Patent application number | Description | Published |
20090091333 | STACKED SEMICONDUCTOR APPARATUS WITH CONFIGURABLE VERTICAL I/O - The present invention provides an apparatus including a stacked plurality of devices and a related method. The apparatus includes a stacked plurality of devices including a master device and at least one secondary device; a plurality of segments, each segment being associated with one of the stacked plurality of devices; and a plurality of N vertical connection paths traversing the stacked plurality of devices. The apparatus further includes a plurality of M vertical signal paths configured from the plurality of N vertical connections paths, wherein M is less than N, and at least one of the plurality of M vertical signal paths is a merged vertical signal path adaptively configured by the master device using at least one segment from each one of at least two of the plurality of N vertical connection paths. | 04-09-2009 |
20090115473 | LOOP FILTER, PHASE-LOCKED LOOP, AND METHOD OF OPERATING THE LOOP FILTER - A loop filter capable of controlling a charge sharing point in time, a phase locked loop, and a method of operating the loop filter are provided. The loop filter includes a duty control unit and a variable capacitor unit. The duty control unit generates a duty control clock signal of which an activation section is shorter than an inactivation section, by controlling a duty of an input clock signal. The variable capacitor unit is charged by an input current and has a capacitance that varies according to the duty control clock signal. The variable capacitor unit may include a switch, a first capacitor, and a second capacitor. The switch is turned on or off in response to the duty control clock signal. The first capacitor is serially connected to the switch and charged by the input current when the switch is turned on. The second capacitor is connected in parallel to the switch and the first capacitor and charged by the input current. | 05-07-2009 |
20100001379 | Multi-chip package (MCP) having three dimensional mesh-based power distribution network, and power distribution method of the MCP - A MCP includes a plurality of semiconductor memory devices, the plurality of semiconductor memory devices being stacked to define a three-dimensional (3D) structure, and a mesh structure, the mesh structure interconnecting the plurality of semiconductor memory devices to define a 3D mesh-based power distribution network. | 01-07-2010 |
20100020583 | Stacked memory module and system - A three dimensional memory module and system are formed with at least one slave chip stacked over a master chip. Through semiconductor vias (TSVs) are formed through at least one of the master and slave chips. The master chip includes a memory core for increased capacity of the memory module/system. In addition, capacity organizations of the three dimensional memory module/system resulting in efficient wiring is disclosed for forming multiple memory banks, multiple bank groups, and/or multiple ranks of the three dimensional memory module/system. | 01-28-2010 |
20100177572 | SEMICONDUCTOR DEVICE CAPABLE OF ADJUSTING PAGE SIZE - A semiconductor device includes a memory cell array comprising a plurality of banks and a page size controller. The page size controller decodes a part of a bank selection address or a power supply voltage and a remaining part of the bank selection address to enable one of the plurality of banks or enable two of the plurality of banks to set a page size of the semiconductor device. | 07-15-2010 |
20110248740 | STACKED SEMICONDUCTOR APPARATUS WITH CONFIGURABLE VERTICAL I/O - The present invention provides an apparatus including a stacked plurality of devices and a related method. The apparatus includes a stacked plurality of devices including a master device and at least one secondary device; a plurality of segments, each segment being associated with one of the stacked plurality of devices; and a plurality of N vertical connection paths traversing the stacked plurality of devices. The apparatus further includes a plurality of M vertical signal paths configured from the plurality of N vertical connections paths, wherein M is less than N, and at least one of the plurality of M vertical signal paths is a merged vertical signal path adaptively configured by the master device using at least one segment from each one of at least two of the plurality of N vertical connection paths. | 10-13-2011 |
20110310649 | Stacked Memory Module and System - A three dimensional memory module and system are formed with at least one slave chip stacked over a master chip. Through semiconductor vias (TSVs) are formed through at least one of the master and slave chips. The master chip includes a memory core for increased capacity of the memory module/system. In addition, capacity organizations of the three dimensional memory module/system resulting in efficient wiring is disclosed for forming multiple memory banks, multiple bank groups, and/or multiple ranks of the three dimensional memory module/system. | 12-22-2011 |
20120300528 | Stacked Memory Module and System - A three dimensional memory module and system are formed with at least one slave chip stacked over a master chip. Through semiconductor vias (TSVs) are formed through at least one of the master and slave chips. The master chip includes a memory core for increased capacity of the memory module/system. In addition, capacity organizations of the three dimensional memory module/system resulting in efficient wiring is disclosed for forming multiple memory banks, multiple bank groups, and/or multiple ranks of the three dimensional memory module/system. | 11-29-2012 |
20150088456 | APPARATUS AND METHOD FOR EXTRACTING FEATURE POINT FOR RECOGNIZING OBSTACLE USING LASER SCANNER - An apparatus and method for extracting a feature point to recognize an obstacle using a laser scanner are provided. The apparatus includes a laser scanner that is installed at a front of a traveling vehicle and is configured to obtain laser scanner data having a plurality of layers in real time. In addition, a controller is configured to separate the laser scanner data obtained by the laser scanner into a plurality of layers to extract measurement data present in each layer and determine feature points of the measurement data to classify a type of obstacle based on a plurality of stored feature points. | 03-26-2015 |