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Hong, Suwon
Jee Hun Hong, Suwon KR
| Patent application number | Description | Published |
|---|---|---|
| 20120129281 | RESIN DISPENSING APPARATUS FOR LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE USING THE SAME - There is provided a resin dispensing apparatus for a light emitting device package and a method of manufacturing a light emitting device package using the same. The resin dispensing apparatus includes a resin dispensing part including a resin storage portion filled with a resin therein and a resin discharge portion combined with the resin storage portion and discharging the resin therefrom; a supporting part having a light emitting device package disposed on an upper surface thereof and electrically connected to the light emitting device package; a voltage applying part having both terminals respectively connected to the resin dispensing part and the supporting part to apply a voltage thereto; and a sensing part electrically connected to the resin dispensing part and the supporting part individually and sensing a contact between the resin dispensing part and the light emitting device package with an electrical signal. | 05-24-2012 |
Joung Sook Hong, Suwon KR
| Patent application number | Description | Published |
|---|---|---|
| 20110027510 | POLYAMIDE CLAY COMPOSITE COMPOSITION AND FUEL TRANSPORT TUBE USING THE SAME - A polyamide clay composite composition including (A) 100 parts by weight of a base resin containing (A-1) 30 to 99.9% by weight of a polyamide resin and (A-2) 0.1 to 70% by weight of a polyolefin resin, (B) 3 to 30 parts by weight of an olefin oligomer with respect to 100 parts by weight of the basin resin, and (C) 0.5 to 5 parts by weight of a layered clay compound, and a fuel transport tube prepared using the same are provided. | 02-03-2011 |
| 20110027512 | CONDUCTIVE POLYAMIDE COMPOSITE COMPOSITION AND FUEL TRANSPORT TUBE USING THE SAME - A conductive polyamide composite composition including (A) 100 parts by weight of a base resin containing (A-1) 50 to 99% by weight of a polyamide resin and (A-2) 1 to 50% by weight of a polyolefin resin, (B) 0.1 to 20 parts by weight of an olefin-copolymer with respect to 100 parts by weight of the base resin, (C) 1 to 15 parts by weight of a carbon black, (D) 0.01 to 5 parts by weight of carbon nanotubes, (E) 0.01 to 10 parts by weight of a plasticizer, and (F) 0.01 to 2 parts by weight of a resin stabilize, and a fuel transport tube prepared using the same are provided. | 02-03-2011 |
Jung Taek Hong, Suwon KR
| Patent application number | Description | Published |
|---|---|---|
| 20110278962 | LINEAR VIBRATOR - There is provided a linear vibrator including: a housing having an internal space formed therein; a magnetic field unit including a yoke disposed in the internal space and a magnet mounted on one surface of the yoke, and interacting with a coil to which power is applied to thereby generate vibrations in the internal space; an elastic member configured of a housing fixing part fixed to an inner surface of the housing, a yoke fixing part surface-contacting the other surface of the yoke, and a plurality of connecting strip parts disposed such that an elastic space is formed between the housing fixing part and the yoke fixing part; and a clearance part formed between the yoke and the yoke fixing part, and preventing the connecting strip parts from contacting the yoke during the vibrations of the magnetic field unit. | 11-17-2011 |
Ju Pyo Hong, Suwon KR
| Patent application number | Description | Published |
|---|---|---|
| 20080290479 | Wafer level device package with sealing line having electroconductive pattern and method of packaging the same - Provided are wafer level package with a sealing line that seals a device and includes electroconductive patterns as an electrical connection structure for the device, and a method of packaging the same. In the wafer level package, a device substrate includes a device region, where a device is mounted, on the top surface. A sealing line includes a plurality of non-electroconductive patterns and a plurality of electroconductive patterns, and seals the device region. A cap substrate includes a plurality of vias respectively connected to the electroconductive patterns and is attached to the device substrate by the sealing line. Therefore, a simplified wafer level package structure that accomplishes electric connection through electroconductive patterns of a sealing line can be formed without providing an electrode pad for electric connection with a device. | 11-27-2008 |
| 20090085134 | Wafer-level image sensor module, method of manufacturing the same, and camera module - Provided is a wafer-level image sensor module including a wafer; an image sensor mounted on the wafer; a transparent member installed above the top surface of the wafer so as to seal the image sensor; a plurality of vias formed in the wafer so as to be positioned outside the transparent member; a plurality of upper pads formed on the upper ends of the respective vias; an encapsulation portion formed on the top surface of the wafer so as to be positioned outside the transparent member; and a plurality of external connection members that are electrically connected to the lower ends of the respective vias. | 04-02-2009 |
| 20110012220 | Wafer-level image sensor module, method of manufacturing the same and camera module - A wafer-level image sensor module including: a wafer having an image sensor and a plurality of upper pads provided thereon, the wafer having an inclined surface on either side thereof; a transparent member installed above the top surface of the wafer so as to seal the image sensor; a plurality of lead portions having one ends connected to the respective upper pads, the lead portions being formed to extend to the bottom surface of the wafer along the inclined surface of the wafer; an encapsulation portion formed on the top surface of the wafer so as to be positioned outside the transparent member; and a plurality of external connection members that are electrically connected to the other ends of the respective lead portions | 01-20-2011 |
| 20110198749 | Semiconductor chip package and method of manufacturing the same - Provided are a semiconductor chip package and a method of manufacturing the same. The semiconductor chip package includes a semiconductor chip comprising a chip pad, and a rerouting layer disposed on the semiconductor chip and including a metal interconnection electrically connected to the chip pad and a partial oxidation region formed by the oxidation of metal and insulating the metal interconnection. | 08-18-2011 |
Ki Pyo Hong, Suwon KR
| Patent application number | Description | Published |
|---|---|---|
| 20120018193 | Multi layer circuit board and method of manufacturing the same - There are provided a multi layer circuit board and a method of manufacturing the same. The multi layer circuit board includes each of ceramic boards having wiring patterns formed and stacked thereon; and via electrodes connecting in series the wiring patterns formed in the each of the ceramic boards, wherein one of the via electrodes is formed as a via group including a plurality of via units which connect in parallel one catch pad formed on one ceramic board and another catch pad formed on ceramic boards adjacent to the one ceramic board. Since the ceramic boards are connected through the plurality of via units, the reliability of the electrical connectivity of the via electrode may be improved, and the formation of a void and the protrusion of the via electrode may be prevented. | 01-26-2012 |
| 20120037408 | METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME - There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof. | 02-16-2012 |
| 20120040125 | METHOD FOR MANUFACTURING CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE USING THE SAME - A method for manufacturing a ceramic substrate, and a ceramic substrate using the same are disclosed. The method for manufacturing a ceramic substrate includes: forming a first adhesive layer on a blister formed on a substrate; filling the blister having the first adhesive layer formed thereon with a filler; and hardening the ceramic substrate. A blister formed on the ceramic substrate can be removed to make the substrate have a smooth surface, thus improving reliability. | 02-16-2012 |
Suk Youn Hong, Suwon KR
| Patent application number | Description | Published |
|---|---|---|
| 20100330717 | SEMICONDUCTOR LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - A high-efficiency semiconductor light emitting diode and a method for manufacturing the same are provided. The semiconductor LED has high internal quantum efficiency and can reduce the bad effect caused by the crystal defect. In the semiconductor light emitting diode, a conductive substrate has a three-dimensional top surface, and a light-emitting stack structure has a three-dimensional structure and includes an n-type nitride semiconductor layer, an active layer, and a p-type nitride semiconductor layer, which are sequentially formed on the conductive substrate. A p-electrode is formed on the p-type nitride semiconductor layer, and an n-electrode is formed on a bottom surface of the conductive substrate. | 12-30-2010 |