| Patent application number | Description | Published |
|---|
| 20080237894 | INTEGRATED CIRCUIT PACKAGE AND METHOD FOR THE SAME - Disclosed are an integrated circuit chip package and a method of connecting an integrated circuit chip and an attachment subject to each other while interposing an adhesive therebetween. The connection between integrated circuit chip and the attachment subject stress often leads to component failure and the addition of an interface layer with a similar thermal expansion coefficient improves reliability. The method may include applying the adhesive on the attachment subject, forming an interface layer between the integrated circuit chip and the adhesive wherein the interface layer has a thermal expansion coefficient similar to a thermal expansion coefficient of the integrated circuit chip. By connecting an integrated circuit chip and the attachment subject to each other by an adhesive via the interface layer, the generation of delamination is minimized and reliability is improved. | 10-02-2008 |
| 20080273314 | PCB having embedded IC and method for manufacturing the same - A multi-layer PCB includes a plurality of insulating layers and a plurality of conductive pattern layers alternatively and repeatedly stacked; contact-hole formed in the insulating layers so as to allow electrical connection through the contact-holes; a first integrated circuit arranged in a first insulating layer as one of the insulating layers so as to be embedded in the multi-layer PCB, the first integrated circuit having a plurality of connection bumps for electric connection on an upper surface of the first integrated circuit; and a second integrated circuit stacked on a lower surface of the first integrated circuit, the second integrated circuit having a plurality of connection bumps for electric connection on an upper surface of the second integrated circuit. | 11-06-2008 |
| 20090040704 | PRINTED CIRCUIT BOARD, METHOD OF FABRICATING THE SAME, AND ELECTRONIC APPARATUS EMPLOYING THE SAME - A printed circuit board includes a core layer, an insulation layer formed on the core layer and having a cavity formed on a part of the insulation layer, and a circuit pattern formed on the insulation layer, wherein the circuit pattern comprises one or more external terminals positioned above the cavity. | 02-12-2009 |
| 20090321728 | TRANSPARENT DISPLAY APPARATUS - A transparent display apparatus is provided that is constructed to transmit or block a light of images selectively according to a supply of electric power to a conventional transparent organic light emitting diode. The transparent display apparatus includes a transparent organic light emitting diode having a glass substrate, a transparent anode, a hole transport layer, an emitting layer, an electron transport layer and a transparent cathode. The transparent display apparatus includes an insulating layer stacked on the transparent cathode, and first and second transparent ITOs stacked on the insulating layer to deliver electromotive force onto an entire surface and to transmit or block the light of images according to the on/off state of a power source. The transparent display apparatus also includes an electro chromic layer provided between the first and the second transparent ITOs and including transparent and colorless chemicals. The electro chromic layer forms a color through oxidation-reduction reaction of the chemicals according to the on/off state of the power source to absorb or block the light of images. The transparent display apparatus further includes a substrate stacked on the second transparent ITO. | 12-31-2009 |
| 20100007475 | VIDEO REPRODUCTION APPARATUS AND METHOD FOR PROVIDING HAPTIC EFFECTS - An apparatus and method for allowing a user to dynamically enjoy a video. A difference between image data is computed at every preset unit of time and a vibration corresponding to the computed difference is generated so that the user can sense a motion change of an object within the video. Upon video reproduction, scenes are displayed by applying the lighting effect of a strobe light or the like between the scenes to be reproduced. Upon video reproduction, more enjoyment and various haptic effects can be provided to the user. | 01-14-2010 |
| 20100146463 | WATCH PHONE AND METHOD FOR HANDLING AN INCOMING CALL IN THE WATCH PHONE - A watch phone and a method for handling an incoming call using the watch phone are provided. In the watch phone, a display device includes a touch screen panel and a display, turns off the touch screen panel in a watch mode, turns on the touch screen panel in an idle mode or upon receipt of an incoming call, and displays at least two areas for call connection and call rejection, upon receipt of the incoming call. A single mode selection key selects one of the watch mode and the idle mode. A controller performs control operations so that the touch screen panel is turned off in the watch mode and is turned on in the idle mode or upon receipt of the incoming call, and connects or rejects the incoming call, when the at least two areas for call connection or call rejection, which are displayed upon receipt of the incoming call, are pointed to or dragged to. | 06-10-2010 |
| 20110155426 | EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates. | 06-30-2011 |
| 20110157858 | SYSTEM-IN-PACKAGE HAVING EMBEDDED CIRCUIT BOARDS - Provided is a System-In-Package (SIP) having embedded circuit boards in which boards are electrically connected and a plurality of chips are embedded in a board in a stacked manner. The SIP includes a first board on a surface of which a first circuit is formed, a second board which is provided on a top surface of the first board in a stacked manner and includes a plurality of chips embedded therein in a stacked manner, and a third board which is provided on a top surface of the second board in a stacked manner and on a surface of which a second circuit is formed. | 06-30-2011 |
