Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Hoffmann, Alzenau

Gerd Hoffmann, Alzenau DE

Patent application numberDescriptionPublished
20110045258LAMINATE AND COMPOSITE LAYER COMPRISING A SUBSTRATE AND A COATING, AND A PROCESS AND APPARATUS FOR PREPARATION THEREOF - The invention relates to a laminate comprising two plastic films and in between a metal or metaloxide layer and a crystalline triazine layer, the laminate having a lamination strength of about 2 N/inch or more as measured in a 90 degree tensile testing at 30 mm/min. The invention further relates to a composite layer, comprising a metal or metal oxide, and a triazine layer comprising a triazine compound suitable for said laminate. The invention further relates to a process for the preparation of a composite layer, comprising the step of applying a triazine layer on a substrate with a metal or metal oxide layer by vapour deposition of the triazine compound, wherein the process comprises (a) applying to the metal or metal oxide layer a compound other than a triazine compound, (b) vapour depositing the triazine compound on the metal or metal oxide layer while the compound is at least in part in a liquid state.02-24-2011

Uwe Hoffmann, Alzenau DE

Patent application numberDescriptionPublished
20080261409PROCESSING DEVICE AND METHOD FOR PROCESSING A SUBSTRATE - A processing device for producing a layer system including at least one layer of an organic light emitting semiconductor material (OLED), comprises (1) a configuration of one or more treatment stations for processing the substrate in the treatment stations and (2) a first encapsulation module for providing an encapsulation element on the layer system deposited on the substrate. Furthermore, the processing device comprises at least a second encapsulation module, and is configured to provide the encapsulation element on the coated substrate in the first or second encapsulation module alternatively. By providing two encapsulation modules, the second module may be cleaned during a continuous operation of the processing device, while the first encapsulation module is generating an encapsulation on a coated substrate. In this way, a continuous operation of a coating device for depositing an OLED coating and an encapsulation element on the OLED coating is provided.10-23-2008
20090020416SPUTTER COATING DEVICE AND METHOD OF DEPOSITING A LAYER ON A SUBSTRATE - A sputter coating device comprises a vacuum coating chamber, substrates arranged within the coating chamber, a cylindrical hollow cathode including a rotatable target rotating around a central axis A, and a magnet assembly which is arranged within the hollow cathode such that confining plasma zones are generated in an area above the surface of the target. At least one substrate is to be coated. The substrate has an OLED layer deposited on the substrate surface. An intermediate area is arranged between the surface of the target and a shield that shields particles sputtered from the surface of the target that move in a direction toward the shield. On each side of the shield, passages are provided between the intermediate area and coating area. Through the passage, only sputtered particles that have been scattered in the intermediate area may enter the coating area via the passage, and impinge the OLED layer.01-22-2009
20090098293METHOD OF PROVIDING AN ENCAPSULATION LAYER STACK, COATING DEVICE AND COATING SYSTEM - A coating system or encapsulation module 04-16-2009
20090317927METHOD OF CLEANING A PATTERNING DEVICE, METHOD OF DEPOSITING A LAYER SYSTEM ON A SUBSTRATE, SYSTEM FOR CLEANING A PATTERNING DEVICE, AND COATING SYSTEM FOR DEPOSITING A LAYER SYSTEM ON A SUBSTRATE - A method of cleaning a patterning device, the patterning device having at least organic coating material (OLED material) deposited thereon, comprises the step of providing a cleaning plasma for removing the coating material from the patterning device by means of a plasma etching process. During the step of removing the coating material from the patterning device, the temperature of the patterning device does not exceed a critical temperature causing damage to the patterning device, while maintaining a plasma etching rate of at least 0.2 μm/min. In order to generate a pulsed cleaning plasma, pulsed energy is provided. The method can be carried out in a direct plasma etching process or in a remote plasma etching process. Different etching processes may be combined or carried out subsequently.12-24-2009
20100098853ARRANGEMENT FOR VAPORIZING MATERIALS AND METHOD FOR COATING SUBSTRATES - The invention relates to an arrangement for the vaporization of materials, and specifically of organic materials, such as are utilized for example in the production of OLEDs. A heating element and a device for transporting a carrier for a layer to be vaporized are herein provided. The carrier with the layer to be vaporized is guided over the heating element where the layer is vaporized and deposited on a substrate.04-22-2010
20100159125METHOD AND APPARATUS FOR DEPOSITING MIXED LAYERS - The present invention refers to a method as well as an apparatus for depositing a layer at a substrate, the layer containing at least two components co-deposited by at least two evaporation sources, wherein the mixture of the components regarding the content of the components is set by tilting the evaporation sources to predetermined angle and/or by positioning the evaporation sources at a predetermined distance with respect to the substrate and/or wherein evaporation plumes of the evaporation sources are arranged such that the maxima of the evaporation plumes are separated locally with respect to the substrate.06-24-2010
20100233353EVAPORATOR, COATING INSTALLATION, AND METHOD FOR USE THEREOF - An evaporator for applying vapor to a substrate at a coating rate is described. The evaporator includes an evaporator tube having a distribution pipe with at least one nozzle outlet, wherein the evaporator tube includes a pressure measurement device, the pressure measurement device comprising an optical diaphragm gauge.09-16-2010

Patent applications by Uwe Hoffmann, Alzenau DE