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Hizume, JP
Kentaro Hizume, Kyoto JP
| Patent application number | Description | Published |
|---|---|---|
| 20100294947 | FLUORESCENT MEASUREMENT DEVICE FOR LIVING BODY AND EXCITING LIGHT-IRRADIATING DEVICE FOR FLUORESCENT MEASUREMENT - Disclosed herein is a fluorescence measurement device for a living body configured to be able to reduce wavelength components that will become leak light and to easily switch a wavelength and an irradiation direction. The fluorescence measurement device for a living body comprises: a sample holder on which a living body sample is to be placed; an exciting light-irradiating device having a plurality of exciting light sources arranged at mutually different positions, each of which is composed of a laser diode or a light-emitting diode and is provided with a filter having an optical property to eliminate, from a spectrum of the exciting light source, disturbing wavelength components overlapping with wavelength components of fluorescence to be detected; an electrical switch for switching lighting of the exciting light sources; a detector for picking up an image produced by fluorescence emitted from the sample placed on the sample holder; and an image display device for displaying the image picked up by the detector. | 11-25-2010 |
| 20110164124 | BIOLOGICAL IMAGE ACQUISITION DEVICE - This object aims to disclose a biological multi-directional observation device with measures to avoid an illumination backlight problem taken. In a preferable embodiment of the multi-directional observation device, a two-dimensional detector ( | 07-07-2011 |
Ryoko Hizume, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20080227463 | DETERMINING LOCATION INFORMATION | 09-18-2008 |
| 20090005062 | METHOD AND APPARATUS FOR SELECTING A REAL TIME LOCATION SERVICE PROVIDER - A method and apparatus for selecting a real time location service provider enables improved positioning services. The method includes processing a request for a position of a portable electronic device, where the request identifies at least one local access point and a connected cellular communication cell to which the device is operatively connected (step | 01-01-2009 |
Takeshi Hizume, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20080303801 | Display apparatus and display method - A display apparatus includes a display section, a touch panel on the display surface of the section to allow the user to specify a desired position on the displayed image being displayed on the section by pressing a pointer against it, a display control section causes a plurality of indicators to be displayed on the section for allowing the user to select one of them via the panel and a notifier section notifies the user of the indicator selected from them. The notifier section notifying the user of the selection of a indicator when the indicator of them being displayed on the section is selected by pressing the pointer against the panel, and the control section is adapted to finalize the selection by the user of a indicator when the pointer selecting the indicator is moved away from the panel after selecting it by being pressed against the panel. | 12-11-2008 |
Taro Hizume, Ishikawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20080199101 | Image Processing Apparatus and Image Processing Program - [PROBLEM TO BE SOLVED] It is an object of the present invention to provide an image processing apparatus capable of obtaining a sharp image having less noise. | 08-21-2008 |
| 20090232395 | IMAGE PROCESSING DEVICE - An image signal inputted from an image signal input unit ( | 09-17-2009 |
Tarou Hizume, Ishikawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20090022408 | IMIAGE PROCESSING APPARATUS AND IMAGE PROCESSING PROGRAM - It is an object to provide an image processing apparatus and an image processing program in which motion information detected from an image is used for a different image processing corresponding to image information so that the detected motion information capable of easily synchronizing the image with the motion information to reduce a circuit scale is shared in a signal processing requiring a plurality of motion information. Motion information is detected by a motion detecting portion ( | 01-22-2009 |
Tohru Hizume, Nagano-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110045642 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A method of manufacturing a semiconductor package comprises: preparing a photosensitive insulating material having a first surface and a second surface opposite to the first surface; bonding a semiconductor chip to the first surface of the photosensitive insulating material with a connecting terminal of the semiconductor chip facing the first surface of the photosensitive insulating material; exposing the second surface of the photosensitive insulating material after the bonding the semi-conductor to the first surface of the photosensitive material; encapsulating the first surface of the photosensitive insulating material, and the semiconductor chip bonded to the first surface, with a resin to form a resin encapsulated portion after exposing the second surface of the photosensitive insulating material; and developing the photosensitive insulating material, thereby forming a through-hole communicating with the connecting terminal of the semiconductor chip in the photosensitive insulating material after the exposing the second surface of the photosensitive insulating material. | 02-24-2011 |
Toru Hizume, Nagano JP
| Patent application number | Description | Published |
|---|---|---|
| 20110104886 | MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE - A manufacturing method includes forming a semi-cured insulation layer made of a photosensitive material on a supporting body; forming an opening part in the insulation layer by a photolithography method, the opening part being configured to expose the supporting body; arranging a semiconductor chip on the insulation layer so that a position of an electrode of the semiconductor chip is consistent with a position of the opening part, and curing the insulation layer; forming sealing resin on a surface of the insulation layer at the semiconductor chip side, the sealing resin being configured to seal the semiconductor chip; removing the supporting body; and providing a wiring layer on a surface of the insulation layer opposite to the semiconductor chip side, the wiring layer being electrically connected to the electrode exposed in the opening part, so that a wiring structural body including the insulation layer and the wiring layer is formed. | 05-05-2011 |
Toru Hizume, Nagano-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20080303153 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE PRODUCT - In a semiconductor device, a semiconductor element is built into a resin molded part molded in a flat plate shape. A wiring is electrically connected to the semiconductor element and is disposed on one surface of the resin molded part so that an inner surface side of the wiring is sealed with the resin molded part and an outer surface of the wiring is exposed flush with the one surface of the resin molded part. An electrode is disposed on the wiring in an outside of a plane area of the semiconductor element and extends through the resin molded part in a thickness direction. A tip part of the electrode protrudes from the other surface of the resin molded part. | 12-11-2008 |
| 20090135574 | WIRING BOARD, SEMICONDUCTOR DEVICE HAVING WIRING BOARD, AND METHOD OF MANUFACTURING WIRING BOARD - The present disclosure relates to a method of manufacturing a wiring board. The method includes: (a) preparing a first board having a pad; (b) providing an insulating member on the first board, wherein a size of the insulating member is larger than that of the first board, when viewed from the top; (c) forming a via in the insulating member such that the via is directly connected to the pad; and (d) repeatedly forming a wiring layer and an insulating layer on the insulating member in which the via is formed, thereby forming a second board. | 05-28-2009 |
| 20100225001 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE - In a method for manufacturing a semiconductor device having a plate-shaped member, a semiconductor element, and a wiring board, the manufacturing method for the semiconductor device includes: a concave portion forming step (S | 09-09-2010 |
| 20110010932 | WIRING BOARD, SEMICONDUCTOR DEVICE HAVING WIRING BOARD, AND METHOD OF MANUFACTURING WIRING BOARD - The present disclosure relates to a method of manufacturing a wiring board. The method includes: (a) preparing a first board having a pad; (b) providing an insulating member on the first board, wherein a size of the insulating member is larger than that of the first board, when viewed from the top; (c) forming a via in the insulating member such that the via is directly connected to the pad; and (d) repeatedly forming a wiring layer and an insulating layer on the insulating member in which the via is formed, thereby forming a second board. | 01-20-2011 |