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| 20100213993 | Phase Locked Oscillator And Radar Unit Having The Same - An error detecting unit of a phase-locked oscillator evaluates difference between a reference phase error signal output from a phase detector and a phase error signal actually output from the phase detector when a reference frequency modulation signal is output from a voltage-controlled oscillator and further detects a frequency error of the frequency modulation signal from the voltage-controlled oscillator based on a rate of change of the difference. A correction unit of the phase-locked oscillator calculates an average value of the frequency error in a predetermined section of the frequency modulation signal and corrects center frequency of the frequency modulation signal by correcting the average value to be zero, and changes the rate of change of control voltage per control step based on comparison between at least two frequency errors in one cycle of the frequency modulation signal. Thus frequency shift of the frequency modulation signal is corrected. | 08-26-2010 |
| 20100264990 | AMPLIFYING CIRCUIT, AC SIGNAL AMPLIFYING CIRCUIT AND INPUT BIAS ADJUSTING METHOD - An amplifying circuit includes: an amplifying unit which amplifies an input signal and applies the amplified signal to a designated load; a current detection unit which detects a load current that flows into the designated load upon application of the amplified signal; an estimating unit which calculates, based on the voltage level of the input signal, an estimated value of the load current to be supplied to the load; and an adjusting unit which adjusts an input bias, to be applied to the amplifying unit, in such a manner so as to reduce a difference value representing a difference between the estimated value and the load current detected by the current detection unit. | 10-21-2010 |
| 20100264992 | AMPLIFYING CIRCUIT AND AMPLIFYING METHOD - An amplifying circuit includes: a waveform modifying unit which changes the signal value in the second section in such a manner so as to reduce the difference between the signal strength of a DC component of the input signal and the limit value that limits the variation range of the signal value in the first section; a DC component removing unit which removes the DC component of the input signal after the input signal has been modified by the waveform modifying unit; and an amplifying unit which amplifies the input signal whose DC component has been removed. | 10-21-2010 |
| 20110115557 | AMPLIFYING APPARATUS - An amplifying apparatus includes an amplifier that amplifies a signal, using a voltage supplied; a power source unit that generates a first voltage and a second voltage having an amplitude greater than that of the first voltage; and a switching controller that, when the an envelope signal of the signal becomes current zero, switches between and supplies to the amplifier, the first voltage and the second voltage generated by the power source unit. | 05-19-2011 |
| 20110136450 | POWER CIRCUIT AND RADIO COMMUNICATION CIRCUIT USING SAME AND METHOD OF OPERATING A CIRCUIT - A power circuit and method thereof are provided. The power circuit includes an output circuit having an alternating current-coupling element and that supplies an output signal of the output circuit to an amplifier as a driving voltage. The power circuit includes an envelope signal-extracting unit extracting an envelope signal from a carrier wave, a simulation signal-waveform generating unit generating a simulation signal including a fluctuation component occurring when the envelope signal is transmitted to the output circuit, a fluctuation component-extracting unit extracting the fluctuation component included in the simulation signal, and an inverted component-generating unit generating an inverted component obtained by performing phase inversion for the fluctuation component, where the fluctuation component occurring in the output circuit is canceled out through the inverted component. | 06-09-2011 |
| 20110221417 | POWER SUPPLY APPARATUS AND POWER SUPPLY CONTROL METHOD - A power supply apparatus includes a detector configured to detect a peak of a transmission signal, a determination unit configured to determine a timing when a change of a variable voltage which is output from the apparatus and which corresponds to the detected peak of the transmission signal is started in accordance with a voltage value corresponding to the peak and a change rate of the variable voltage, a generation unit configured to generate a variable voltage control signal used to start the change of the voltage at the determined timing, and an output unit configured to output a voltage in accordance with the generated variable voltage control signal. | 09-15-2011 |
| 20120154035 | AMPLIFYING DEVICE - An amplifying device which amplifies a signal, includes: an amplifier which amplifies an input signal by a power supplied from a power node; a first power source which supplies a fixed voltage to the power node; a second power source which supplies a variable voltage to the power node based on an envelope signal relating to the input signal and voltage of the power node; an active short device which reduces impedance of the power node when the first power source supplies the power to the power node and the second power source does not supply the power to the power node; a synthesizer which synthesizes the envelope signal and a cancel signal so that the second power source does not supply the power to the power node according to voltage variation of the power node by the active short device. | 06-21-2012 |
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| 20100157746 | RECORDING/REPRODUCING APPARATUS AND RECORDING/REPRODUCING SYSTEM - A recording/reproducing apparatus includes an optical source and a near-field light generating unit. The near-field light generating unit includes two conductors facing to each other at a predetermined distance and generating near-field light between the two conductors by irradiation of light from the optical source. These two conductors are arranged so that a direction along which the two conductors face to each other is substantially in parallel with the longitudinal direction of a recording mark region. Here, the recording mark region is prepared from a predetermined recording material and having shape anisotropy when information is recorded on a recording medium on which the recording mark is independently formed. | 06-24-2010 |
| 20100157747 | RECORDING/REPRODUCTION APPARATUS AND RECORDING/REPRODUCTION SYSTEM - A recording/reproduction apparatus includes: a light source; and a near-field light production section that includes two conductor sections disposed opposite each other with a predetermined gap therebetween and that produces near-field light between the two conductor sections upon light irradiation from the light source, the two conductor sections being disposed such that when information is recorded on a recording medium using the near-field light, a direction from one of the two conductor sections to the other of the two conductor sections is generally perpendicular to a line direction of the recording medium. | 06-24-2010 |
| 20110013251 | OPTICAL DEVICE AND OPTICAL APPARATUS - An optical device includes: a base that transmits incident light; and a first conductive film formed on one surface of the base, and that includes an indentation pattern of a predetermined period formed on a base-side surface, wherein a side portion defining an edge portion irradiated with the incident light has a form of a protrusion or a straight line as viewed from the incident side of the incident light. | 01-20-2011 |
| 20120154816 | Imaging apparatus, electronic apparatus, photovoltaic cell, and method of manufacturing imaging apparatus - An imaging apparatus includes: an imaging unit in which a plurality of pixels receiving incidence light on a light receiving face are disposed in an imaging region of a substrate, wherein the pixel includes a thermocouple device group in which a plurality of thermocouples are aligned along the light receiving face, wherein, in the thermocouple device group, the plurality of thermocouples are arranged so as to be separated from each other such that the light receiving face has a grating structure, and wherein the thermocouple device group is disposed such that the incidence light is incident to the grating structure so as to cause plasmon resonance to occur on the light receiving face, and an electromotive force is generated due to a change in the temperature of a portion of the thermocouple device group, at which the plasmon resonance occurs, in each of the plurality of thermocouples. | 06-21-2012 |
| 20120250485 | RECORDING/REPRODUCING APPARATUS AND RECORDING/PRODUCING SYSTEM - A recording/reproducing apparatus includes an optical source and a near-field light generating unit. The near-field light generating unit includes two conductors facing to each other at a predetermined distance and generating near-field light between the two conductors by irradiation of light from the optical source. These two conductors are arranged so that a direction along which the two conductors face to each other is substantially in parallel with the longitudinal direction of a recording mark region. Here, the recording mark region is prepared from a predetermined recording material and having shape anisotropy when information is recorded on a recording medium on which the recording mark is independently formed. | 10-04-2012 |
| 20120257489 | RECORDING/REPRODUCING APPARATUS AND RECORDING/PRODUCING SYSTEM - A recording/reproducing apparatus includes an optical source and a near-field light generating unit. The near-field light generating unit includes two conductors facing to each other at a predetermined distance and generating near-field light between the two conductors by irradiation of light from the optical source. These two conductors are arranged so that a direction along which the two conductors face to each other is substantially in parallel with the longitudinal direction of a recording mark region. Here, the recording mark region is prepared from a predetermined recording material and having shape anisotropy when information is recorded on a recording medium on which the recording mark is independently formed. | 10-11-2012 |
| 20130028280 | SEMICONDUCTOR LASER ELEMENT AND MANUFACTURING METHOD OF THE SAME - Disclosed herein is a semiconductor laser element including: on a substrate, a laser structure section configured to include a semiconductor laminated structure having an n-type semiconductor layer, active layer and p-type semiconductor layer in this order, and a p-side electrode on top of the p-type semiconductor layer; a pair of resonator edges provided on two opposed lateral sides of the semiconductor laminated structure; and films made of a non-metallic material having a thermal conductivity higher than that of surrounding gas, and provided in the region of the top side of the laser structure section including the positions of the resonator edges. | 01-31-2013 |
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| 20100113108 | ELECTRONIC DEVICE - An electronic device includes an outer case having a sound hole, an acoustic unit included in the outer case in a position corresponding to a position of the sound hole, a sheet member provided between the acoustic unit and the outer case in a position corresponding to the position of the sound hole, and placed over the acoustic unit to cover an outside of an outer edge of the acoustic unit, a mounting portion circumferentially provided on an outer peripheral portion of the sheet member and mounted to the outer case, and an extension portion that extends the mounting portion toward an inner periphery thereof on a side of the sheet member facing the acoustic unit and to which the acoustic unit is mounted. | 05-06-2010 |
| 20110075022 | IMAGING DEVICE, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF MANUFACTURING IMAGING DEVICE - An imaging device includes an imaging unit, and a panel facing the imaging unit. The panel includes a panel body that has an anti-reflection-coated surface treated with anti-reflection coating and has a portion thereof overlapping an angle of view of the imaging unit, a sheet that is provided on a portion of the anti-reflection-coated surface outside of the angle of view, and a resin layer that has a pattern and is provided on a side of the sheet near the imaging unit. | 03-31-2011 |
| 20110222300 | ILLUMINATION DEVICE, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF MANUFACTURING ILLUMINATION DEVICE - An illumination device is provided including a light emitter; and a panel. The panel includes a recess configured to accept an optically transparent sealant that is illuminated by light from the light emitter. Moreover, the panel includes a hole in the recess that is sealed by the optically transparent sealant. | 09-15-2011 |
| 20120055838 | WATER-RESISTANT COVER AND ELECTRONIC DEVICE - A water-resistant cover placed on an electronic device in an attachable/removable manner, and for the water-resistant cover and the circumference of a water-resistant area of the electronic device, a sealing member is provided on the whole circumference in the circumference direction of the water-resistant area on one side, and a contact plane facing the sealing member is formed on the same plane on another side, and the water-resistant cover slides and put on the electronic device in the state in which the sealing member contacts the contact plane and pressed. | 03-08-2012 |
| 20120063074 | MOBILE TERMINAL DEVICE - A mobile terminal device includes a case that forms a storage space for storing a component and that includes an open section at a first surface, a display module that is stored in the open section of the case and that includes a display surface for allowing information to be displayed thereon adjacent to the first surface, a plate that is fixed to an inner surface of the case and that partitions the storage space into a space for storing the display module and a space for storing a component other than the display module, a panel that covers the open section of the case and that supports the display module such that the display module is sandwiched between the panel and the plate, and an adhesive that adheres the panel and a surrounding region of the open section of the case. | 03-15-2012 |
| 20120063075 | EXTERNAL COMPONENT AND PORTABLE ELECTRONIC DEVICE - An external component attachable to a portable electronic device includes a curved surface attachable to a convex surface of the portable electronic device and attaching portions formed at both ends of the curved surface and fixable to the portable electronic device. The curved surface curves such that the width between the attaching portions is narrower than the width between fixing portions of the portable electronic device to which the attaching portions are fixable. | 03-15-2012 |
| 20120071204 | MOBILE TERMINAL DEVICE AND SENSOR MODULE - A mobile terminal device includes a face panel provided on an exterior of a housing, a sensor module that detects that the face panel is touched, where the sensor module is provided on a more inward side of the housing than the face panel, a light-emitting unit provided with a light-emitting member that emits light when the sensor module detects that the face panel is touched, where the light-emitting unit is provided on a more inward side of the housing than the sensor module, and a connection unit that makes an electrical connection between the sensor module and the light-emitting unit. | 03-22-2012 |
| 20120129582 | MOBILE TERMINAL APPARATUS - The mobile terminal apparatus of the present invention includes a housing having an opening section in which an accommodated object is fitted; a lid covering the opening section, the lid having a protrusion which surrounds the opening section and shields the accommodated object from water, on a surface facing the accommodated object; and a cover covering the lid, the cover being attached to the housing to press the lid onto the housing. When the cover is attached to the housing, the protrusion of the lid surrounds the opening section and is pressed onto the housing by the cover, so that the accommodated object can be reliably shielded from water. | 05-24-2012 |
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| 20100181105 | PACKAGE FOR ELECTRON ELEMENT AND ELECTRONIC COMPONENT - A package for an electron element comprises: a base substrate made of ceramic; a frame body made of ceramic arranged on a top surface of the base substrate and provided therein with a cavity for accommodating the electron element; a via formed in the base substrate below the cavity, penetrating the base substrate from the top surface to a bottom surface thereof and filled with a thermally-conductive material; and a projecting part formed on an inner wall of the via and projecting toward a center of the via. The projecting part has a length along a direction perpendicular to a penetration direction of the via not less than a thickness along the penetration direction. An electronic component comprises the package and the electron element mounted thereon. The electron element is accommodated in the cavity defined inside the frame body of the package and arranged above the via. | 07-22-2010 |
| 20100182791 | PACKAGE FOR LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE - In a package for a light emitting element according to the present invention, a light reflecting plate is buried in a base substrate at a position below a cavity with a light reflecting surface thereof facing upward, a part of the ceramic forming the base substrate is interposed between the light reflecting surface of the light reflecting plate and a top surface of the base substrate, and at least the part is light-transmitting. A light emitting device comprises the package, and the light emitting element accommodated in the cavity of the package. In another light emitting device, a first reflector which is made of a metal material and reflects a light emitted from the light emitting element is buried in a frame body. | 07-22-2010 |
| 20100213811 | PACKAGE FOR LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING SAME - The package for a light emitting element according to the present invention comprises a base substrate made of ceramic including glass, and a frame body made of ceramic. The frame body is arranged on a top surface of the base substrate and provided therein with a cavity for accommodating the light emitting element. A part of the glass included in the base substrate is precipitated in an area of the top surface of the base substrate, which is a bottom surface of the cavity, and a crystallinity degree of the precipitated glass is greater than 3%. In the manufacturing method of the package according to the present invention, a ceramic body which is to be the package is fired at a temperature of 840 degrees C. or higher and lower than 950 degrees C. | 08-26-2010 |
| 20100246135 | ELECTRONIC DEVICE - An electronic device of the present invention includes: a base made of a ceramic material; an electronic device element arranged in a central area of the upper surface of the base, in a way that the electronic device element is placed on a first heat transfer layer; a first heat dissipation layer formed in a central area of the lower surface of the base; a plurality of thermal vias arranged in the base, and which connects the first heat transfer layer and the first heat dissipation layer; and a second heat transfer layer buried in the base, the second heat transfer layer crossing the plurality of thermal vias, while extending from a position above a central area of the lower surface of the base to a position above a peripheral area of the lower surface of the base. | 09-30-2010 |
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| 20110304003 | SEMICONDUCTOR DEVICE, CAMERA MODULE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - According to the embodiments, a semiconductor substrate, an active layer that is formed on one surface of the semiconductor substrate, a wiring layer that is formed on the active layer and includes a wire to be a convex portion on a surface that is not in contact with the active layer, a insulation layer that is formed on the wiring layer to have a concave portion, an embedded layer that is provided on the concave portion of the insulation layer, a bonding layer that is provided on the insulation layer and the embedded layer, and a substrate that is bonded to the bonding layer to face one surface of the semiconductor substrate are included. | 12-15-2011 |
| 20120068290 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND CAMERA MODULE - According to one embodiment, an insulation film is formed over the surface, backside, and sides of a first substrate. Next, the insulation film formed over the surface of the first substrate is removed. Then, a joining layer is formed over the surface of the first substrate, from which the insulation film has been removed. Subsequently, the first substrate is bonded to a second substrate via a joining layer. | 03-22-2012 |
| 20120190138 | SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR SUBSTRATE BONDING METHOD - According to one embodiment, semiconductor manufacturing apparatus includes a first member that holds a first semiconductor substrate; a second member that holds a second semiconductor substrate in a state where a bonding surface of the second semiconductor substrate faces a bonding surface of the first semiconductor substrate; a distance detecting unit that detects a distance between the bonding surface of the first semiconductor substrate and the bonding surface of the second semiconductor substrate; an adjusting unit that adjusts the distance between the bonding surface of the first semiconductor substrate and the bonding surface of the second semiconductor substrate to a predetermined value by moving at least one of the first and second members based on a detection result of the distance detecting unit; and a third member that forms the bonding start point between the first semiconductor substrate and the second semiconductor substrate. | 07-26-2012 |
| 20120217600 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A manufacturing method of a semiconductor device according to embodiments includes forming a photodiode layer, which is an active region including a photodiode, on a main surface of a first substrate, forming a wiring layer, which includes a wire and a dielectric layer covering the wire, on the photodiode layer, and forming a dielectric film on the wiring layer. The manufacturing method of the semiconductor device according to the embodiments further includes bonding a second substrate to the dielectric film of the first substrate so that a crystal orientation of the photodiode layer matches a crystal orientation of the second substrate. | 08-30-2012 |
| 20120329241 | SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD - According to one embodiment, a semiconductor manufacturing apparatus is provided. The semiconductor manufacturing apparatus includes a stage, a substrate supporter, first and second pushers, and a controller. The stage is configured to support outer periphery portions of the first semiconductor substrate from below. The substrate supporter is configured to hold the back of the second semiconductor substrate. The first and second pushers are configured to bring the first and second semiconductor substrates in contact. The controller is configured to form the bonding initiation point between the first and second semiconductor substrates. | 12-27-2012 |
