Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Ho-Sik
Ho Sik Ahn, Suwon KR
| Patent application number | Description | Published |
|---|---|---|
| 20090321773 | LED PACKAGE FRAME AND LED PACKAGE HAVING THE SAME - An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability. | 12-31-2009 |
Ho Sik Chang, Daejon KR
| Patent application number | Description | Published |
|---|---|---|
| 20090221771 | PROCESS FOR POLYMERIZATION OR COPOLYMERIZATION OF ETHYLENE - Provided is a process for polymerization and copolymerization of ethylene, specifically comprising carrying out polymerization or copolymerization ethylene in the presence of (a) a solid complex titanium catalyst which is produced by the process comprising: (i) preparing a magnesium compound solution by contacting a halogenated magnesium compound and an alcohol for allowing a reaction; (ii) reacting the resulted magnesium compound solution with an ester compound having at least one hydroxyl group and a silicon compound having at least one alkoxy group; (iii) reacting the resulted solution with a mixture of a titanium compound and a silicon compound to obtain a solid titanium catalyst component; (iv) washing the resulted solid titanium catalyst component with a halogenated saturated hydrocarbon compound; and (v) further reacting the washed solid titanium catalyst component with a titanium compound to obtain a solid complex titanium catalyst, and (b) an organometallic compound from Group II or III of Periodic table of elements. According to the present invention, it is possible to provide a process for polymerization or copolymerization of ethylene in which the catalyst activity is improved and a polymer of high bulk density is provided, with the use of a catalyst prepared by a simple process. | 09-03-2009 |
Ho Sik Cho, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20100303251 | METHOD FOR RECOGNIZING EAR PHONE IN PORTABLE TERMINAL AND APPARATUS THEREOF - Disclosed is an apparatus for recognizing an earphone of a portable terminal that includes an interface unit which is connected to the earphone; a controller which performs a switch operation by determining whether a switch key of the earphone is inputted, according to a change of a current of a first port and a voltage of a second port, when the connection of the earphone is sensed; and an audio processing unit that outputs an audio signal to the earphone under the control of the controller. | 12-02-2010 |
Ho Sik Choi, Whasung-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110123263 | Device for Fastening Clash Pad to Vehicle - A device for fastening a clash pad to a vehicle, may include a grommet having a clash pad connection portion for placing in a hole formed in the clash pad, a stud bolt holder connected to the clash pad connection portion and including a receiving hole for receiving a stud bolt at a cowl panel of a vehicle body, and a mounting shelf clip connected to the stud bolt holder for placing on and fastening to a mounting flange at the cowl panel of the vehicle body, wherein the clash pad is fastened to the vehicle body as the stud bolt holder or the mounting shelf clip is placed on the stud bolt or the mounting flange, respectively. | 05-26-2011 |
Ho-Sik Park, Hwaseong-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090026604 | Semiconductor plastic package and fabricating method thereof - A semiconductor plastic package and a method of fabricating the semiconductor plastic package are disclosed. A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board. | 01-29-2009 |
| 20090236038 | Method for manufacturing insulating sheet and method for manufacturing metal clad laminate and printed circuit board using the same - A method for manufacturing an insulating sheet, a method for manufacturing a metal clad laminate, and a method for manufacturing a printed circuit board are disclosed. The method for manufacturing an insulating sheet may include stacking a thermoplastic resin layer over a reinforcement material, and hot pressing the thermoplastic resin layer into the reinforcement material to impregnate and attach the thermoplastic resin layer into the reinforcement material. Certain embodiments of the invention can be utilized to produce an insulation board that has a coefficient of thermal expansion close to that of the semiconductor chip, and thereby prevent bending or warpage in the multi-layer printed circuit board using the insulation board. Furthermore, the stress in the material connecting the semiconductor chip with the printed circuit board can be reduced, so that cracking or delamination in the connecting material, such as lead-free solder, may be avoided. | 09-24-2009 |
| 20090242248 | Insulating sheet and printed circuit board having the same - A method of manufacturing an insulating sheet can include: providing a reinforcement material on which a thermoplastic resin layer is stacked, stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate, and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate. This method can be used to produce an insulation board that has a coefficient of thermal expansion close to that of the semiconductor chip, and thereby prevent bending or warpage in the printed circuit board using the insulation board. Furthermore, the stress in the connecting material can be reduced, so that cracking or delamination in the connecting material may be avoided, while heat-releasing performance may also be improved. | 10-01-2009 |
| 20090250253 | Printed circuit board and manufacturing method thereof - Disclosed are a printed circuit board and a manufacturing method thereof. The method of manufacturing a printed circuit board in accordance with an embodiment of the present invention includes: providing a first resin layer having a first pattern on one surface thereof; forming a conductive bump, which is electrically connected to the first pattern, on one surface of the first resin layer; compressing an insulation layer and the first resin layer such that the conductive bump passes through the insulation layer; laminating a second resin layer, which has a second pattern on a surface thereof facing the insulation layer, on the insulation layer; and forming an opening by etching a part of at least one of the first resin layer and the second resin layer. | 10-08-2009 |
| 20090255714 | Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board - A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin. | 10-15-2009 |
| 20090288293 | Metal core package substrate and method for manufacturing the same - A metal core package substrate and a method for manufacturing the same. A method for manufacturing a metal core package substrate may include: forming a plurality of holes in a metal core; forming a plurality of paste bumps piercing into insulation layers of a first copper foil layer and a second copper foil layer; positioning the first and second copper foil layers at positions corresponding to the holes of the metal core so that the paste bumps are opposed to each other around the metal core; allowing each paste bump to pierce into the holes of the metal core by pressing the first and second copper foil layers; and forming inner circuits in the metal core pierced with the paste bumps. | 11-26-2009 |
| 20100330747 | Method of fabricating semiconductor plastic package - A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board. | 12-30-2010 |
Ho-Sik Park, Suwon-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090084595 | Printed circuit board and manufacturing method of the same - A method of manufacturing a printed circuit board includes stacking a solder resist layer on one side of a carrier; forming a first circuit pattern, which includes a first electrode pad, on the solder resist layer; forming a conductive post on the first electrode pad; stacking and pressing the carrier onto an insulation layer stacked in an inner substrate, such that the conductive post faces the insulation layer; and removing the carrier. As the conductive posts are pressed into the insulation layers to implement interlayer connections, certain drilling processes for forming via holes may be omitted, so that the degree of freedom can be increased in designing the circuits, and the circuits can be made to have greater densities. As the circuit patterns are buried in the insulation layers, the board can be made thinner, and the attachment areas can be increased, to allow greater adhesion. | 04-02-2009 |
| 20110139499 | Printed circuit board and manufacturing method of the same - A printed circuit board the includes: an insulation layer; a first circuit pattern including a first electrode pad buried in the insulation layer such that a portion of the first circuit pattern is exposed at a surface of the insulation layer; an inner substrate having the insulation layer stacked therein and having a second circuit pattern including a second electrode pad formed thereon; a conductive post buried in the insulation layer such that one end thereof is connected to the first electrode pad and the other end thereof is connected to the second electrode pad; and a solder resist layer stacked on the insulation layer. | 06-16-2011 |
Ho-Sik Shin, Ahnyang-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090262057 | LIQUID CRYSTAL DISPLAY AND METHOD OF DRIVING THE SAME - A liquid crystal display includes: a signal controller which converts a first image signal having a first gray level based on an original gamma coefficient into a second image signal having a second gray level based on a target gamma coefficient; a liquid crystal panel connected to the signal controller and which displays an image based on the second image signal; and a light-emitting unit connected to the signal controller and which provides light to the liquid crystal panel. The target gamma coefficient is less than or equal to the original gamma coefficient, and a luminance of the light provided by the light-emitting unit is adjusted by the signal controller to minimize an amount of luminance distortion of the image. | 10-22-2009 |
| 20090262065 | LIQUID CRYSTAL DISPLAY AND METHOD OF DRIVING THE SAME - A liquid crystal display includes a liquid crystal panel having display blocks arranged in a first matrix thereon, and light-emitting blocks which provide light to the liquid crystal panel. Each of the light-emitting blocks corresponds to a corresponding column of the first matrix and provides the light to a corresponding column of display blocks in the corresponding column of the first matrix. A frame during which an image is displayed on the liquid crystal display is divided into time slots, and a number of the time slots is equal to a number of the corresponding display blocks included in each column of the first matrix. A luminance of the light provided by each of the light-emitting blocks during each time slot of the frame is controlled based on an image data signal supplied to the corresponding column of the first matrix. | 10-22-2009 |