| Patent application number | Description | Published |
|---|
| 20110057228 | RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT HOUSING PACKAGE, AND OPTICAL SEMICONDUCTOR LIGHT-EMITTING DEVICE OBTAINED USING THE SAME - The present invention relates to a resin composition for forming an insulating resin layer for optical semiconductor element housing package having a concave portion in which a metal lead frame and an optical semiconductor element mounted thereon are housed, in which the resin composition includes the following ingredients (A) to (D), and the ingredients (C) and (D) are contained in a blend ratio (C)/(D) of 0.3 to 3.0 as a weight ratio thereof: (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a white pigment; and (D) an inorganic filler. | 03-10-2011 |
| 20110058776 | RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, OPTICAL-SEMICONDUCTOR-DEVICE LEAD FRAME OBTAINED USING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE - The present invention relates to a resin composition for optical semiconductor devices, the resin composition including the following ingredients (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a polyorganosiloxane; and (D) a white pigment. | 03-10-2011 |
| 20110309384 | SEMICONDUCTOR LIGHT EMITTING DEVICE - The present invention relates to a semiconductor light emitting device including: a substrate for element mounting; a wiring provided on the substrate; an LED element provided on the substrate and electrically connected to the wiring; an encapsulating resin layer for encapsulating the LED element; and a wavelength conversion layer which contains a phosphor material and converts a wavelength of light emitted by the LED element, in which the wavelength conversion layer is provided on an upper side of the LED element, and a diffusive reflection resin layer is provided in a state that side faces of the LED element are surrounded therewith, and an area at the LED element face side of the wavelength conversion layer is at least twice larger by area ratio than an area of light emitting area on an upper surface of the LED element. | 12-22-2011 |
| 20110309398 | COMPOSITE FILM AND SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE SAME - The present invention relates to a composite film including a wavelength conversion layer and a diffusive reflection resin layer in a laminated state and being used in a semiconductor light emitting device, in which the wavelength conversion layer contains a phosphor material which absorbs a part or all of excitation light and is excited to emit visible light in a wavelength region longer than a wavelength of the excitation light, the diffusive reflection resin layer is selectively formed with patterning on one surface of the wavelength conversion layer, and a region on the one surface of the wavelength conversion layer where the diffusive reflection resin layer is not formed with patterning is a path of the excitation light which excites the phosphor material in the wavelength conversion layer. | 12-22-2011 |
| 20120012875 | COMPONENT FOR LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE AND PRODUCING METHOD THEREOF - A component for a light-emitting device includes a fluorescent layer that is capable of emitting fluorescent light and a housing that is connected to the fluorescent layer for housing a light-emitting diode. | 01-19-2012 |
| 20120014088 | COMPONENT FOR LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE AND PRODUCING METHOD THEREOF - A component for a light-emitting device includes a fluorescent layer capable of emitting fluorescent light, and a lens connected onto the fluorescent layer. | 01-19-2012 |
| 20120015463 | METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE - The present invention relates to a method for manufacturing a light-emitting device, the method including applying resin encapsulation to a lead frame having mounted and packaged thereon a plurality of light-emitting elements, in which the following lead frame portion (A) is used as the lead frame portion: (A) a lead frame portion that is obtained by cutting and separating a lead frame, in which the lead frame has a lattice form including a plurality of rows and a plurality of columns with a plurality of intersection points formed thereby and has a plurality of light-emitting elements disposed and packaged between the adjacent intersection points in each row, into individual column to produce a lead frame portion for each column, and that is passed a light emission test performed by flowing a current to the lead frame portion. | 01-19-2012 |
| 20120025247 | COMPONENT FOR LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE AND PRODUCING METHOD THEREOF - A component for a light-emitting device includes a sealing resin layer that is capable of sealing in a light emitting diode, a fluorescent layer that is formed on one face of the sealing resin layer and is capable of emitting fluorescent light, and a reflection layer that is provided on the other face of the sealing resin layer so as to avoid a region where the sealing resin layer seals in the light emitting diode and is capable of reflecting the light. | 02-02-2012 |
| 20120028375 | INSPECTION METHOD OF LIGHT-EMITTING DEVICE AND PROCESSING METHOD AFTER INSPECTION OF LIGHT-EMITTING DEVICE - The present invention relates to a method for inspecting a light-emitting device, the method including performing a light emission test of (A) a light-emitting device including a lead frame having mounted and packaged thereon a plurality of light-emitting elements or (B) a light-emitting device obtained by resin encapsulating and packaging the light-emitting device (A), by applying a current to the plurality of light-emitting elements and judging each light-emitting element as passed or failed, in which arrangement of the plurality of light-emitting elements in the light-emitting device is set as in the following (α): (α) In a lead frame having a lattice form including a plurality of rows and a plurality of columns with a plurality of intersection points formed thereby, a plurality of light-emitting elements are disposed between the adjacent intersection points in each row, the adjacent light-emitting elements in each row are connected to each other so that positive electrode terminals or negative electrode terminals thereof face each other, and a positive-side power supply channel or a negative-side power-supply channel in the lead frame works as a common channel between a certain column and a column adjacent thereto. | 02-02-2012 |
