| Patent application number | Description | Published |
|---|
| 20090071525 | Cooling Hot-Spots by Lateral Active Heat Transport - An apparatus includes a thermoelectric cooler adjacent to a surface of a device substrate and including a first set of one or more metal electrodes, a second set of one or more metal electrodes, and one or more semiconductor members. Each member includes a material different from the device substrate and physically joins a corresponding one electrode of the first set to a corresponding one electrode of the second set. The electrodes and at least one member are configured to transport heat to or from a thermal load in a direction parallel to the surface of the device substrate. | 03-19-2009 |
| 20090188264 | Modular in-frame pumped refrigerant distribution and heat removal system - An apparatus, method and system are provided for a modular in-frame pumped refrigerant distribution system. Specifically, a micro-channel heat exchanger is positioned in an equipment cabinet close to equipment that generates heat. More specifically, the micro-channel heat exchanger may be positioned on a) a shelf above the equipment, b) the back side of the equipment, or c) a shelf below the equipment. The micro-channel heat exchanger is operable to receive a refrigerant supplied by an external heat exchanger along a primary flow path, transfer heat from air above and/or near the equipment to a coil of the micro-channel heat exchanger, circulate the refrigerant to extract the heat, and return the refrigerant with an extracted portion of generated heat to the external heat exchanger along a secondary flow path. The external heat exchanger may remove extracted heat from a building via a building chilled water system or an outdoor condenser unit. | 07-30-2009 |
| 20090242175 | Thermal energy transfer device - Device having first wick evaporator including first membrane and plurality of first thermally-conductive supports. First membrane has upper and lower surfaces. First membrane also has plurality of pores with upper pore ends at upper surface of first membrane and with lower pore ends at lower surface of first membrane. Each of first thermally-conductive supports has upper and lower support ends. Upper support ends of first thermally-conductive supports are in contact with first membrane. Each of first thermally-conductive supports has longitudinal axis extending between the upper and lower support ends, average cross-sectional area along axis, and membrane support cross-sectional area at upper support end, the membrane support cross-sectional area effectively being smaller than average cross-sectional area. First thermally-conductive supports are configured to conduct thermal energy from lower support ends of first thermally-conductive supports to first membrane. Process includes providing wick evaporator, providing liquid working fluid in contact with lower or upper surface of membrane, and causing liquid working fluid to be evaporated from liquid-vapor interface in membrane. | 10-01-2009 |
