| Patent application number | Description | Published |
|---|
| 20090272995 | RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION, AND OPTICAL SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME - An epoxy resin composition for optical semiconductor element encapsulation includes an epoxy resin (Component (A)) mainly containing an epoxy compound represented by a specific structural formula (1), a curing agent (Component (B)), and at least one of an oxynitride phosphor and a nitride phosphor (Component (C)). Therefore, the phosphor component (C) is uniformly dispersed in the epoxy resin composition without segregation. Thus, the resin composition serves as an excellent optical semiconductor element encapsulation material which has an adequate light diffusion property and a high light transmittance and permits a reduction in internal stress. Therefore, a light emitting diode element encapsulated with the epoxy resin composition is capable of stably emitting light, and satisfactorily performs its functions. | 11-05-2009 |
| 20090295003 | RESIN COMPOSITION FOR OPTICAL COMPONENTS, OPTICAL COMPONENT USING THE SAME AND PRODUCTION METHOD OF OPTICAL LENS - The present invention relates to a resin composition for optical components, which is an ultraviolet-curable transparent resin composition used as a material for an optical component, in which the resin composition includes (A) an epoxy resin having two or more epoxy groups in one molecule thereof, (B) an oxetane compound having one or more oxetanyl groups in one molecule thereof and (C) a photo-acid generator, and in which the component (C) is contained in an amount of 0.01 to 2.0 parts by weight based on 100 parts by weight of a total amount of the components (A) and (B). The present invention also relates to an optical component obtained by using the resin composition for optical components, and a production method thereof. | 12-03-2009 |
| 20090311630 | PROCESS FOR PRODUCING OPTICAL COMPONENT - The present invention relates to a process for producing an optical component, the process including: disposing a transparent stamp tool on a substrate or an imaging element through a transparent ultraviolet-curable resin composition layer; and irradiating the resin composition layer with an ultraviolet ray through the transparent stamp tool to thereby cure the resin composition layer, in which a resin composition contained in the resin composition layer contains a thermosetting resin as a main component and a photo-acid generator, and the ultraviolet ray passing through the transparent stamp tool is an ultraviolet ray having a wavelength of 320 nm or more. | 12-17-2009 |
| 20100019271 | EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for optical semiconductor element encapsulation, the epoxy resin composition including following components (A) to (C): | 01-28-2010 |
| 20100041799 | Epoxy Resin Composition for Optical-Semiconductor Encapsulation, Cured Resin Thereof, and Optical Semiconductor Device Obtained with the same - The present invention relates to an epoxy resin composition for optical-semiconductor encapsulation which comprises the following ingredients (A) to (C): (A) an epoxy resin; (B) a curing agent; and (C) a naphthalocyanine colorant. The epoxy resin composition of the invention transmits visible rays and shields near infrared rays while retaining properties inherent in the epoxy resin. | 02-18-2010 |
| 20100292358 | RESIN COMPOSITION FOR OPTICAL COMPONENTS AND OPTICAL COMPONENT USING THE SAME - The present invention relates to a resin composition for optical components, the resin composition being an ultraviolet-curable transparent resin composition to be used as a material for an optical component, in which the resin component includes the following component (A) as a main component and the following component (B) being a photo-cationic polymerization initiator: (A) an epoxy resin having two or more epoxy groups in one molecule thereof; and (B) an onium salt containing a hexafluorophosphate ion as an anion component. | 11-18-2010 |
| 20110316031 | TRANSFER SHEET FOR PHOSPHOR LAYER AND LIGHT-EMITTING DEVICE - A transfer sheet for a phosphor layer includes a release substrate, a phosphor layer formed on the release substrate, and an adhesive layer formed on the phosphor layer. | 12-29-2011 |
| 20110316032 | PHOSPHOR LAYER AND LIGHT-EMITTING DEVICE - A phosphor layer is composed of a resin in which phosphor particles and light scattering particles are dispersed. | 12-29-2011 |
