Patent application number | Description | Published |
20130292832 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package includes: a first insulating layer; a plurality of first conductive elements disposed in the first insulating layer; a first circuit layer formed on the first insulating layer; a semiconductor chip disposed on the first insulating layer; and an encapsulant formed on the first insulating layer and encapsulating the semiconductor chip. The first conductive elements that are bonding wires have a small diameter and thus occupy desired limited space on the first insulating layer. Therefore, more space is available for the first circuit layer. | 11-07-2013 |
20130334694 | PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A packaging substrate is provided, including: a metal board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of first openings for defining a first core circuit layer therebetween, the second surface has a plurality of second openings for defining a second core circuit layer therebetween, each of the first and second openings has a wide outer portion and a narrow inner portion, and the inner portion of each of the second openings is in communication with the inner portion of a corresponding one of the first openings; a first encapsulant formed in the first openings; a second encapsulant formed in the second openings; and a surface circuit layer formed on the first encapsulant and the first core circuit layer. The present invention effectively reduces the fabrication cost and increases the product reliability. | 12-19-2013 |
20140091462 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is provided, which includes: a dielectric layer made of a material used for fabricating built-up layer structures; a conductive trace layer formed on the dielectric layer; a semiconductor chip is mounted on and electrically connected to the conductive trace layer; and an encapsulant formed over the dielectric layer to encapsulate the semiconductor chip and the conductive trace layer. Since a strong bonding is formed between the dielectric layer and the conductive trace layer, the present invention can prevent delamination between the dielectric layer and the conductive trace layer from occurrence, thereby improving reliability and facilitating the package miniaturization by current fabrication methods. | 04-03-2014 |
20140315353 | FABRICATION METHOD OF PACKAGING SUBSTRATE, AND FABRICATION METHOD OF SEMICONDUCTOR PACKAGE - A fabrication method of a packaging substrate includes: providing a metal board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of first openings for defining a first core circuit layer therebetween, the second surface has a plurality of second openings for defining a second core circuit layer therebetween, each of the first and second openings has a wide outer portion and a narrow inner portion, and the inner portion of each of the second openings is in communication with the inner portion of a corresponding one of the first openings; a first encapsulant in the first openings; a second encapsulant in the second openings; and forming a surface circuit layer on the first encapsulant and the first core circuit layer. | 10-23-2014 |
20150144384 | PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF - A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads. | 05-28-2015 |
20150187603 | FABRICATION METHOD OF PACKAGING SUBSTRATE - A fabrication method of a packaging substrate includes: providing a metal board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of first openings for defining a first core circuit layer therebetween, the second surface has a plurality of second openings for defining a second core circuit layer therebetween, each of the first and second openings has a wide outer portion and a narrow inner portion, and the inner portion of each of the second openings is in communication with the inner portion of a corresponding one of the first openings; forming a first encapsulant in the first openings; forming a second encapsulant in the second openings; and forming a surface circuit layer on the first encapsulant and the first core circuit layer. | 07-02-2015 |
20150305162 | PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF - A fabrication method of a packaging substrate is provided, which includes the steps of: forming first conductive portions on a carrier; sequentially forming a conductive post and an alignment layer on each of the first conductive portions; forming an encapsulant on the carrier for encapsulating the first conductive portions, the conductive posts and the alignment layers; forming a conductive via on each of the alignment layers in the encapsulant and forming second conductive portions on the conductive vias and the encapsulant; and removing the carrier. Each of the first conductive portions and the corresponding conductive post, the alignment layer and the conductive via form a conductive structure. The alignment layer has a vertical projection area larger than those of the conductive post and the conductive via to thereby reduce the size of the conductive post and the conductive via, thus increasing the wiring density and the electronic element mounting density. | 10-22-2015 |
Patent application number | Description | Published |
20090306199 | Method for inhibiting activation of macrophages, inhibiting formation of osteoclasts, inhibiting function of osteoclasts, and/or activating osteoblasts - A method for inhibiting the activation of macrophages, inhibiting the formation of osteoclasts, inhibiting the function of osteoclasts, and/or activating osteoblasts in a mammal is provided. The method comprises the administration of an effective amount of kinsenoside of formula (I) or a pharmaceutically acceptable salt or ester thereof to the mammal: | 12-10-2009 |
20110082197 | Method for inhibiting formation and/or activation of osteoclasts using flemingia macrophylla extract or lespedeza flavanone A - A method for inhibiting the formation and/or activation of osteoclasts in a mammal comprising administrating an effective amount of a compound of formula (I) or a pharmaceutically acceptable salt or ester thereof to the mammal is provided: | 04-07-2011 |
20110142966 | AQUEOUS EXTRACTS OF ANOECTOCHILUS SPP. KINSENOSIDE AND PHARMACEUTICAL COMPOSITIONS USEFUL FOR HEPATOPROTECTION - A pharmaceutical composition useful for hepatoprotection is provided. The composition comprises an effective amount of kinsenoside or a pharmaceutically acceptable salt or ester thereof. An aqueous extract of | 06-16-2011 |
20120059059 | METHOD FOR INHIBITING ACTIVITY AND/OR EXPRESSION OF MATRIX METALLOPROTEINASE, INHIBITING PHOSPHORYLATION OF MITOGEN-ACTIVATED PROTEIN KINASE, AND/OR PROMOTING EXPRESSION OF COLLAGEN USING TORMENTIC ACID - A method for inhibiting the activity of matrix metalloproteinase (MMP), inhibiting the expression of matrix metalloproteinase, inhibiting the phosphorylation of mitogen-activated protein kinase (MAPK), and/or promoting the expression of collagen in a mammal is provided. The method comprises administrating to the mammal an effective amount of an active component selected from a group consisting of a compound of formula (I), a pharmaceutically acceptable salt of the compound, a pharmaceutically acceptable ester of the compound, and combinations thereof: | 03-08-2012 |
Patent application number | Description | Published |
20160002377 | MOLD RELEASING AGENT - A mold releasing agent is copolymerized with a fluorine-containing monomer, an acrylic ester monomer, and an acid monomer. Whereby, the mold releasing agent has comparable releasing performance and longevity to long-chain copolymers containing halothane. | 01-07-2016 |
20160002516 | WATER-REPELLENT AND OIL-REPELLENT AGENT - A water-repellent and oil-repellent agent is polymerized with a fluorine-containing monomer, a non-fluorinated branched monomer, a non-fluorinated crosslinking monomer, and an olefin monomer. Whereby, the agent provides good water-repellent and oil-repellent effect, and enhances adhesion problem on a roller. | 01-07-2016 |
20160002857 | WATER- AND OIL-REPELLENT AGENT - A water- and oil-repellent agent is produced by blending a fluorine-containing polymer and a fluorine-free polymer, wherein the fluorine-free polymer is 30-70% by weight of the total of the water- and oil-repellent agent, the fluorine-containing polymer is polymerized by a fluorine-containing monomer, a non-fluorinated branched monomer, a non-fluorinated crosslinking monomer, and an olefin monomer, and wherein the fluorine-containing monomer, the non-fluorinated branched monomer, the non-fluorinated crosslinking monomer, and the olefin monomer are 45-80%, 1-30%, 1-10%, and 10-50% by weight of the total of the fluorine-containing polymer respectively and the fluorine-free polymer is polymerized by a non-fluorinated non-crosslinking monomer, a non-fluorinated crosslinking monomer, and an olefin monomer, wherein the non-fluorinated non-crosslinking monomer, the non-fluorinated crosslinking monomer, and the olefin monomer are 45-80%, 1-30%, and 10-50% by weight of the total of the fluorine-free polymer respectively whereby, the agent reduces adhesion on a roller, and reduces environmental impact due to reduced fluorine usage. | 01-07-2016 |
Patent application number | Description | Published |
20100080717 | Fan motor for combustion-powered tool - A fan motor is adapted to be mounted in a combustion-powered tool. The combustion-powered tool has a housing. The fan motor includes a fan unit, a motor for driving the fan unit, a vibration-absorbing unit, and a clamping unit. The vibration-absorbing unit includes a rigid support that is adapted to be mounted fixedly in the housing of the combustion-powered tool, and an elastic member sleeved over the motor and molded on the rigid support such that the rigid support is disposed around the elastic member. The elastic member is disposed between the rigid support and the motor for absorbing vibrations generated by the motor. The clamping unit includes at least one clamping member sleeved over the elastic member for clamping and retaining the elastic member on the motor. | 04-01-2010 |
20120037682 | DUAL SAFETY COMBUSTION POWERED TOOL DEVICE - A dual safety combustion powered tool device includes a push member disposed to be pressed against a targeted surface to bring a lever to turn to be closer to an actuating unit. A trigger body is pulled to move the actuating unit so as to permit an actuating region to abut against the lever and to turn the actuating unit to an orientation where an actuating region is engageable with an ignition switch. Subsequently, a further movement of the trigger body to a final-stage position permits the actuating region to switch on the ignition switch so as to ignite combustion for initiation of a stroke movement of a driver blade. With such construction, undesired firing of the combustion powered tool device can be avoided. | 02-16-2012 |
20130242530 | STATUS INDICATING DEVICE FOR A POWER NAIL GUN - A status indicating device for a power nail gun includes a trigger adapted to be disposed on a gun body and having at least one transparent portion, and a light emitting module adapted to be disposed between the gun body and the trigger for emitting light through the transparent portion. | 09-19-2013 |
Patent application number | Description | Published |
20100137220 | BLOOD SUGAR-MODULATING POLYPEPTIDES - A blood sugar-modulating polypeptide, a pharmaceutical composition comprising the polypeptide, and a method for modulating blood sugar in a mammal comprising the administration of the polypeptide are provided. The polypeptide has a following amino acid sequence or a homologous amino acid sequence derived from the substitution, deletion, and/or addition of one or more amino acids therein: | 06-03-2010 |
20110124557 | BLOOD SUGAR-MODULATING POLYPEPTIDES - A blood sugar-modulating polypeptide, a pharmaceutical composition comprising the polypeptide, and a method for modulating blood sugar in a mammal comprising the administration of the polypeptide are provided. The polypeptide has a following amino acid sequence or a homologous amino acid sequence derived from the substitution, deletion, and/or addition of one or more amino acids therein: | 05-26-2011 |
20120027676 | MODIFIED SODIUM IODIDE SYMPORTER PROTEINS AND USES THEREOF - A modified sodium iodide symporter (NIS) protein is provided. The modified NIS protein comprises an amino acid sequence of SEQ ID NO.1 with the proviso that at least one amino acid residue within SEQ ID NO. 1 is changed. The modified NIS protein has an enhanced transport function, and the expression of the modified NIS protein in the cells results in higher intracellular levels of a substrate of a NIS protein than does the expression of the same amount of a wild-type NIS protein. | 02-02-2012 |
Patent application number | Description | Published |
20090141924 | Earpiece Device with Microphone - An earpiece device includes a housing having a sound output portion, a speaker and a microphone. The speaker disposed in the housing includes a diaphragm and a sound transmitting hole. The diaphragm is located between the sound output portion and the sound transmitting hole. The microphone is disposed in the housing and covers the sound transmitting hole. A sound wave generated within an ear canal would be received by the speaker and delivered through the sound transmitting hole to the microphone for pickup. | 06-04-2009 |
20090196443 | WIRELESS EARPHONE SYSTEM WITH HEARING AID FUNCTION - A wireless earphone system includes a main device and two ear-hang devices. The main device having a digital signal processor, a server-end wireless transmitting module and a server-end wireless receiving module electrically connected with the digital signal processor respectively. Each ear-hang device has a microphone, a speaker, a client-end wireless transmitting module electrically connected to the microphone and a client-end wireless receiving module electrically connected to the speaker. The microphone collects an external sound wave and converts the external sound wave into an electronic signal for transmission to the digital signal processor by the client-end wireless transmitting module and the server-end wireless receiving module, and the processed electronic signal is transmitted by the server-end wireless transmitting module and the client-end wireless receiving module to the microphone for converting into a sound wave. | 08-06-2009 |
20090196454 | EARPHONE SET - An earphone set includes a main device having a digital signal processor, and an earplug has an external microphone and a speaker electrically connected with the digital signal processor respectively. The external microphone converts an external sound wave into an electronic signal and transmits the electronic signal to the digital signal processor for processing. The speaker converts the electronic signal processed by the digital signal processor into a sound wave for output. | 08-06-2009 |
Patent application number | Description | Published |
20090015122 | RTA MODULAR DESKTOP CABINET - A ready-to-assemble (RTA) modular desktop cabinet has a multiple dowels, multiple clasp connectors, two side panels, a rear panel, a main shelf, a pedestal assembly and a top panel. The rear panel has a top board and a bottom board. The side panels are mounted parallelly and detachably mounted to the rear panel, the main shelf, the pedestal assembly and the top panel independently using dowels or clasp connectors. Further, the bottom board is hinged to the top board, so that the footprint of the folded rear panel is reduced for transport and storage. Furthermore, the RTA modular cabinet can be assembled and disassembled easily without needing tools. | 01-15-2009 |
20090080969 | Detachable connector assembly - A detachable connector assembly has a bracket, an active dowel and a lever. The bracket has a clamping recess. The active dowel has a shaft and a shaft cover. The shaft has a head, a central segment and a mounting end. The central segment is formed coaxially on and smaller than the head. The mounting end is formed coaxially on the central segment. The shaft cover is mounted around the central segment and the mounting end. The bracket and the active dowel are mounted inside two perpendicular panels respectively with the head of the active dowel inserted in the clamping recess. A person rotates the lever to drive the bracket around, thereby pulling the head further into bracket, the shaft cover is pressed further into the panel around the mounting end, thereby holding the shaft in the panel and securing the panels and connecting assembly together. | 03-26-2009 |
20090123222 | Detachable connector assembly - A detachable connector assembly has a bracket, an active dowel and a lever. The bracket has a clamping recess. The active dowel has a shaft and a shaft cover. The shaft has a head, a central segment and a mounting end. The central segment is formed coaxially on and is smaller than the head. The mounting end is formed coaxially on the central segment. The shaft cover is mounted around the central segment and the mounting end. The bracket and the active dowel are respectively mounted inside two perpendicular panels with the head of the active dowel inserted in the clamping recess. The lever is rotated to drive the bracket around, thereby pulling the head further into bracket, the shaft cover is pressed further into the panel around the mounting end, thereby holding the shaft in the panel and securing the panels and connecting assembly together. | 05-14-2009 |
20090256455 | RAIL ASSEMBLY - A rail assembly has at least two hangers, a base and a rail body. Each hanger is a straight slot and has a narrow side and a clamp side longitudinal forming on the hanger. The clamp side is wider than the narrow side. The base has a base body and at least two mounting troughs. The mounting troughs are securely mounted on the base body and each mounting trough corresponds to and is slidably mounted on one of the hangers. The rail body is mounted on the base body. It is only to hang the assembled rail body with the base onto the hangers for assembling the rail assembly without using any tool, so to assemble the rail assembly is easy and convenient. | 10-15-2009 |
20090256456 | RAIL ASSEMBLY - A rail assembly has a bracket, a base, a rail body and at least one bolt. The bracket is securely mounted on a surface of a furniture and has a top surface, a fastening tab protruding from the top surface and at least one fixing hole. The fixing hole is formed through the fastening tab. The base has a bottom surface, a mounting tab protruding from the bottom surface of the base and at least one mounting hole, wherein the bottom surface and the mounting tab correspond to the top surface and the fastening tab. The mounting hole is formed through the mounting tab. The rail body is securely mounted on the base. Accordingly, the rail assembly can be conveniently assembled without using any tool. | 10-15-2009 |
20090290957 | Fastener - A fastener has a rod body that has a proximal end, a distal end, a head and an engaging segment. The head is formed on the proximal end. The engaging segment is formed between the proximal end and the distal end and has multiple teeth formed around the engaging segment. The rod body has a diameter gradually decreasing from the proximal end to the distal end. Accordingly, the fastener is convenient in combining two boards without using any tool. | 11-26-2009 |