| Patent application number | Description | Published |
|---|
| 20110259564 | THERMAL CONDUCTIVE SHEET - A thermal conductive sheet contains a plate-like boron nitride particle, wherein the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more. The breakdown voltage of the thermal conductive sheet as measured in conformity with JIS C 2110 (2010) is 10 kV/mm or more. | 10-27-2011 |
| 20110259565 | HEAT DISSIPATION STRUCTURE - A heat dissipation structure includes a substrate, an electronic component mounted on the substrate, a heat dissipation member for dissipating heat generated from the electronic component, and a thermal conductive adhesive sheet provided on the substrate so as to cover the electronic component. The thermal conductive adhesive sheet includes a thermal conductive layer containing a plate-like boron nitride particle. The thermal conductive layer has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive layer of 4 W/m·K or more, and the thermal conductive adhesive sheet is in contact with the heat dissipation member. | 10-27-2011 |
| 20110259566 | THERMAL CONDUCTIVE SHEET - A thermal conductive sheet contains a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more. The thermal conductive sheet does not fall off from an adherend in the initial adhesion test ( | 10-27-2011 |
| 20110259567 | THERMAL CONDUCTIVE SHEET - A thermal conductive sheet includes a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more, and the 5% weight loss temperature of 250° C. or more. The thermal conductive sheet has a water absorption of 3 vol % or less. | 10-27-2011 |
| 20110259568 | THERMAL CONDUCTIVE SHEET - A thermal conductive sheet containing a plate-like boron nitride particle, wherein the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more, and a glass transition point determined as the peak value of tanδ obtained by measuring a dynamic viscoelasticity of the thermal conductive sheet at a frequency of 10 Hz is 125° C. or more. | 10-27-2011 |
| 20110259569 | THERMAL CONDUCTIVE SHEET - A thermal conductive sheet contains a plate-like boron nitride particle. The proportion of the boron nitride particle content is 35 vol % or more, and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more. | 10-27-2011 |
| 20110260185 | LIGHT-EMITTING DIODE DEVICE - A light-emitting diode device includes a light-emitting diode, a power circuit portion for supplying electric power to the light-emitting diode, and a heat dissipating member for dissipating the heat generated from the light-emitting diode. The heat dissipating member is made of a thermal conductive sheet which contains a plate-like boron nitride particle. The thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more. | 10-27-2011 |
| 20110262728 | THERMAL CONDUCTIVE SHEET, LIGHT-EMITTING DIODE MOUNTING SUBSTRATE, AND THERMAL CONDUCTIVE ADHESIVE SHEET - A thermal conductive sheet contains a plate-like boron nitride particle, has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more, and has a volume resistivity of 1×10 | 10-27-2011 |
