Patent application number | Description | Published |
20090126174 | METHOD OF MANUFACTURING MULTI-LAYER CERAMIC CONDENSER - There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser. | 05-21-2009 |
20100101702 | METHOD OF MANUFACTURING MULTILAYER CERAMIC SUBSTRATE - Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets. | 04-29-2010 |
20100170708 | METHOD OF MANUFACTURING CAPACITOR-EMBEDDED LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE - A method of manufacturing a capacitor-embedded low temperature co-fired ceramic substrate. A capacitor part is manufactured by firing a deposition including at least one high dielectric ceramic sheet to form a capacitor part. A plurality of low temperature co-fired green sheets are provided. Each of the low temperature co-fired green sheet has at least one of a conductive pattern and a conductive via hole thereon. A low temperature co-fired ceramic deposition is formed by depositing the low temperature co-fired green sheets to embed the capacitor part in the low temperature co-fired ceramic deposition. The embedded capacitor part is connected either to the conductive pattern or the conductive via hole of an adjacent green sheet. Then the low temperature co-fired ceramic deposition having the capacitor part embedded therein is fired. | 07-08-2010 |
20110168439 | MULTILAYER CERAMIC CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - There is provided a method of manufacturing a multilayer ceramic circuit board. A multilayer ceramic circuit board according to an aspect of the invention may include: preparing a plurality of ceramic green sheets; forming a recess having a desired line shape and a via hole connected to the recess in at least one of the plurality of ceramic green sheets; forming a conductive via by filling the via hole with a conductive material; forming a circuit line connected to the conductive via by filling the recess with a conductive material; stacking the plurality of ceramic green sheets upon one another to thereby form a ceramic green sheet stack; and sintering the ceramic green sheet stack. | 07-14-2011 |
Patent application number | Description | Published |
20090283792 | SIDE VIEW LIGHT EMITTING DIODE PACKAGE - A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall. | 11-19-2009 |
20090321779 | SIDE VIEW LIGHT EMITTING DIODE PACKAGE - A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall. | 12-31-2009 |
Patent application number | Description | Published |
20120297851 | METHOD AND APPARATUS FOR MANUFACTURING PANELS FOR VEHICLES - Disclosed herein is a method and apparatus for manufacturing a panel for a vehicle. When a steel sheet is machined to form a panel for a vehicle, a blanking-texturing machine conducts a blanking process for cutting the steel sheet and a texturing process for forming depressions in the steel sheet at the same time. Therefore, the present invention reduces the number of manufacturing processes, thus enhancing the productivity, and reducing the production cost and provides a steel sheet with uniform depressions across the surface of the steel sheet, thereby reducing the coefficient of friction during the pressing process consistently. | 11-29-2012 |
20130122315 | COATING LAYER WITH LOW-FRICTION FOR VEHICLE COMPONENT AND METHOD FOR PRODUCING THE SAME - The present invention provides a low-friction coating layer for vehicle components comprising: a Ti layer on a surface of a base material; a TiN layer on the Ti layer surface; a TiAgN layer on the TiN layer surface; and an Ag layer transferred on the TiAgN layer surface, and a method for producing the same. | 05-16-2013 |
20130136896 | METHOD FOR PRODUCING COATING LAYER WITH LOW-FRICTION - In a method for producing a coating layer using plasma which includes heating, buffer layer coating, coating and cooling, a method for producing a coating layer with low-friction comprises: a coating step of forming TiAgN coating layer on the surface of a base material using Ti arc source and Ag sputtering source at a certain coating temperature; a fraction increase step of increasing the Ag fraction on the surface by increasing bias voltage and sputtering power for a certain time period; and a nano-forming step of forming Ag nanoparticles on the surface by maintaining the temperature at 50˜100° C. higher than the certain coating temperature for a certain time period. | 05-30-2013 |
20130202811 | SURFACE TREATMENT METHOD FOR COATING LAYER - Disclosed is a surface treatment method for producing a coating layer, which improves surface properties (e.g., low friction wear-resistance) of the coating layer at high temperature. The surface treatment method controls a process pressure during the formation of a coating layer to form a fine surface morphology with increased silver (Ag) content. The surface treatment method includes: heating a coated material in a chamber; removing foreign substances from the surface of the heated, coated material; forming a buffer layer on the surface of the coated material; and forming a coating layer on the buffer layer, wherein the process pressure is controlled during the formation of the coating layer to improve the surface properties at high temperatures. | 08-08-2013 |
20140065394 | MULTI-LAYER COATING AND METHOD FOR FORMING THE SAME - Disclosed is a multi-layer coating formed by repeatedly and sequentially laminating first coating layers composed of TiN and second coating layers composed of TiAgN on a surface, and a method of forming the same. | 03-06-2014 |
20140170051 | TiAgN COATING LAYER, TiAgN COATING METHOD AND TiAgN COATING APPARATUS - Disclosed is a TiAgN coating layer, formed by subjecting a substrate having a surface roughness of about 0.05˜0.1 μm to plasma coating by periodically turning on/off an Ag source while a Ti source is continuously turned on in a nitrogen gas atmosphere, a TiAgN coating method, and a TiAgN coating apparatus. | 06-19-2014 |
20140170053 | LOW FRICTION COATING LAYER, LOW FRICTION COATING METHOD AND LOW FRICTION COATING APPARATUS - Disclosed herein is a low friction coating layer wherein the uniform concentration of a low friction metal in the coating layer is increased by increasing a turning-on power of a low friction metal source to be higher than a turning-off power thereof, decreasing a turning-on power of a Ti source to be lower than a turning-off power thereof. Alternatively the concentration is increased by increasing a flow rate or temperature of a nitrogen atmosphere gas upon introduction to be higher than upon termination of the introduction thereof. | 06-19-2014 |
20140170441 | TiAgN COATING LAYER, TiAgN COATING METHOD AND TiAgN COATING APPARATUS - Disclosed is a TiAgN coating layer, which is coated by plasma coating method using nitrogen gas, a Ti source and a Ag source, the coating layer comprising Ag in the coating layer at an amount of about 15 at % or more, a TiAgN coating method, and a TiAgN coating apparatus therefor. | 06-19-2014 |
20150021165 | COATING LAYER WITH LOW-FRICTION FOR VEHICLE COMPONENT AND METHOD FOR PRODUCING THE SAME - The present invention provides a low-friction coating layer for vehicle components comprising: a Ti layer on a surface of a base material; a TiN layer on the Ti layer surface; a TiAgN layer on the TiN layer surface; and an Ag layer transferred on the TiAgN layer surface, and a method for producing the same. | 01-22-2015 |