| Patent application number | Description | Published |
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| 20080247182 | VEHICLE LAMP - In a vehicle lamp including a light source unit at inside of a lamp chamber formed by a lamp body and a transparent front face cover attached to a front opening portion thereof, a light source unit includes a light emitting element supported by a unit mounting portion, an optical unit for irradiating light from the light emitting element to a front side of the vehicle lamp, and a swivel drive mechanism for driving the optical unit without being moved cooperatively with the light emitting element. The light source unit integral with the unit mounting portion and a heat radiating portion is arranged to penetrate the lamp body. | 10-09-2008 |
| 20080285297 | LIGHTING UNIT FOR VEHICLE HEADLAMP - A lighting unit for a vehicle headlamp is provided with a projection lens, a light source, a reflector, a shade, and a convex lens. The projection lens is arranged on an optical axis extending in a longitudinal direction of a vehicle. The light source is arranged on a rear side of a rear side focal point of the projection lens. The reflector is configured to reflect forward a light from the light source toward the optical axis. An upper end edge of the shade passes through a vicinity of the rear side focal point. The shade is configured to shield a part of a reflected light from the reflector. The convex lens is arranged between the light source and the shade. The convex lens is configured to converge the light from the light source into the vicinity of the upper end edge of the shade. | 11-20-2008 |
| 20100277939 | VEHICULAR LAMP - A vehicular lamp comprising includes a light-emitting diode that is used as a light source and that emits light; and a light transmitting member that is arranged in a path of the emitted light and through which the light is passed. The light transmitting member shields the light-emitting diode from infrared rays that travel in an opposite direction to a traveling direction of the light. | 11-04-2010 |
| 20110032722 | LAMP UNIT FOR VEHICULAR HEADLAMP - A lamp unit for a vehicular headlamp includes: a projection lens arranged to have an optical axis extending in a vehicle longitudinal direction; a light-emitting element that is a light source arranged on a rear side with respect to a rear focal point of the projection lens; and a reflector that is formed so that a longitudinal section of the reflector has the shape of an ellipse having a first focal point at a center of light emission of the light-emitting element and a second focal point at the rear focal point of the projection lens, wherein the reflector is arranged to cover the light-emitting element and reflects irradiated light toward the projection lens, the irradiated light being light irradiated from the light-emitting element. A major axis of the ellipse, passing through the first focal point and the second focal point, is inclined with respect to the optical axis. | 02-10-2011 |
| Patent application number | Description | Published |
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| 20090097139 | OPTICAL DEVICE AND MANUFACTURING METHOD THEREOF - An optical element mounted on a wiring board is sealed by a sealing resin except an optical function region. Wires connecting the wiring board with the optical element are also sealed by the sealing resin. The optical function region is exposed as a bottom surface of a recess whose side surface is formed by the sealing resin. A boundary portion between the side surface of the recess and a top surface portion and a boundary portion between the side surface and bottom surface of the recess have a rounded shape. | 04-16-2009 |
| 20090154321 | SEMICONDUCTOR DEVICE AND OPTICAL PICKUP DEVICE - By increasing the width of a lead terminal | 06-18-2009 |
| 20100001174 | SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD AND OPTICAL PICKUP MODULE - In a semiconductor device, a semiconductor element is mounted on a substantially rectangular package. First ribs are respectively provided on a pair of opposite external edges of a mounting surface and project upward from the pair of opposite external edges. External edges of a lid are placed on the upper surfaces of the first ribs, and fixed thereto with an adhesive. Dams are provided on external edges of the first rib upper surfaces. The adhesive is continuously present from side surfaces of the lid to the dams. | 01-07-2010 |
| 20100008203 | SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD AND OPTICAL PICKUP MODULE - A semiconductor element is mounted on a rectangular base of a package including the base and ribs provided on a pair of opposite external edges of the base. Electrode pads of the semiconductor element and connection electrodes provided on rib upper surfaces are connected to each other by metal wires. On the rib upper surfaces, spacers are provided at locations closer to the outside than the connection electrodes. A transparent lid adheres to the upper surfaces of the spacers to cover the entire surface of the package. The height of the spacers is greater than the diameter of the metal wires. | 01-14-2010 |
| 20100091630 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, OPTICAL PICKUP MODULE AND SEMICONDUCTOR DEVICE - A plurality of parallel rib prototypes are provided on a flat base plate. A plurality of semiconductor elements are placed in each trench between adjacent ones of the rib prototypes, and a transparent member is bonded to each of the semiconductor elements. Electrode pads of the semiconductor elements are wire bonded to connection electrodes. The trenches are then filled with an encapsulating resin. Thereafter, middle portions, in the longitudinal direction, of the rib prototypes are cut with a dicing saw, and adjacent ones of the semiconductor elements are separated from each other, thereby obtaining semiconductor devices. | 04-15-2010 |
| 20100091633 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND OPTICAL PICKUP MODULE - A flat pre-board plate including connection electrodes, internal interconnections, and external-connection portions is prepared. This pre-board plate is cut at portions each located between adjacent ones of the connection electrodes, thereby forming trenches. A plurality of semiconductor elements are placed in each of the trenches. Electrode pads and the connection electrodes are connected to each other by metal wires. Transparent lids are placed on, and bonded to, spacers to cover the semiconductor elements. Thereafter, two lines of the connection electrodes arranged between adjacent ones of the trenches are separated from each other. Subsequently, adjacent ones of the semiconductor elements are also separated from each other. | 04-15-2010 |
