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Ho-Jeong
Ho-Jeong Choi, Yongin-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090009204 | Test socket - A test socket in accordance with one aspect of the present invention includes a socket body, a thermoelectric element and a heat transfer member. The socket body receives an object. The thermoelectric element is arranged in the socket body to emit heat and absorb heat in accordance with current directions. The heat transfer member is arranged between the object and the thermoelectric element to transfer a heat generated from the object to the thermoelectric element. Thus, the object may be directly provided with a desired test temperature using the thermoelectric element so that the desired test temperature may be set rapidly and accurately. Further, the heat transfer member interposed between the object and the thermoelectric element may quickly dissipate the heat in the object. | 01-08-2009 |
| 20090028571 | ELECTRICAL SIGNAL TRANSMISSION MODULE, METHOD OF TRANSMITTING ELECTRIC SIGNALS AND ELECTRICAL INSPECTION APPARATUS HAVING THE SAME - An electrical signal transmission module includes a plurality of optical signal lines and a plurality of electrical signal lines. The plurality of optical signal lines converting a first externally input electrical signal into an optical signal, transmitting the optical signal, converting the optical signal back into the first electrical signal, and outputting the first electrical signal. The plurality of electrical signal lines transmitting a second externally input electrical signal and outputting the second electrical signal. | 01-29-2009 |
| 20100176796 | Apparatus for testing electrical characteristics - An apparatus for testing electrical characteristics includes a probe configured to contact a test object, a DC signal transmission line configured to transmit a DC signal to the probe, a frequency signal transmission line configured to transmit a frequency signal to the probe, and a line selection unit configured to selectively connect only one of the frequency signal transmission line and the DC signal transmission line to the probe at a time in accordance with a selected test. | 07-15-2010 |
Ho-Jeong Lee, Gyeonggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20100196370 | FUSION PROTEIN OF IMMUNOGLOBULIN FC AND HUMAN APOLIPOPROTEIN(A) KRINGLE FRAGMENT - The present invention relates to an LK8-Fc fusion protein, which has increased angiogenesis inhibitory activity and in vivo stability. More specifically, relates to an LK8-Fc fusion protein in which an LK8 protein having angiogenesis inhibitory activity is fused with the Fc region of human immunoglobulin IgG1, as well as a composition for treating cancer, which contains the fusion protein. The LK8-Fc fusion protein has not only angiogenesis inhibitory activity leading to anticancer and metastasis inhibitory activities, but also a very long in vivo half-life, and thus can be used as a more efficient and economic cancer therapeutic agent or cancer inhibitor. | 08-05-2010 |
Ho-Jeong Moon, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090146300 | Semiconductor packages and electronic products employing the same - Example embodiments of a semiconductor package are provided. In accordance with an example embodiment, a semiconductor package may include an external terminal connected to a concave surface of a bottom pad, wherein the bottom pad is recessed into a substrate. In accordance with another example embodiment, a semiconductor package may include at least one external terminal, a flexible substrate having a first surface with a plurality of convex portions and a second surface opposite the first surface having a plurality of concave portions, wherein the at least one terminal is recessed into the substrate and at least one of the concave portions surrounds a portion of the at least one external terminal. | 06-11-2009 |
| 20100206062 | ADHESION TEST METHOD USING ELASTIC PLATE - Provided is a method for testing adhesion. The method includes forming thin films on a substrate; attaching an elastic plate to the substrate, wherein the elastic plate has a larger elastic coefficient than the substrate; and performing an adhesion test on the thin films using an adhesion test apparatus. | 08-19-2010 |
Ho-Jeong Moon, Hwasung-City KR
| Patent application number | Description | Published |
|---|---|---|
| 20100177165 | METHOD OF CONDUCTING PRECONDITIONED RELIABILITY TEST OF SEMICONDUCTOR PACKAGE USING CONVECTION AND 3-D IMAGING - A precondition reliability test of a semiconductor package, to determine a propensity of the package to delaminate, includes a baking test of drying the package, a moisture soaking test of moisturizing the dried package, a reflow test of heat-treating the moisturized package using hot air convection, and a three-dimensional imaging of the package to acquire a 3-D image of a surface of the package. The three-dimensional imaging is preferably carried out using a Moire interferometry technique during the course of the reflow test. Therefore, the delamination of the package can be observed in real time so that data on the start and rapid development of the delamination can be produced. The method also allows data which can be ordered as a Weibull Plot to be produced, thereby enabling a quantitative analysis of the reliability test results. | 07-15-2010 |
Ho-Jeong Yu, Incheon KR
| Patent application number | Description | Published |
|---|---|---|
| 20110290184 | POLY SILICON DEPOSITION DEVICE - Provided is a poly silicon deposition device, which includes an electrode part, a silicon core rod part, a silicon core rod heating part, a gas supply pipe, and a gas injection part. The electrode part includes a first electrode and a second electrode which are disposed in a bottom of a reactor including a gas inlet for introducing source gas, a gas outlet for discharging gas, and a heating material inlet for introducing a heating material, and are spaced a predetermined distance from each other. The silicon core rod part receives electric current from the first electrode and transmits the electric current to the second electrode to generate heat. The silicon core rod heating part is spaced a predetermined distance from the silicon core rod part and surrounds the silicon core rod part and includes a heater receiving the heating material introduced through the heating material inlet of the reactor. The gas supply pipe is disposed between the heater and the silicon core rod part to supply the source gas introduced through the gas inlet of the reactor, to the silicon core rod part. The gas injection part includes a plurality of nozzles disposed in a surface of the gas supply pipe to discharge the source gas to the silicon core rod part. | 12-01-2011 |