| Patent application number | Description | Published |
|---|
| 20090178496 | REAGENT VESSEL CAP AND METHOD FOR COLLECTING REAGENT - A reagent vessel cap includes a sealing member for sealing the opening of a vessel body; an pressurizing member linked to a retaining part for sealing the sealing member, for bringing the sealing member in close contact with the opening all the time, wherein when pressure is applied, the pressurizing member lifts the sealing member against the biasing force of itself to open the vessel and, when the pressure is eliminated, the pressurizing member returns to position by the biasing force to close the vessel by the sealing member; and a cap body capable of mounting the sealing member and the pressurizing member to the opening of the vessel body containing a reagent. The reagent is collected using the cap structure. | 07-16-2009 |
| 20090260703 | Resin Pipe with Mouthpiece and Method of Manufacturing the Same - Disclosed is a resin pipe with a mouthpiece comprising: a mouthpiece; and a resin pipe of which one end is joined to the mouthpiece, wherein the one end is disposed in the mouthpiece, and an outer peripheral surface of the one end is joined to an inner peripheral surface of the mouthpiece by fusion. | 10-22-2009 |
| 20090260745 | Method of Manufacturing Resin Pipe - Disclosed is a method for manufacturing a resin pipe, including: heating a sheet member after winding the sheet member around a bar desired multiple times and holding the sheet member, wherein the sheet member is melted and molded into a resin pipe by the heating, and the bar is removed from the resin pipe after the heating. | 10-22-2009 |
| 20090317948 | METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A method is provided for manufacturing a QFN type semiconductor integrated circuit device using a multi-device lead frame having a tie bar for tying external end portions of plural leads, wherein sealing resin filled between an outer periphery of a mold cavity and the tie bar is removed by a laser and thereafter a surface treatment such as solder plating is performed. | 12-24-2009 |
| 20100123240 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device is provided with improved reliability. A semiconductor chip is mounted over a chip mounting portion of a lead frame via solder. A metal plate is arranged over a source pad of the semiconductor chip and a lead portion of a lead frame via solder. A solder reflow process is performed thereby to bond the semiconductor chip over the chip mounting portion with a solder, and to bond the metal plate to the source pad and the lead portion with the other solders. The lead frame is formed of a copper alloy, and thus has its softening temperature higher than the temperature of the solder reflow process. The metal plate is formed of oxygen-free copper, and has its softening temperature lower than the temperature of the solder reflow process, whereby the metal plate is softened in the solder reflow process. Thereafter, a gate pad electrode of the semiconductor chip is coupled to a lead portion via the wire, a sealing resin portion is formed, and then the lead frame is cut. | 05-20-2010 |
| 20100258922 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - To prevent, in a resin-sealed type semiconductor package, generation of cracks in a die bonding material used for mounting of a semiconductor chip. A semiconductor chip is mounted over the upper surface of a die pad via a die bonding material, followed by sealing with an insulating resin. The top surface of the die pad to be brought into contact with the insulating resin is surface-roughened, while the bottom surface of the die pad and an outer lead portion are not surface-roughened. | 10-14-2010 |
| 20110205343 | STEREOSCOPIC VIDEO PROCESSING DEVICE AND METHOD, AND PROGRAM - A stereoscopic video processing device includes a candidate coordinate range calculation unit configured to calculate a range of candidate coordinates of a display position of a reference point of a two-dimensional object in a screen, a parallax total value calculation unit configured to calculate a total value of parallax values of pixels of a region overlapping the two-dimensional object in the stereoscopic video, for each candidate coordinate, a display position determination unit configured to determine a candidate coordinate having a smallest total value of the parallax values as the display position of the reference point of the two-dimensional object, a maximum value specifying unit configured to specify a maximum value of the parallax values of the pixels of the region overlapping the two-dimensional object in the stereoscopic video, and a parallax setting unit configured to set the parallax of the two-dimensional object displayed in the stereoscopic video. | 08-25-2011 |
| 20110316137 | METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - The semiconductor device includes a semiconductor chip, a chip mounting portion, a suspension lead, and a plurality of leads. Each of the plurality of leads has a first part and a second part, and the suspension lead has a first part and a second part. The first part of each of the plurality of leads and the suspension lead project from the plurality of side surfaces of the sealing body, respectively. Parts of the side surfaces of the plurality of leads and the suspension lead are exposed from the plurality of side surfaces of the sealing body, respectively. An area of the obverse surface of the first part of the suspension lead is larger than an area of the obverse surface of the first part of each of the plurality of leads in a plan view. | 12-29-2011 |
