| Patent application number | Description | Published |
|---|
| 20100101626 | SOLAR BATTERY APPARATUS, PORTABLE ELECTRONIC DEVICE, AND GLOBAL POSITIONING SYSTEM APPARATUS - A solar battery apparatus | 04-29-2010 |
| 20100147377 | SOLAR CELL MODULE AND METHOD FOR PRODUCING THE SAME - An object of the present invention is to provide a solar cell module in which a solar cell element connected with a substrate by wire bonding is sealed and which is capable of preventing deformation of a bonding wire. For this object, the solar cell module of the present invention is designed such that the bonding wire is sealed with potting resin so that a surface of the solar cell element, which surface is opposite to the substrate, is exposed. | 06-17-2010 |
| 20100148311 | SEMICONDUCTOR DEVICE - Patterns provided on a surface of a substrate include an adhesion area pattern and one or more non-adhesion area patterns. A chip electrode on a backside of a semiconductor chip is attached to the adhesion area pattern by a conductive adhesive. Consequently, an area of patterns subjected to gold plating that is stable in a steady state is smaller in a substrate of the present invention than in a conventional substrate, resulting in reduction in costs. Further, the chip electrode is attached to the adhesion area pattern by a conductive adhesive in a liquid form. Consequently, a semiconductor device of the present invention allows reducing use of an expensive conductive adhesive compared with a conventional semiconductor device, resulting in reduction in costs. | 06-17-2010 |
| 20100294342 | SOLAR CELL MODULE AND ELECTRONICS DEVICE INCLUDING THE SOLAR CELL MODULE - A solar cell module | 11-25-2010 |
| 20100294358 | SEMICONDUCTOR PACKAGE - A semiconductor chip and an interposer are bonded by a conductive die bonding material. Between the semiconductor chip and the interposer, an application region in which the die bonding material resides and a region in which a sealing resin resides are provided. This allows adhesivity between the semiconductor chip and the interposer to be higher than that in conventional semiconductor packages, thereby causing no detachment at the adhesive interface. As a result, it becomes possible to improve electrical property and long-term reliability as compared to conventional semiconductor packages. Moreover, it is also possible to prevent the semiconductor chip from warping. | 11-25-2010 |
| 20100313930 | SOLAR BATTERY MODULE, AND ELECTRONIC COMPONENT, ELECTRIC COMPONENT AND ELECTRONIC APPARATUS MOUNTING THE SAME - All solar battery cells are in a matrix disposition. Each row of the matrix includes at least two cell groups, and each column of the matrix includes at least two cell groups. | 12-16-2010 |
| 20110064984 | SOLAR BATTERY MODULE SUBSTRATE AND SOLAR BATTERY MODULE - A solar battery module substrate includes an insulating substrate on which a conductive pattern and an insulating protective film are formed, the conductive pattern including: cathode mounting terminals each of which is to be connected with a cathode of a solar battery cell; anode mounting terminals each of which is to be connected with an anode of the solar battery cell; and first module wiring, the first module wiring connecting a cathode mounting terminal to be connected with a cathode of one solar battery cell with an anode mounting terminal to be connected with an anode of another solar battery cell connected in series with said one solar battery cell, the insulating protective film having at least one opening for exposing the cathode mounting terminal and the anode mounting terminal, and the opening being positioned inside a portion of the solar battery module substrate on which portion the solar battery cell is to be projected. | 03-17-2011 |
