| Patent application number | Description | Published |
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| 20110117746 | COATING COMPOSITION AND PATTERN FORMING METHOD - It is an object to provide a coating composition applicable to “reversal patterning” and suitable for forming a film covering a resist pattern. The object is accomplished by a coating composition for lithography comprising an organopolysiloxane, a solvent containing the prescribed organic solvent as a main component, and a quaternary ammonium salt or a quaternary phosphonium salt; or a coating composition for lithography comprising a polysilane, a solvent containing the prescribed organic solvent as a main component, and at least one additive selected from a group consisting of a crosslinking agent, a quaternary ammonium salt, a quaternary phosphonium salt, and a sulfonic acid compound, wherein the polysilane has, at a terminal thereof, a silanol group or a silanol group together with a hydrogen atom. | 05-19-2011 |
| 20110230058 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM WITH REDUCED OUTGASSING - There is provided underlayer films of high-energy radiation resists that are applied onto semiconductor substrates in a lithography process for producing semiconductor devices and that are used to prevent reflection, static electrification, and development defects and to suppress outgassing during the exposure of resist layers with high-energy radiation. A composition for forming an underlayer film of a high-energy radiation resist, the composition comprising a film component having an aromatic ring structure or a hetero ring structure. The film component having an aromatic ring structure or a hetero ring structure is contained preferably in a film at a proportion of 5 to 85% by mass. The film component may be a compound having an aromatic ring structure or a hetero ring structure, and the compound may be a polymer or a polymer precursor including a specific repeating unit. The aromatic ring may be a benzene ring or fused benzene ring, and the hetero ring structure may be triazinetrione ring. | 09-22-2011 |
| Patent application number | Description | Published |
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| 20090211787 | PRINTED CIRCUIT BOARD - A first insulating layer is formed on a suspension body, and a write wiring trace and a read wiring trace are formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring traces. A write wiring trace and a read wiring trace are formed on the second insulating layer. A third insulating layer is formed on the second insulating layer so as to cover the wiring traces. The width of the wiring trace is larger than the width of the wiring trace, and the width of the wiring trace is larger than the width of the wiring trace. | 08-27-2009 |
| 20090242259 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Ground traces are formed to sandwich a write wiring trace. Ground walls are formed on the ground traces. A ground cover is formed so as to couple upper ends of the ground walls. Thus, the ground traces, the ground walls and the ground cover are positioned in a region above and on both sides of the write wiring trace to surround the write wiring trace. | 10-01-2009 |
| 20090250252 | PRINTED CIRCUIT BOARD - A first insulating layer is formed on a suspension body and a wiring trace is formed on the first insulating layer. In addition, a ground trace is formed on the first insulating layer so as to extend along the wiring trace on one side of the wiring trace with a spacing therebetween. A second insulating layer is formed on the first insulating layer to cover the wiring trace and the ground trace. On the second insulating layer, a wiring trace is formed at a position above the wiring trace. A third insulating layer is formed on the second insulating layer to cover the wiring trace. The width of the wiring trace is set larger than the width of the wiring trace. At least a partial region of the ground trace and at least a partial region of the wiring trace are opposite to each other with part of the second insulating layer sandwiched therebetween. | 10-08-2009 |
| 20090316300 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A first insulating layer is formed on a suspension body. Wiring traces are formed in parallel at an interval on the first insulating layer. A second insulating layer is formed in a region on the first insulating layer on both sides of the wiring traces. A wiring trace is formed in a region on the second insulating layer on the side of the wiring trace. A wiring trace is formed in a region on the second insulating layer on the side of the wiring trace. A third insulating layer is formed on the first and second insulating layers to cover the wiring traces. | 12-24-2009 |
| 20100051334 | Printed Circuit Board and Method of Manufacturing the Same - A first insulating layer is formed on a suspension body. A write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer to cover the write wiring trace. A write wiring trace and read wiring traces are formed on the second insulating layer. The write wiring trace is arranged above the write wiring trace. The write wiring trace includes a conductor layer and reinforcing alloy layers. The reinforcing alloy layers are sequentially formed to cover an upper surface and side surfaces of the conductor layer. | 03-04-2010 |
