
Taisuke Horimoto, Tokyo JP
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20110110978 | HIGH TITER RECOMBINANT INFLUENZA VIRUSES WITH ENHANCED REPLICATION IN VERO CELLS - The invention provides a composition useful to prepare high titer influenza viruses, e.g., in the absence of helper virus, which includes internal genes from an influenza virus vaccine strain or isolate, e.g., one that is safe in humans, for instance, one that does not result in significant disease, and genes from vaccine seed virus isolates which include a HA gene segment with a HA2 sequence encoding a HA2 that confers enhanced growth in cells in culture, such as Vero cells. | 05-12-2011 |
Takayuki Horimoto, Taito-Ku JP
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20130239375 | RATCHET BUCKLE FOR HELMETS - Provided is a ratchet buckle for helmets wherein an engagement/releasing member having an engagement part is assembled to the buckle, via a pin, between the base member and operating member, and therefore when the operating member is pulled up and rotated in the counterclockwise direction, the front end of the operating member contacts the front end of the engagement/releasing member and the engagement with the tab of the ratchet is released by rotation of the engagement part of the engagement/releasing member, and because the engagement is released by pulling up the operating member by at least twice the conventional pull-up distance, the helmet will not come off from the head as a result of a wrong or inadvertent lever operation and thus safety can be ensured, while the thickness of the ratchet buckle can be kept small. | 09-19-2013 |
Takayuki Horimoto, Fujisawa JP
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20150295210 | BASE MATERIAL INTEGRATED TYPE SEAL AND METAL MOLD FOR MANUFACTURING THE SAME - A seal with an integral base material in which a gasket is formed integrally with a film, sheet, or plate-shaped base material, wherein space saving is achieved by making the width of the gasket as small as possible. In order to achieve the foregoing, the following are provided: the film, sheet, or plate-shaped base material; the gasket that is provided integrally with the base material and that is formed of a rubbery elastic material; and a fill layer formed by the rubbery elastic material that is filled into a through hole that is provided in an open state in the base material. A portion of the fill layer is connected to the gasket and another portion extends out from the gasket at substantially the same thickness as the base material. | 10-15-2015 |
Tomoyuki Horimoto, Tokyo JP
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20150266076 | HOT-PRESS DEEP-DRAWING FORMING METHOD AND HOT-PRESS DEEP-DRAWING FORMING METHOD APPARATUS - A hot-press deep-drawing forming apparatus includes a punch that constitutes a lower die and a die that constitutes an upper die. The punch has an inner-face forming surface that forms the inner face of a product, and a bent corner against which a scrap section S of a workpiece W abuts. The die has an outer-face forming surface that forms the outer surface of the product. A blank holder and a pre-forming die that clamp the scrap section are caused to move, together with the die, until the clamped scrap section abuts the bent corner. The movement of the blank holder and the pre-forming die is stopped after the scrap section has abutted the bent corner. | 09-24-2015 |
Wataru Horimoto, Neyagawa-Shi, Osaka JP
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20160024282 | FIBERS FOR USE IN FIBER-REINFORCED RESIN, AND PRODUCTION METHOD THEREOF - Fibers for fiber-reinforced resin of the present invention are fibers for fiber-reinforced resin to which a sizing agent is adhered. The fibers are at least one selected from carbon fibers and glass fibers, and an ester bond (—COO—) generated by denaturation of the sizing agent is present on surfaces of the fibers. A method for producing the same according to the present invention includes: subjecting fibers to which a sizing agent is adhered to at least one treatment selected from the group consisting of ozone oxidation, ultraviolet irradiation at a wavelength of 400 nm or less, and a plasma treatment. The fibers are at least one selected from carbon fibers and glass fibers. Thus, it is possible to provide carbon fibers having enhanced wettability to a matrix resin and thereby allowing the matrix resin to be impregnated between the fibers easily. | 01-28-2016 |
Yasuhiro Horimoto, Shiga JP
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20140184352 | ELECTROSTATIC MICRO RELAY AND MANUFACTURING METHOD FOR THE SAME - An electrostatic micro relay has a substrate, a signal line arranged on the substrate and having an input point configured to receive a signal and a plurality of signal channels configured to distribute the signal, the plurality of signal channels being each formed with a fixed contact, a plurality of movable contacts, each provided with respect to each of the fixed contacts and arranged so as to be opposed to a corresponding fixed contact across a space, a plurality of movable electrodes, each connected to each of the plurality of movable contacts and configured to make the connected movable contact brought into contact with and separated from the corresponding fixed contact, a cap, formed with a space configured to house the plurality of movable electrodes, and bonded with the substrate, and a signal input portion. | 07-03-2014 |
20140253260 | HIGH-FREQUENCY SWITCH - A high-frequency switch configured to transmit differential signals including first and second signals, has first and second switches each comprising an input terminal configured to receive a signal and two output terminals configured to output the signal, and a substrate comprising a first surface mounted with the first and second switches. The input terminal is arranged between the two output terminals. The first and second switches are arranged on the substrate along a direction intersecting with a direction in which the input terminal and the two output terminals are placed side by side. One terminal of the first switch and one terminal of the second switch are placed side by side along the direction in which the first and second switches are arranged. | 09-11-2014 |
Yasuhiro Horimoto, Kusatsu JP
Patent application number | Description | Published |
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20140045290 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING MICROPHONE - A method for manufacturing a semiconductor device is provided, the method comprising: fabricating a semiconductor element on a semiconductor substrate; joining a surface of the semiconductor substrate to a support member, the surface being on a side where the semiconductor element is fabricated; and polishing a surface on an opposite side of the surface of the semiconductor substrate where the semiconductor element is fabricated and reducing a thickness of the semiconductor substrate, in a state where the semiconductor substrate and the support member are joined. | 02-13-2014 |
Yasuhiro Horimoto, Kyoto JP
Patent application number | Description | Published |
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20090181489 | MICROPHONE MANUFACTURING METHOD - A sacrifice layer | 07-16-2009 |
20100038734 | VIBRATION SENSOR AND METHOD FOR MANUFACTURING THE VIBRATION SENSOR - A method for manufacturing a vibration sensor including forming a sacrifice layer at one part of a front surface of a semiconductor substrate of monocrystalline silicon with a material isotropically etched by an etchant for etching the semiconductor substrate, forming a thin film protective film with a material having resistance to the etchant on the sacrifice layer and the front surface of the semiconductor substrate at a periphery of the sacrifice layer, forming a thin film of monocrystalline silicon, polycrystalline silicon, or amorphous silicon on an upper side of the sacrifice layer, opening a backside etching window in a back surface protective film having resistance to the etchant for etching the semiconductor substrate formed on a back surface of the semiconductor substrate, forming a through-hole in the semiconductor substrate by etching the semiconductor substrate anisotropically by using crystal-oriented etching by applying the etchant from the back surface window, then etching the sacrifice layer isotropically by the etchant after the etchant reaches the front surface of the semiconductor substrate, and then etching the semiconductor substrate anisotropically by using crystal-oriented etching from a front side by the etchant spread to a space formed after the sacrifice layer is removed, and forming a holder for supporting the thin film on an upper surface of the semiconductor substrate by removing the thin film protective film partially. | 02-18-2010 |
20150264463 | MICROPHONE - A microphone has a MEMS acoustic transducer having a frame-shaped support, and a membrane including a diaphragm as a movable electrode, covering an opening in the support, an integrated circuit that amplifies the output from the MEMS acoustic transducer, and a housing that houses the MEMS acoustic transducer and the integrated circuit. The housing includes a sound port bearing partition with a sound port formed therein. The MEMS acoustic transducer is secured in the housing with the membrane thereof facing the inner surface of the sound port bearing partition to form a closed space inward of the sound port bearing partition of the housing between the membrane and the sound port bearing partition. The closed space communicates with the outside via the sound port. | 09-17-2015 |
Yasuhiro Horimoto, Kusatsu-Shi JP
Patent application number | Description | Published |
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20130070942 | ACOUSTIC TRANSDUCER, AND MICROPHONE USING THE ACOUSTIC TRANSDUCER - An acoustic sensor includes: a semiconductor substrate; a vibrating membrane, formed above the semiconductor substrate, which includes a vibrating electrode; and a fixed membrane, formed on an upper surface of the semiconductor substrate, which includes a fixed electrode, the acoustic sensor detecting an acoustic wave according to a change in capacitance between the vibrating electrode and the fixed electrode. The fixed membrane has a plurality of sound hole portions formed therein in order to allow the acoustic wave to reach the vibrating membrane from outside, and the fixed electrode is formed so that a boundary of an edge portion of the fixed electrode does not intersect the sound hole portions. | 03-21-2013 |
20130343590 | MICROPHONE - Provided is a microphone capable of reducing a plane area seen from above, and further increasing a capacity of a back chamber of an acoustic sensor. An interposer | 12-26-2013 |
Yoshinari Horimoto, Osaka-Shi JP
Patent application number | Description | Published |
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20140029007 | NON-DESTRUCTIVE INSPECTION DEVICE FOR OXYGEN CONCENTRATION IN BAG-SHAPED CONTAINER - A laser emitting section | 01-30-2014 |