Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Hoechst

Arnim Hoechst, Reutlingen DE

Patent application numberDescriptionPublished
20100135123ACOUSTIC SENSOR ELEMENT - A micromechanical acoustic sensor element, which has at least one diaphragm and at least one fixed counter element, the diaphragm being situated in a cavity between a substrate and the counter element and acting as movable electrode of a capacitor system, the counter element acting as first fixed counter electrode of this capacitor system, and at least one through hole being formed in the substrate for the application of sound pressure to the diaphragm. For fixation and strengthening purposes, the counter element is connected to the substrate via at least one support element. The support element is situated in the region of the cavity, and an opening is formed in the diaphragm for the support element.06-03-2010
20110001200MICROMECHANICAL COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF - A method for manufacturing a micromechanical component and the micromechanical component produced thereby. This component is preferably a diaphragm or a diaphragm layer which is independently produced for the purpose of subsequent assembly with other components.01-06-2011
20110002359SENSOR AND METHOD FOR PRODUCING THE SAME - A sensor, in particular for the spatially resolved detection, includes a substrate, at least one micropatterned sensor element having an electric characteristic whose value varies as a function of the temperature, and at least one diaphragm above a cavity, the sensor element being disposed on the underside of the at least one diaphragm, and the sensor element being contacted via connecting lines, which extend within, on top of or underneath the diaphragm. In particular, a plurality of sensor elements may be formed as diode pixels within a monocrystalline layer formed by epitaxy. Suspension springs, which accommodate the individual sensor elements in elastic and insulating fashion, may be formed within the diaphragm.01-06-2011
20110079081Manufacturing method for a micromechanical component and micromechanical component - A manufacturing method for a micromechanical component having the following steps: at least partially covering a first side of a substrate using a first insulating layer, forming at least one actuator plate electrode, at least one contact terminal, and at least one spring component from at least one first conductive material, covering at least the at least one actuator plate electrode, the at least one contact terminal, and the at least one spring component using a second insulating layer, forming at least one stator plate electrode from at least one second conductive material, forming at least one first trench in the substrate for producing a displaceable mass and a frame of a mounting, etching being performed in a first direction, and removing at least one partial mass of the second insulating layer, which is between the at least one actuator plate electrode and the at least one stator plate electrode, etching being performed in a second direction. Also described is a related micromechanical component.04-07-2011
20110198713MICROMECHANICAL COMPONENT HAVING A REAR VOLUME - In a method for manufacturing a micromechanical component, a cavity is produced in the substrate from an opening at the rear of a monocrystalline semiconductor substrate. The etching process used for this purpose and the monocrystalline semiconductor substrate used are controlled in such a way that a largely rectangular cavity is formed.08-18-2011

Arnim Hoechst, Tuebingen DE

Patent application numberDescriptionPublished
20100260974Method for Manufacturing a Micromechanical Component, and Micromechanical Component - A micromechanical method for manufacturing a cavity in a substrate, and a micromechanical component manufactured with this method. In this method, in a first step a first layer is produced on or in a substrate. At least one second layer is then applied onto the first layer. An access hole is produced in this second layer. Material of the first layer and of the substrate can be dissolved out through this hole, so that a cavity is produced in the substrate beneath at least a portion of the second layer. This second layer above the cavity can subsequently be used as a membrane. In addition, the possibility also exists of depositing further layers onto the second layer, only the totality of which layers constitutes the membrane. The material of the first layer is selected so that dissolving out the material of the first layer produces a transition edge in the first layer, which edge at is at a predefinable angle between the substrate and the second layer.10-14-2010

Kimberly L. Hoechst, West Chester, PA US

Patent application numberDescriptionPublished
20100179888SYSTEM AND METHOD FOR ESTABLISHING OR MODIFYING AN ACCOUNT WITH USER SELECTABLE TERMS - The present invention relates to methods for allowing an account holder to easily customize the terms of an account such as a loan account, an asset account, a mortgage account, an insurance account, or a brokerage account. Exemplary embodiments of the invention allow the user to specify various preferred terms such as cost (e.g., APR and annual fee), rewards programs, card design, affiliates, credit line, and payment due date, among others. The financial service provider issuing the account, e.g., the issuing bank, may make the various available terms for the account easily accessible to the user, for example through an internet website or an automated phone system, enabling the user to easily specify his or her preferences. The customization methods may be applied to the process of opening a new account or customizing an existing account. The customization methods may dynamically update the available terms as the user begins to select his or her desired terms.07-15-2010

Norbert Hoechst, Hilzingen DE

Patent application numberDescriptionPublished
20110266180TUBULAR-BAG PACK FOR ARTICLES IN BAR FORM AND METHOD FOR PRODUCING A PACKAGING-MATERIAL WEB - The invention relates to a tubular bag packaging (11-03-2011