| Patent application number | Description | Published |
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| 20080268764 | METHOD AND APPARATUS FOR A LOW IMPEDANCE ANTI-RECIRCULATION AIR MOVING INLET DEVICE - An inlet recirculation apparatus for an air moving device includes a housing defined by a wall extending from a base. The base includes an aperture therethrough receptive to alignment with an inlet of the air moving device. A plurality of flaps each pivotally extends radially outwardly from a center pivot to another corresponding pivot disposed around a perimeter of the wall. The center pivot is coaxial with a center of the aperture. Each flap moves to an open position due to air pressure from the air moving device causing air to flow into the inlet wherein each flap pivotally rotates about the center pivot and corresponding pivot at the wall, and moves to a closed position when air pressure from the air moving device ceases wherein a space between contiguous flaps is eliminated when each flap pivotally rotates to the closed position about the center pivot and corresponding pivot at the wall to prevent reverse airflow through the air moving device. | 10-30-2008 |
| 20090308033 | MODIFIED HEXAGONAL PERFORATED PATTERN - Described herein are various embodiments of a modified hexagonal perforated pattern and objects within which the pattern is formed. For example, according to one representative embodiment, an apparatus includes an object and a perforated pattern formed in the object. The perforated pattern includes a plurality of perforations through which matter is flowable. Each of the perforations includes a modified hexagonal shape including a hexagon having six rounded corners. | 12-17-2009 |
| 20100252234 | HIGH PERFORMANCE DUAL-IN-LINE MEMORY (DIMM) ARRAY LIQUID COOLING ASSEMBLY AND METHOD - A method and associated assembly for cooling electronic heat generating components of a computer including dual-in-line memory (DIMM) array(s) is provided. The assembly comprises a cooling component having a plate with a first and a second (reverse) side, thermally coupling to the heat generating components including the DIMM array(s). The first plate side has a coolant conduit connected at one end to a supply manifold via flexible tubing and at another end to a return manifold via another flexible tubing such that when coolant is supplied, the coolant circulates from the supply manifold to the return manifold by passing through said first plate's conduit. | 10-07-2010 |
| 20110137621 | Non-Iterative Mapping of Fan Noise Across a Hydraulic Plane - In embodiments of the present invention a method and computer program product is presented to map noise levels onto a fan's hydraulic operating plane. In another embodiment this methodology allows for the comparison of a first fan configuration to a second fan configuration to enable the selection of a particular fan configuration to be utilized in an electronic system. | 06-09-2011 |
| Patent application number | Description | Published |
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| 20090037152 | Mapping Fan Noise Across an Hydraulic Plane - A method and computer program product is presented to map noise levels onto the hydraulic operating plane. Application of this model has the potential to show which fan is quieter, where, and by how much. It is shown how the technique can be applied to a diverse set of comparisons including speed, diameter, type, model, and multiple fans in combination. | 02-05-2009 |
| 20090213541 | Cooling Plate Assembly with Fixed and Articulated Interfaces, and Method for Producing Same - A cooling plate assembly for transferring heat from electronic components mounted on a circuit board includes both fixed and articulated interfaces. A fixed-gap coldplate is positioned over and in thermal contact with (e.g., through an elastomerically compressive pad thermal interface material) electronic components mounted on the circuit board's top surface. An articulated coldplate is positioned over and in thermal contact with at least one electronic component mounted on the circuit board's top surface. In the preferred embodiments, the articulated coldplate is spring-loaded against one or more high power processor components having power dissipation greater than that of the electronic components under the fixed-gap cooling plate. Thermal dissipation channels in the coldplates are interconnected by flexible tubing, such as copper tubing with a free-expansion loop. In the preferred embodiments, the coldplates and the flexible tubing are connected to define a portion of a single flow loop used to circulate cooling fluid through the coldplates. | 08-27-2009 |
| 20090284928 | Enhancing the Cooling of Dual In-Line Memory Modules - An apparatus for enhancing the cooling of a dual in-line memory module (DIMM) includes a planar body having opposing surfaces, a top edge, a bottom edge, and opposing ends. An engagement flange is connected to the bottom edge of the body. A first clip leg is connected to the engagement flange. The first clip leg includes a tab arranged to engage one mounting latch recess of the DIMM. A second clip leg connected to the engagement flange. The second clip leg includes a tab arranged to engage the other mounting latch recess of the DIMM. | 11-19-2009 |
| 20100193175 | Heat Sink Apparatus with Extendable Pin Fins - An apparatus for cooling a heat-generating component is disclosed. The apparatus includes a cooling chamber containing a liquid metal. The cooling chamber has a heat-conducting wall thermally coupled to the heat-generating component. A plurality of extendable tubes making up an array of cooling pin fins is attached to the cooling chamber. Each of the extendable tubes has a port end that opens into the cooling chamber and a sealed end that projects away from the cooling chamber. Moreover, each of the extendable tubes has an extended position when filled with liquid metal from the cooling chamber and a retracted position when emptied of the liquid metal. A pump system is included for urging the liquid metal from the cooling chamber into the plurality of extendable tubes. | 08-05-2010 |
