| Patent application number | Description | Published |
|---|
| 20100012299 | HEAT EXCHANGER UNIT - According to the present invention, there is provided a heat exchanger unit having, over a base, a surface-modified portion composed of a metal, the surface-modified portion being brought into contact with a flow path provided for a liquid refrigerant, wherein the liquid refrigerant is a liquid having a surface tension smaller than that of water, and the surface-modified portion has a porous structure, in which a plurality of recesses are provided on the flow path side thereof, each recess has an introduction path having a cross-section area gradually reduced from the inlet of the recess, and a cavity communicated with the introduction path while placing an inflection portion in between, and the shortest distance between the inflection portion and the flow path is larger than the shortest distance between the cavity and the flow path. | 01-21-2010 |
| 20100025019 | HEAT EXCHANGER FOR COOLING SEMICONDUCTOR CHIP AND METHOD OF MANUFACTURING THE SAME - Behavior of a vapor bubble that emerges should be controlled to improve operational stability and reliability of a phase shift heat exchanger having a microchannel. The heat exchanger has a dual layer structure and includes a material that is elastically deformed according to pressure difference between the layers. The layers are connected, and at the connection interface a resistance unit that exerts a predetermined resistance against a coolant flowing from the coolant supplying layer toward the microchannel layer is provided, to maintain internal pressure of the coolant supplying layer higher than that of the microchannel, under a normal operation. Once a vapor bubble emerges, the relationship in strength of the internal pressure is turned over, and the elastic material is lifted so that the vapor bubble is dividedly distributed over a plurality of microchannels. Alternatively, the internal pressure of the coolant supplying layer may be maintained lower than that of the microchannel, so that once a vapor bubble emerges the vapor bubble is drawn to the lower pressure side. | 02-04-2010 |
| 20100065260 | VIBRATION GENERATING AND COOLING APPARATUS - There is provided an energy-saving vibration generating and cooling apparatus with a small volume in which convection is created inside and outside its cabinet and which can effectively transfer heat. It includes a motor | 03-18-2010 |
| 20110001898 | LIQUID CRYSTAL DISPLAY DEVICE - A liquid crystal display device includes a sealed housing part, a liquid crystal display part disposed at the front face of the housing part, a light source part housed in the housing part to generate the light to be displayed on the liquid crystal display part, an electric power supply part housed in the housing part to perform electric power supply, a control part housed in the housing part to perform control, and a heat exchange part disposed at the rear face of the housing part to cool the heat generated in the housing part. The heat exchange part includes an air stirring part for stirring the air in the housing part, a forced air cooling part covered with a duct in which the air stirring part is installed and constructed from a plate extending into the housing part, and a natural air cooling part constructed from a plate extending to the outside of the housing part. The forced air cooling part and the natural air cooling part are integrated with a rear face plate of the housing part. | 01-06-2011 |
| 20110114384 | ELECTRONIC APPARATUS, IMAGE DISPLAY APPARATUS AND METHOD OF COOLING ELECTRONIC APPARATUS - Resistivity to dust and cooling performance are improved by a simple structure. Electronic apparatus (image display apparatus) | 05-19-2011 |
| 20110192574 | COOLING STRUCTURE, ELECTRONIC DEVICE USING SAME, AND COOLING METHOD - A maintenance-free cooling structure is provided which, by removing bubbles produced on a boiling surface utilizing an action other than buoyancy, heat change (heat transfer) is effectively brought about on the boiling surface, thus enabling efficient cooling and its miniaturization and low power consumption. The cooling structure has an evaporation chamber | 08-11-2011 |
| 20110214840 | BOILING HEAT TRANSFER DEVICE - A boiling heat transfer device of the present invention includes: a heat receiving portion that boils a liquefied refrigerant to convert it to vapor, and contacts with a device to be cooled and cools the device to be cooled; a vapor tube that connects to an upper portion of the heat receiving portion and conveys the vapor generated by the heat receiving portion; a heat dissipating portion that condenses the vapor conveyed from the vapor tube to convert it to a liquefied refrigerant and dissipates heat to an atmosphere; and a liquid tube that returns to the heat receiving portion the liquefied refrigerant condensed by the heat dissipating portion. At least a portion of a cross-sectional area of a flow passage of the vapor in the heat receiving portion gradually decreases from a lower portion of the heat receiving portion toward the upper portion of the heat receiving portion. | 09-08-2011 |
| 20110279978 | COOLING DEVICE - A cooling device of the present invention includes: a substrate having a first surface which supports an electronic component and a second surface on an opposite side to the first surface; a container which can form a space between itself and the second surface of the substrate; and an evaporation section which is thermally connected to the electronic component supported on the substrate, which is arranged in the space so that at least a portion thereof is in contact with a liquid within the space, and which changes a phase of at least a portion of the liquid to gas on a basis of heat generated by the electronic component. | 11-17-2011 |
