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Hongo, Tokyo

Akihisa Hongo, Tokyo JP

Patent application number	Description	Published
20090026068	Revolution member supporting apparatus and semiconductor substrate processing apparatus - A revolution member supporting apparatus holds and rotates a disc-shaped object (object to be rotated) such as a semiconductor wafer. The revolution member supporting apparatus includes a rotatable member which rotates about an axis of rotation, and a plurality of holding members which are disposed along a circle having a center corresponding to the axis of rotation of the rotatable member. The holding members revolve around the axis of rotation when the rotatable member rotates and are allowed to swing about their own central axes.	01-29-2009
20090117828	Polishing apparatus and substrate processing apparatus - The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing (	05-07-2009
20100136886	POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS - The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.	06-03-2010

Hiroo Hongo, Tokyo JP

Patent application number	Description	Published
20100111505	DISPLAY ELEMENT AND FIELD-EFFECT TYPE TRANSISTOR - A field-effect type transistor has: a source electrode; a drain electrode being a metal electrode; a semiconductor layer provided to be in contact with both of the source electrode and the drain electrode; and a gate electrode provided to face at least a part of the semiconductor layer. The gate electrode has: a first gate electrode; and a second gate electrode provided closer to the drain electrode than the first gate electrode is. The second gate electrode is so connected as to have a same potential as the drain electrode and is electrically isolated from the first gate electrode. Consequently, in a display device, the off-leakage current is suppressed, and reduction in a pixel area and a bus interconnection width is suppressed.	05-06-2010
20100140588	CATALYST SUPPORT SUBSTRATE, METHOD FOR GROWING CARBON NANOTUBES USING THE SAME, AND TRANSISTOR USING CARBON NANOTUBES - A catalyst supporting substrate includes a first region (	06-10-2010

Naoki Hongo, Tokyo JP

Patent application number	Description	Published
20080197925	Distortion Compensation Amplifying Apparatus - In an amplifying apparatus performing distortion compensation by imparting pre-distortion, a table for distortion compensation is efficiently updated for improving the accuracy of distortion compensation even when the frequency of occurrences of levels near a peak of an input signal is low. Compensation values in a distortion compensation table	08-21-2008
20090115513	Predistorter - The invention aims to converge predistortion coefficients efficiently in a predistorter adapted to compensate for distortion generated in an amplifier. Level detection means (	05-07-2009
20090160550	PREDISTORTER - A predistorter for correcting distortion caused by a memory effect in amplifying a signal by an amplifier is provided. In the memory PD	06-25-2009
20090189692	PREDISTORTER - A predistorter for correcting distortion caused by a memory effect in amplifying a signal by an amplifier is provided. In the memory PD	07-30-2009
20090231032	LINC amplifying device - An amplifying apparatus includes a splitting unit for splitting an input signal into a first split signal and a second split signal; phase-shifting unit for phase-shifting the first split signal and the second split signal, respectively; a first amplifying unit for amplifying a first phase-shifted signal and outputting the signal as a first output signal; a second amplifying unit for amplifying, in a substantially identical manner to the first amplifying unit, a second phase-shifted signal and outputting the signal as a second output signal; and a matching unit for matching the first output signal and the second output signal to a first transmission unit and a second transmission unit, respectively. The first transmission unit is for transmitting the first output signal from the matching unit to a load resistor, and the second transmission unit is for transmitting the second output signal from the matching unit to the load resistor.	09-17-2009
20110163806	DISTORTION COMPENSATION AMPLIFICATION DEVICE - It is intended to increase the efficiency of a distortion compensation amplification device having a pre-distorter	07-07-2011

Sadato Hongo, Tokyo JP

Patent application number	Description	Published
20100121490	BASE SEQUENCE DETECTION APPARATUS AND BASE SEQUENCE AUTOMATIC ANALYZING APPARATUS - A base sequence detection apparatus is provided with a channel formed on a base sequence detection chip. Working electrodes are formed along the channel and include a probe immobilized thereon, counter electrodes are formed on the inner surface of the channel and, reference electrodes are formed on the inner surface of the channel. An introduction port introduces solution or air from the upstream side of the channel, a delivery port delivers the solution or air in the channel, and the sample is injected into the channel through a sample injection port.	05-13-2010

Satoshi Hongo, Tokyo JP

Patent application number	Description	Published
20110217795	SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD - According to one embodiment, a first substrate and a second substrate are pressed from an opposite surface of a joint surface of the second substrate such that a joint surface of the first substrate and the joint surface of the second substrate are in contact with each other. The second substrate is restrained by a member to provide a gap between the joint surfaces. It is determined, based on a temporal change of a joint interface calculated based on an image imaged from the opposite surface side of the joint surface, whether joining is normally performed.	09-08-2011
20110233786	SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - According to an embodiment, a separation layer and a wiring layer having an organic insulating film formed of a resin material and a metal wiring are sequentially formed on a support substrate. Regions of the organic insulating film corresponding to dicing regions are removed. Plural semiconductor chips are mounted on the wiring layer. A sealing resin layer is formed on the separation layer. The sealing resin layer is formed to cover edge surfaces of the device forming regions. The support substrate is separated from a resin sealing body having the wiring layer, the plural semiconductor chips and the sealing resin layer. The resin sealing body is cut according to the dicing regions to cingulate a structure configuring a semiconductor device.	09-29-2011

Takeshi Hongo, Tokyo JP

Patent application number	Description	Published
20080298011	ELECTRONIC APPARATUS AND COOLING UNIT - According to one embodiment, an electronic apparatus includes a first heat receiving plate opposed to one side of a circuit board and an exothermic component mounted on the circuit board, and thermally connected to the exothermic component, a second heat receiving plate opposed to another side of the circuit board, and a heat transfer member provided with a heat receiving end portion thermally connected to at least one of the first and second heat receiving plates. The first and second heat receiving plates each extend to a region outside the circuit board, and are joined to each other in the region outside the circuit board so as to be thermally connected to each other. The heat receiving end portion of the heat transfer member is located in a line to the circuit board along a direction parallel with a surface of the circuit board.	12-04-2008
20090056911	ELECTRONIC APPARATUS - An electronic apparatus includes: a circuit board that is mounted with a first heat generating component and a second heat generating component that generate heat; and a circulation-type heat pipe that circulates a coolant, the heat pipe including: a first heat reception part that receives heat from the first heat generating component, the first heat reception part being provided with a wick for evaporating the coolant to serve as an evaporation part; a second heat reception part that receives heat from the second heat generating component and circulates the coolant to the first heat reception part; and a condensation part that condenses the coolant circulated from the first heat reception part, the condensation part being provided between the first heat reception part and the second heat reception part.	03-05-2009
20100198363	DISTRIBUTED CONTROL SYSTEM - There is provided a distributed control system including a plurality of field controllers which are connected through a control network. Each of the field controllers includes: a control clock that defines a control timing of the field controller; and an adjustment unit that adjusts a control time of the control clock depending on a network time obtained through the control network.	08-05-2010

Takuya Hongo, Tokyo JP

Patent application number	Description	Published
20090246565	FUEL CELL SYSTEM AND FUEL CELL CONTROL METHOD - A fuel cell system includes a membrane electrode assembly including an anode electrode, a cathode electrode, and an electrolyte membrane interposed between the anode electrode and the cathode electrode; a porous body in contact with the anode electrode; an anode passage plate in contact with the porous body, including a gas passage which collects a gas generated in the anode electrode and a fuel passage which supplies a fuel to the anode electrode; and a gas supply unit configured to supply a second gas to the gas passage.	10-01-2009
20090246590	FUEL CELL SYSTEM - A fuel cell system includes a membrane electrode assembly including an anode electrode, a cathode electrode opposed to the anode electrode, and an electrolyte membrane interposed between the anode electrode and the cathode electrode; a porous body in contact with the anode electrode; an anode passage plate in contact with the porous body, including a gas passage collecting a gas generated in the anode electrode and a fuel passage supplying a fuel to the anode electrode; a first seal portion sealing outer circumferences of the cathode electrode; and a second seal portion sealing outer circumferences of the anode electrode and made of a material having lower CO	10-01-2009

Tomoko Hongo, Tokyo JP

Patent application number	Description	Published
20120077963	METHOD FOR REMOVING VIRUSES FROM HIGH CONCENTRATION MONOCLONAL ANTIBODY SOLUTION - An object of the present invention is to provide a method for removing even small viruses from a high concentration monoclonal antibody solution using a membrane, and thus for recovering the antibody within a short time at high yield in the form of a filtrate. The present invention provides a method for producing a preparation containing a monoclonal antibody, which comprises a step of removing viruses by filtering viruses in a monoclonal antibody solution using a virus-removing membrane, wherein	03-29-2012

Yuki Hongo, Tokyo JP

Patent application number	Description	Published
20090291248	Coating composition, coating film, method of manufacturing coating film, and optical recording medium - A coating composition containing a solvent and a coating agent having an ionizing radiation-curable compound as a principal component thereof, wherein under the following condition for the concentration a (wt %) of the coating agent in the coating composition	11-26-2009