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Ho-Seong

Ho-Seong Kang, Gyeonggi-Do KR

Patent application numberDescriptionPublished
20080318351METHOD OF SETTING RECIPES OF A DEFECT TEST - In a method of setting recipes of a defect test, a laser intensity map of a sample is obtained. The laser intensity map is then area-scanned to obtain average laser intensity. Recipes are set based on the average laser intensity. Thus, a laser power set in a defect detector may be constant regardless of inspectors so that the defect detector may have improved defect detection reliability.12-25-2008

Ho-Seong Kim, Yongin-Si KR

Patent application numberDescriptionPublished
20110117423Holder case for secondary battery and lithium secondary battery using the same - A holder case for secondary battery having an improved longitudinal compression property and a lithium secondary battery using the same in which a case for secondary battery includes a case body and a first rib. The case body includes first and second long-side walls opposite to each other, first and second short-side walls, a bottom wall connected to one end portions of the two long-side walls and the two short-side walls, and an opening positioned at the other end portions of the two long-side walls and the two short-side walls while being opposite to the bottom wall. The first rib is disposed on the case body and extends from a middle portion of the first long-side wall to a middle portion of the second long-side wall via the second short-side wall.05-19-2011
20110117424CASE FOR SECONDARY BATTERY AND SECONDARY BATTERY HAVING THE SAME - A secondary battery case with improved extreme temperature exposure characteristics and a secondary battery. The secondary battery case includes: a quadrangular case body receiving and sealing an anode and a cathode, which are insulated from each other at a predetermined distance, and a liquid electrolyte; and at least one safety device that is coupled to the case body, wherein the safety device applies a force in a predetermined direction, wherein the predetermined direction is adjacent to a direction orthogonal to a line and the line extends in a direction orthogonal to a side wall of the case body from the center of gravity of the case body.05-19-2011
20110123854CASE FOR SECONDARY BATTERY AND LITHIUM SECONDARY BATTERY USING THE SAME - A case for secondary battery and a lithium secondary battery including the case, the case including: opposing main walls; opposing side walls connected to the main walls; and a bottom wall connected ends of the main and side walls. The bottom wall has a first notch extending between the main walls. The thickness of the bottom wall decreases from the side walls to a central portion thereof.05-26-2011

Ho-Seong Lee, Seoul KR

Patent application numberDescriptionPublished
20090176948Transition metal complexes, and catalysts compositions for preparing ethylene homopolymers or copolymers - Disclosed are a transition metal complex having a high catalytic activity for the preparation of an ethylene homopolymer or a copolymer of ethylene and α-olefin and a catalyst composition comprising the same. More specifically, there are provided a transition metal complex having, around a group IV transition metal, a cyclopentadiene derivative and at least one aryl oxide ligand with a heterocyclic aryl derivative substituted at the ortho-position thereof, with no crosslinkage between the ligands, a catalyst composition comprising the transition metal complex and an organoaluminum compound or boron compound as cocatalyst, and a method for the preparation of high molecular weight ethylene homopolymers or copolymers of ethylene and α-olefin using the same.07-09-2009
20090176949Transition metal complexes, catalyst compositions containing the same, and methods for preparing ethylene homopolymers or copolymers of ethylene and alpha-olefins using the same - The present invention relates to a transition metal complex and a transition metal catalyst composition comprising the same for the preparation of an ethylene homopolymer or a copolymer of ethylene and α-olefin. More particularly, it relates to a group IV transition metal catalyst having a cyclopentadiene derivative and at least one aryl oxide ligand in which an oxygen-containing heterocycle is fused at the ortho-position around a group IV transition metal, with no crosslinkage between the ligands, a catalyst composition comprising the transition metal catalyst and an aluminoxane cocatalyst or a boron compound cocatalyst, and a process for preparing an ethylene homopolymer or a copolymer of ethylene and α-olefin using the same.07-09-2009
20100298512TRANSITION METAL COMPLEXES, CATALYSTS COMPOSITION CONTAINING THE SAME, AND PROCESS FOR PREPARING ETHYLENE HOMOPOLYMERS OR COPOLYMERS OF ETHYLENE AND ALPHA-OLEFINS USING THE SAME - The present invention relates to a transition metal complex useful as a transition metal catalyst in the preparation of an ethylene homopolymer or a copolymer of ethylene and an α-olefin, a catalyst composition comprising the same and a process of preparing an ethylene homopolymer or a copolymer of ethylene and an α-olefin using the same. More particularly, it relates to a transition metal complex having a cyclopentadiene derivative and at least one phenyl oxide ligand substituted at the 2-position of phenyl with, for example, a silyl group having a C11-25-2010
20110152475ETHYLENE ALPHA OLEFIN POLYMER FORMED BY USE OF METALLOCENE CATALYST - There is provided a method for producing copolymer that is composed of ethylene and alpha-olefin by a solution polymerization, and more specifically, a method for producing copolymer that is composed of ethylene and aromatic monomer as main components by using a transition metal catalyst including a cyclopentadiene derivative, and one or more anionic ligand having aryloxy group in which an aryl derivative is substituted at an ortho-position06-23-2011

Patent applications by Ho-Seong Lee, Seoul KR

Ho-Seong Lee, Daejeon KR

Patent application numberDescriptionPublished
20080234508Process for the Preparation of N(5)-Ethylglutamine - Disclosed relates to a process for preparing N(5)-ethylglutamines economically without a specific purification process via a simplified and safe process, in which glutamic acid derivatives, represented by formula 1, protected by phthaloyl groups react with ethylamine to cause an amidation and a deprotection reaction in turn under the same reaction condition, thus preparing N(5)-ethylglutamines.09-25-2008
20100048840TRANSITION METAL CATALYTIC SYSTEMS AND METHODS FOR PREPARING ETHYLENE HOMOPOLYMERS OR COPOLYMERS OF ETHYLENE AND OLEFINS USING THE SAME - Disclosed herein is a group IV transition metal catalyst for producing an ethylene homopolymer or an ethylene-olefin copolymers, having high catalytic activity, which includes a cyclopentadiene derivative and one or more anionic ligands having an aryl group substituted with an aryl derivative at an ortho-position thereof around a transition metal, the ligands not being crosslinked to each other, a catalyst system including the group IV transition metal catalyst and an aluminoxane cocatalyst or a boron compound cocatalyst, and a method of producing ethylene homopolymers or ethylene-olefin copolymers using the catalyst system.02-25-2010
20100087662CHIRAL SALEN CATALYSTS AND METHODS FOR THE PREPARATION OF CHIRAL COMPOUNDS FROM RACEMIC EPOXIDES BY USING THEM - The present invention relates to new chiral salen catalysts and the preparation method of chiral compounds from racemic epoxides using the same. More specifically, it relates to new chiral salen catalysts that have high catalytic activity due to new molecular structures and have no or little racemization of the generated target chiral compounds even after the reaction is completed and can be also reused without catalyst regeneration treatment, and its economical preparation method to mass manufacture chiral compounds of high optical purity, which can be used as raw materials for chiral food additives, chiral drugs, or chiral crop protection agents, etc., using the new chiral salen catalysts.04-08-2010
20100120981ETHYLENE COPOLYMER AND A METHOD OF PREPARING THE SAME - Provided are ethylene copolymers and a process for preparing the same. More specifically, provided are ethylene copolymers exhibiting excellent processibility and physical properties due to its multimodal molecular weight distribution index, through a multi-stage process by using reactors connected in series or in parallel in the presence of catalyst composition containing transition metal catalyst, and a process for preparing the same.05-13-2010

Patent applications by Ho-Seong Lee, Daejeon KR

Ho-Seong Seo, Suwon-Si KR

Patent application numberDescriptionPublished
20080237894INTEGRATED CIRCUIT PACKAGE AND METHOD FOR THE SAME - Disclosed are an integrated circuit chip package and a method of connecting an integrated circuit chip and an attachment subject to each other while interposing an adhesive therebetween. The connection between integrated circuit chip and the attachment subject stress often leads to component failure and the addition of an interface layer with a similar thermal expansion coefficient improves reliability. The method may include applying the adhesive on the attachment subject, forming an interface layer between the integrated circuit chip and the adhesive wherein the interface layer has a thermal expansion coefficient similar to a thermal expansion coefficient of the integrated circuit chip. By connecting an integrated circuit chip and the attachment subject to each other by an adhesive via the interface layer, the generation of delamination is minimized and reliability is improved.10-02-2008
20080273314PCB having embedded IC and method for manufacturing the same - A multi-layer PCB includes a plurality of insulating layers and a plurality of conductive pattern layers alternatively and repeatedly stacked; contact-hole formed in the insulating layers so as to allow electrical connection through the contact-holes; a first integrated circuit arranged in a first insulating layer as one of the insulating layers so as to be embedded in the multi-layer PCB, the first integrated circuit having a plurality of connection bumps for electric connection on an upper surface of the first integrated circuit; and a second integrated circuit stacked on a lower surface of the first integrated circuit, the second integrated circuit having a plurality of connection bumps for electric connection on an upper surface of the second integrated circuit.11-06-2008
20090040704PRINTED CIRCUIT BOARD, METHOD OF FABRICATING THE SAME, AND ELECTRONIC APPARATUS EMPLOYING THE SAME - A printed circuit board includes a core layer, an insulation layer formed on the core layer and having a cavity formed on a part of the insulation layer, and a circuit pattern formed on the insulation layer, wherein the circuit pattern comprises one or more external terminals positioned above the cavity.02-12-2009
20090321728TRANSPARENT DISPLAY APPARATUS - A transparent display apparatus is provided that is constructed to transmit or block a light of images selectively according to a supply of electric power to a conventional transparent organic light emitting diode. The transparent display apparatus includes a transparent organic light emitting diode having a glass substrate, a transparent anode, a hole transport layer, an emitting layer, an electron transport layer and a transparent cathode. The transparent display apparatus includes an insulating layer stacked on the transparent cathode, and first and second transparent ITOs stacked on the insulating layer to deliver electromotive force onto an entire surface and to transmit or block the light of images according to the on/off state of a power source. The transparent display apparatus also includes an electro chromic layer provided between the first and the second transparent ITOs and including transparent and colorless chemicals. The electro chromic layer forms a color through oxidation-reduction reaction of the chemicals according to the on/off state of the power source to absorb or block the light of images. The transparent display apparatus further includes a substrate stacked on the second transparent ITO.12-31-2009
20100007475VIDEO REPRODUCTION APPARATUS AND METHOD FOR PROVIDING HAPTIC EFFECTS - An apparatus and method for allowing a user to dynamically enjoy a video. A difference between image data is computed at every preset unit of time and a vibration corresponding to the computed difference is generated so that the user can sense a motion change of an object within the video. Upon video reproduction, scenes are displayed by applying the lighting effect of a strobe light or the like between the scenes to be reproduced. Upon video reproduction, more enjoyment and various haptic effects can be provided to the user.01-14-2010
20100146463WATCH PHONE AND METHOD FOR HANDLING AN INCOMING CALL IN THE WATCH PHONE - A watch phone and a method for handling an incoming call using the watch phone are provided. In the watch phone, a display device includes a touch screen panel and a display, turns off the touch screen panel in a watch mode, turns on the touch screen panel in an idle mode or upon receipt of an incoming call, and displays at least two areas for call connection and call rejection, upon receipt of the incoming call. A single mode selection key selects one of the watch mode and the idle mode. A controller performs control operations so that the touch screen panel is turned off in the watch mode and is turned on in the idle mode or upon receipt of the incoming call, and connects or rejects the incoming call, when the at least two areas for call connection or call rejection, which are displayed upon receipt of the incoming call, are pointed to or dragged to.06-10-2010
20110155426EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.06-30-2011
20110157858SYSTEM-IN-PACKAGE HAVING EMBEDDED CIRCUIT BOARDS - Provided is a System-In-Package (SIP) having embedded circuit boards in which boards are electrically connected and a plurality of chips are embedded in a board in a stacked manner. The SIP includes a first board on a surface of which a first circuit is formed, a second board which is provided on a top surface of the first board in a stacked manner and includes a plurality of chips embedded therein in a stacked manner, and a third board which is provided on a top surface of the second board in a stacked manner and on a surface of which a second circuit is formed.06-30-2011

Patent applications by Ho-Seong Seo, Suwon-Si KR