| Patent application number | Description | Published |
|---|
| 20090128174 | Probe card using thermoplastic resin - Disclosed is a probe card using thermoplastic resin. The probe card includes: a printed circuit board; a probe head that includes a plurality of terminals disposed on one surface thereof, the terminals being electrically connected to the printed circuit board; and a plurality of probe tips electrically connected to a plurality of the terminals and disposed on the other surface of the probe head, whereas the other surface of the probe head is formed of thermoplastic resin. According to the probe card, it is possible to reduce an inferior goods rate by protecting the probe head even during an etching process. | 05-21-2009 |
| 20090137073 | LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF - The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer. | 05-28-2009 |
| 20090141481 | Array light source using led and backlight unit including the same - Disclosed are an array light source using a light-emitting diode and a backlight unit including the same. In accordance with an embodiment of the present invention, the array light source can include a plurality of light-emitting diodes (LED); and a wiring board on which wires for transferring signals to each of the LEDs are formed. Here, the wiring board can include a plurality of sublayers, and the wires can be divided into at least two wiring groups and separately formed on different sublayers of the wring board per wiring group. | 06-04-2009 |
| 20090168449 | Light emitting diode unit - Disclosed is a light emitting diode unit, more particularly, a light emitting diode unit including a thermoplastic substrate, a light emitting diode, mounted on one surface of the thermoplastic substrate and a heat sink, directly adhered to the other surface of the thermoplastic substrate. With the present invention, the manufacturing cost and the manufacturing time of the light emitting diode unit can be reduced by allowing the heat sink, discharging the heat generated by the light emitting diode, to be directly adhered to the substrate on which the light emitting diode is mounted. Also, the heat discharging ability of the light emitting diode unit by using the heat sink directly adhered to the thermoplastic substrate. | 07-02-2009 |
| 20090189177 | Light emitting diode package and manufacturing method thereof - Disclosed are a light emitting diode package and a manufacturing method thereof. According to an embodiment of the present invention, the method includes: manufacturing a package main body having a plurality of cavities, the cavities being formed in a line on one surface, through molding by putting thermoplastic polymer into a previously produced mold; forming an electrode passing through the package main body; mounting a light emitting diode chip on a basal surface of the each cavity formed in the package main body; connecting electrically the light emitting diode chip and the electrode by using a bonding means; and sealing the light emitting diode chip and the bonding means by using a molding resin. | 07-30-2009 |
| 20090262520 | Backlight unit using a thermoplastic resin board - A backlight unit is disclosed. The backlight unit may include a thermoplastic resin board in which cavities may be formed, a light emitting diode (LED) component which may be mounted on a bottom surface of the cavity, and a molding resin which may be filled in the cavity and which may secure the light emitting diode component. The thermoplastic resin board may include a light-reflective filler, to improve reflection efficiency, dispersed within the thermoplastic resin board. According to certain embodiments of the invention, a simple process can be utilized to reduce the thickness of the backlight unit, making it applicable to compact devices. | 10-22-2009 |
| 20100031504 | METHOD OF MANUFACTURING PROBE CARD - A method of manufacturing a probe card is disclosed. The method in accordance with an embodiment of the present invention can include coupling a thermoplastic resin board to one surface of a probe head, forming a plurality of terminals on the other surface of the probe head, coupling a metal board to the thermoplastic resin board, and forming a probe tip by etching the metal board selectively. The method of the present invention can protect the probe head while etching and reduce percent defective of the probe card. | 02-11-2010 |
| 20100032407 | METHOD OF MANUFACTURING CERAMIC PROBE CARD - Provided is a method of manufacturing a ceramic probe card. A ceramic laminated body having a plurality of ceramic green sheets and an interlayer circuit including a conductive via and a conductive line formed in the plurality of ceramic green sheets is prepared. Then, at least one probe pin structure connected to the interlayer circuit is formed by selectively removing the plurality of photosensitive ceramic sheets having a ceramic powder and a photosensitive organic component on the ceramic laminated body necessarily, and by filling a metal material in a region from which the plurality of photosensitive ceramic sheets have been removed. Then, a ceramic substrate having the at least one probe pin structure is provided by simultaneously firing the ceramic laminated body and the photosensitive ceramic sheets, and by removing the photosensitive ceramic sheets. | 02-11-2010 |
| 20100039129 | PROBE CARD - Provided is a probe card. The probe card includes a ceramic substrate including a signal line, and a plurality of probe pins formed on the ceramic substrate, and including probe bodies having one end connected to the signal line and probe tips formed at other end of the probe body. The probe body is divided into a first section adjacent to the signal line and second section adjacent the probe tips. The first section is united by an insulating support, and the second sections are divergently arranged to position the probe tips at different measurement regions, respectively. | 02-18-2010 |
| 20100040984 | METHOD OF FABRICATING MICRO ELECTRO-MECHANICAL COMPONENT - A method of manufacturing a micro electro-mechanical component having a three-dimensional structure includes preparing a conductive substrate, selectively insulating or removing the conductive substrate to form a functional structure for performing a desired electro-mechanical function, forming a plated structure serving as an electrical connection portion on at least one surface of the functional structure, and mounting the functional structure on a circuit substrate so that the electrical connection portion is connected to a circuit pattern of the circuit substrate. | 02-18-2010 |
| 20100052711 | PROBE CARD AND MANUFACTURING METHOD OF THE SAME - There is provided a method of manufacturing a probe card, the method including: providing a first substrate including a plurality of probe pin patterns for forming a probe pin and at least one first stress relieving groove for relieving thermal stress; forming the probe pin by filling a metal material in the plurality of probe pin patterns; bonding a surface of the first substrate where the probe pin is formed onto a surface of a second substrate; and transferring the probe pin onto the second substrate by heating the first and second substrates bonded together. | 03-04-2010 |
| 20100116676 | METHOD OF FABRICATING PROBE PIN FOR PROBE CARD - Provided is a method of fabricating a probe pin. In the method, a concave region for a probe pin is formed on a mold substrate. The surface roughness of the concave region is reduced to smooth the surface of the concave region. A release layer is formed on the surface of the concave region of the mold substrate. A plating process is performed to form a probe pin corresponding to the concave region. After the performing of the plating process, the mold substrate having the probe pin is disposed on a circuit substrate and the probe pin is connected to a desired portion of the circuit substrate. Thereafter, the mold substrate is separated from the probe pin in such a way that the mold substrate remains unchanged. Also, the separated mold substrate may be reused. | 05-13-2010 |
| 20110043477 | Touch feedback panel, and touch screen device and electronic device inluding the same - A touch feedback panel includes a transparent electrode detecting a signal and a plurality of piezoelectric actuators disposed over the transparent electrode and partitioned into cells to generate a vibration only in a region where a signal is sensed. | 02-24-2011 |
| 20110050623 | Organic conductive composition and touch panel input device including the same - An organic conductive composition and a touch panel input device are provided. The organic conductive composition includes a conductive polymer, a dopant lowering electric resistance, an acrylic binder, and a viscosity control agent. The organic conductive composition has excellent transparency, low surface resistance, similar elongation and thermal expansion coefficient to that of a substrate. Accordingly, a conductive film of the touch panel input device including the organic conductive composition is not likely to be peeled off from the substrate, which makes it possible to increase the durability of the input device. | 03-03-2011 |
| 20110059232 | Method for forming transparent organic electrode - A method for forming a transparent organic electrode includes: preparing an organic conductive composition including a conductive material, a binder, and a solvent; preparing a substrate on which cutting lines demarcating cells are formed; forming a conductive layer by printing a conductive pattern within each of the cells demarcated by the cutting lines by using the organic conductive composition; and dicing the substrate along the cutting lines to separate the cells each having the conductive layer formed thereon. A transparent organic electrode can be formed with good transparency while consuming less raw materials and having a low defectivity rate. | 03-10-2011 |
| 20110063250 | Organic conductive composition and touch panel input device including the same - An organic conductive composition and a touch panel input device are provided. The organic conductive composition includes: 10 to 70 parts by weight of a conductive polymer; 0.01 to 40 parts by weight of a dopant selected from the group consisting of Lewis acids capable of accepting electrons; 1 to 40 parts by weight of a binder; and 1 to 30 parts by weight of a viscosity control agent, wherein the organic conductive composition has a viscosity ranging from 1 to 100,000 mPas. | 03-17-2011 |
| 20110080368 | Input device of touch screen and method of manufacturing the same - There is provided an input device of a touch screen and a method of manufacturing the same. A input device of a touch screen according to an aspect of the invention may include: a first board and a second board arranged to face each other; a first conductive layer and a second conductive layer provided on the first board and the second board, respectively, while the first conductive layer and the second conductive layer face each other; and a zinc oxide thin film provided on the first conductive layer and aligned in a c-axis direction, wherein electrical changes in the zinc oxide thin film caused by mechanical deformation, applied to one region of the second conductive layer, are detected in the first conductive layer. | 04-07-2011 |
| 20110109564 | TOUCH SCREEN INPUT DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed is a touch screen input device, which includes a window plate through which a signal is input, a conductive film applied on one surface of the window plate using a conductive polymer, a first adhesive layer applied on one surface of the conductive film, and an anti-noise film applied on one surface of the first adhesive layer using a conductive polymer and thus grounded, so that the conductive film is directly applied on the window plate, thus omitting bonding of an additional film coated with a conductive film to the window plate, thereby preventing the generation of foam and simplifying the manufacturing process. A method of manufacturing the touch screen input device is also provided. | 05-12-2011 |
| 20110147668 | CONDUCTIVE POLYMER COMPOSITION AND CONDUCTIVE FILM PREPARED USING THE SAME - Disclosed herein is a conductive polymer composition, including: a conductive polymer; a liquid crystal polymer; and a polar solvent. The conductive polymer composition according to the present invention, differently from a general conductive polymer, can prevent the deterioration of conductive properties by using a minimum of binder or without using any binder at all. Therefore, the conductive polymer film prepared using the conductive polymer composition can be used in electrodes for various display devices, such as liquid crystal displays (LCDs), transparent touch panels, e-papers, organic light emitting diodes (OLEDs) and the like, because it has a low surface resistance of 10˜1000 Ω/□. | 06-23-2011 |
| 20110151201 | TRANSPARENT ELECTRODE FILM AND METHOD OF MANUFACTURING THE SAME - Disclosed is a transparent electrode film for a touch screen, which includes a transparent substrate, an assistant adhesive layer formed on each of both surfaces of the transparent substrate, and a transparent conductive polymer layer formed on the assistant adhesive layer, thus obviating a need for an optically clear adhesive film and resulting in increased transmittance and superior price competitiveness. A method of manufacturing the transparent electrode film is also provided. | 06-23-2011 |
