| Patent application number | Description | Published |
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| 20090147246 | OPTICAL DEFECT INSPECTION APPARATUS - A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. Thus the useful life of each plane mirror can be prolonged without displacing the optical axis. | 06-11-2009 |
| 20100141936 | OPTICAL DEFECT INSPECTION APPARATUS - A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. Thus, the useful life of each plane mirror can be prolonged without displacing the optical axis. | 06-10-2010 |
| 20100231900 | OPTICAL DEFECT INSPECTION APPARATUS - A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. Thus, the useful life of each plane mirror can be prolonged without displacing the optical axis. | 09-16-2010 |
| 20110102781 | OPTICAL DEFECT INSPECTION APPARATUS - A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. Thus, the useful life of each plane mirror can be prolonged without displacing the optical axis. | 05-05-2011 |
| Patent application number | Description | Published |
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| 20090186955 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator;
| 07-23-2009 |
| 20110021005 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor. | 01-27-2011 |
| 20110187006 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor. | 08-04-2011 |
| 20120080808 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor. | 04-05-2012 |
| Patent application number | Description | Published |
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| 20100079371 | TERMINAL APPARATUS, DISPLAY CONTROL METHOD, AND DISPLAY CONTROL PROGRAM - A terminal apparatus includes a display displaying a plurality of display elements representing options on a display screen, an image-capturing section capturing an image of an operator who is viewing the display screen, a face position detector detecting the position of a facial image of the operator in a captured image, and a controller controlling the display to move the plurality of display elements in a predetermined direction on the display screen and to sequentially update and display the display elements when it is detected that the facial image of the operator in the captured image is outside of a predetermined range, and to stop the movement of the plurality of display elements when it is detected that the facial image falls within the predetermined range. | 04-01-2010 |
| 20100123772 | TERMINAL APPARATUS, DISPLAY CONTROL METHOD, AND DISPLAY CONTROL PROGRAM - A terminal apparatus includes: a display unit configured to display a projection image of a three-dimensional object on a two-dimensional display screen; an imaging unit configured to capture an image of an operator who is in a state of viewing the display screen; a changing unit configured to change a viewpoint position relative to the three-dimensional object in response to a position of an image of the operator's face relative to the captured image; and a projection image generator configured to obtain a projection image generated by projecting each portion of the three-dimensional object viewed from the viewpoint position onto a predetermined projection plane. | 05-20-2010 |
| 20120036443 | INFORMATION TERMINAL, INFORMATION PRESENTATION METHOD FOR AN INFORMATION TERMINAL, AND INFORMATION PRESENTATION PROGRAM - An information terminal enables a user to simply and easily confirm a plurality of pieces of update information handled by a plurality of various application programs without any troublesome operation. An information storage stores a plurality of different types of information. An update information storage stores a part of information updated in the information storages as update information associated with the respective types. An update information manager monitors an information update in the information storages and stores, when an information update is made in the information storages, the part of the updated information in the update information storage as update information associated with the respective types. Further, an information selector extracts the update information stored in the update information storage in time series and outputs them to display them on a screen. | 02-09-2012 |
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| 20090088536 | HEAT-RESISTANT RESIN PASTE AND METHOD FOR PRODUCING SAME - An object of the present invention is to provide a heat-resistant resin paste that enables the formation of a precise pattern, exhibits excellent adhesiveness, heat resistance and flexibility, and enables a shortening of the production time, as well as a method for producing thereof. The present invention relates to a heat-resistant resin paste, comprising a first organic solvent (A1), a second organic solvent (A2) that comprises a lactone, a heat-resistant resin (B) that is soluble in a mixed organic solvent of (A1) and (A2), and a heat-resistant resin filler (C) that is soluble in (A1) but insoluble in (A2), wherein (C) is dispersed within a solution comprising (A1), (A2) and (B). | 04-02-2009 |
| 20090189300 | Sealing Film and a Semiconductor Device Using the Same - The present invention provides a sealing film excellent in filling properties and adhesiveness as a sealing film which comprises a resin layer containing the following (A), (B) and (C) and having a flow within the range of 150 to 1800 μm at 80° C.: (A) a resin component containing (a1) a high-molecular-weight component comprising crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of −50 to 50° C. and (a2) a thermoplastic component comprising an epoxy resin as main component, (B) a filler having an average particle size within the range of 1 to 30 μm, and (C) a colorant, as well as a method for manufacturing the same and a semiconductor device using the same. The present invention also provides a sealing film excellent in adhesiveness and shape retention as a sealing film which comprises a resin layer containing the above (A), (B) and (C) and having a resin layer having a viscosity within the range of 10000 to 100000 Pa·s in a B-stage state at 50 to 100° C. in thermosetting viscoelasticity measurement, as well as a semiconductor device using the same. | 07-30-2009 |
| 20090264582 | HEAT-RESISTANT RESIN PASTE - Provided is a heat-resistant resin paste excellent in heat resistance, flexibility, printability and viewability. A heat-resistant resin paste containing a first organic solvent (A1), a second organic solvent (A2) containing a lactone, a heat-resistant resin (B) soluble in a mixed solvent of the solvents (A1) and (A2), a heat-resistant resin filler (C) insoluble in the mixed organic solvent of the solvents (A1) and (A2), and a pigment (D), wherein the components (C) and (D) are dispersed in a solution containing the solvents (A1) and (A2) and the component (B). | 10-22-2009 |
