| Patent application number | Description | Published |
|---|
| 20080318455 | BACKPLANE CONNECTOR WITH HIGH DENSITY BROADSIDE DIFFERENTIAL SIGNALING CONDUCTORS - Embodiments of the present invention address deficiencies of the art in respect to backplane connectivity and provide a backplane connector for high density broadside differential signaling. In an embodiment of the invention, a backplane connector can be provided. The backplane connector can include a signal header assembly and a signal receptacle assembly. The signal header assembly can include pairs of differential signaling conductors arranged in columns for broadside signaling. Comparably, the signal receptacle assembly can include pairs of conductor receptacles arranged in columns to receive corresponding ones of the pairs of the differential signaling conductors. Finally, a surface mount (SMT) lead can be provided for each of the conductor receptacles and each of the signaling conductors | 12-25-2008 |
| 20090210190 | HEAT SINK METHOD, SYSTEM, AND PROGRAM PRODUCT - Where an attachment means connects a heat sink to a system component, heat is thereby conducted to the heat sink from the component, a temperature sensor is located on the heat sink and another on the component or the attachment means, a portion of the attachment means is disposed between the sensors. Temperature readings from the sensors are compared to identify a failing one of the heat sink, the attachment means portion, and the component, with respect to heat conduction. Corrective action may be identified, and self-power means may also be provided to supply operative power. A wireless output circuit may be provided. Multiple heat sink sensors may be provided in any element. Rate-of-rise temperature readings may be observed and compared, including to historical values. | 08-20-2009 |
| 20110008994 | IMPLEMENTING ENHANCED CONNECTOR GUIDE BLOCK STRUCTURES FOR ROBUST SMT ASSEMBLY - A method and enhanced connector guide block structures implement robust connector assembly including robust Surface Mount Technology (SMT) connector assembly. A connector guide block includes a printed wiring board (PWB) mating face including at least one mounting screw hole provided within a mounting portion for receiving a mounting screw. The connector guide block is assembled with a printed wiring board (PWB) by inserting a respective non-bonding screw through an aligned opening in the PWB into guide block mounting hole and a gap is defined from an upper surface of the PWB below the guide block mounting portion. The gap is filled with an electrically nonconductive underfill material and cured. Another connector guide block structure includes an upper connector guide block portion and a lower connector guide block portion with a gap between the guide block portions filled with a selected electrically nonconductive underfill material and cured. | 01-13-2011 |
| Patent application number | Description | Published |
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| 20080233771 | CUSTOMIZABLE BACKER FOR ACHIEVING CONSISTENT LOADING AND ENGAGEMENT OF ARRAY PACKAGE CONNECTIONS - An electrical contact assembly includes a first module ( | 09-25-2008 |
| 20080239683 | Method and Apparatus for Electrically Connecting Two Substrates Using a Land Grid Array Connector Provided with a Frame Structure Having Power Distribution Elements - A method and apparatus for electrically connecting two substrates using a land grid array (LGA) connector provided with a frame structure having power distribution elements. In an embodiment, the frame structure includes a frame having one or more conductive layers sandwiched between non-conductive layers. The frame may, for example, be a printed wire board (PWB) having power planes that distribute power from a first substrate (e.g., a system PWB) and/or a power cable to a second substrate (e.g., an electronic module). The frame includes one or more apertures configured to receive an LGA interposer for electrically connecting the two substrates. Preferably, the frame includes four apertures arranged in quadrants that each receive an interposer, and at least one power plane extends between two quadrants and/or adjacent to a peripheral edge of one or more quadrants in the form of stacked and/or parallel bus bars each defining a power domain. | 10-02-2008 |
| 20080259572 | Mounting a Heat Sink in Thermal Contact with an Electronic Component - A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap. | 10-23-2008 |
| 20080264603 | Mounting a Heat Sink in Thermal Contact with an Electronic Component - A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap. | 10-30-2008 |
| 20090111292 | Surface Mount Technology Pad Layout for Docking Connector Systems - A pad array for a surface mount technology board includes a front row ground pad as a single pad, followed by a signal pad. The ground pads internal to the array may be arranged as pairs of pads interconnected to each other, with sandwiching signal pads on the internal portion of the array. To minimize stress on connector wafers of large scale connectors, external rows of ground pads may be enlarged by a predetermined amount in a Y-direction to minimize potential formation of stress risers, while ensuring that electrical spacing requirements to adjacent signal leads may be preserved for optimal signal integrity. | 04-30-2009 |
| 20090321125 | Plastic Land Grid Array (PLGA) Module and Printed Wiring Board (PWB) With Enhanced Contact Metallurgy Construction - An enhanced contact metallurgy construction for plastic land grid array (PLGA) modules and printed wiring boards (PWBs). The PWB may, for example, have subcomposite laminate construction and/or a double-sided LGA site. A plurality of preform contacts are each respectively soldered to one of a plurality of metal pads on a PLGA module carrier and/or a PWB. Each of the preform contacts comprises a metal preform base (e.g., copper, nickel) soldered to one of the plurality of metal pads and an electrolytic noble metal plating (e.g., gold) over the metal preform base. An electrolytic non-noble metal underplating (e.g., nickel) may be interposed between the metal preform base and the electrolytic noble metal plating. In one embodiment, the electrolytic non-noble metal underplating is 80-400 microinches thick to provide an enhanced diffusion barrier, and the electrolytic noble metal plating is 30-60 microinches thick and incorporates one or more hardening agents to provide enhanced wear and corrosion resistance. | 12-31-2009 |
| 20100248506 | Implementing Enhanced Solder Joint Robustness for SMT Pad Structure - A method and a surface mount technology (SMT) pad structure are provided for implementing enhanced solder joint robustness. The SMT pad structure includes a base SMT pad. The base SMT pad receives a connector for soldering to the SMT pad structure. A standoff structure having a selected geometry is defined on the base SMT pad to increase thickness of the solder joint for the connector. | 09-30-2010 |
