| Patent application number | Description | Published |
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| 20090200471 | INFRARED-DETECTING ELEMENT AND INFRARED IMAGE SENSOR USING THE SAME - An infrared-detecting element includes: a substrate; a laminated body; an anchor coupling a part of the laminated body with the substrate and supporting the laminated body with a gap above the substrate; and an amplifier provided on the substrate and connected to at least one of the lower electrode and the upper electrode. The laminated body has a lower electrode, an upper electrode, and a piezoelectric film made of aluminum nitride which is provided between the lower electrode and the upper electrode and in which a c-axis is oriented almost perpendicularly to a film plane. The amplifier has a circuit performing conversion into voltage according to a charge generated in the laminated body. | 08-13-2009 |
| 20090237772 | OPTICAL ELEMENT, OPTICAL DEVICE, AND DISPLAY DEVICE - An optical element includes a plurality of first beam bodies arranged in a first direction on a first plane and being parallel to each other, and second beam bodies placed between adjacent ones of the first beam bodies and provided parallel to the first beam bodies. The first beam body has side surfaces which face the second beam bodies adjacent thereto and are sloped so that the width in the first direction gradually decreases to the upward direction perpendicular to the first plane, the second beam body has side surfaces which face the first beam bodies adjacent thereto and are sloped so that the width in the first direction gradually increases to the upward direction perpendicular to the first plane, and as viewed in the first direction, the spacing between the first beam body and the second beam body is variable. | 09-24-2009 |
| 20110061449 | ELECTRONIC DEVICE - According to one embodiment, an electronic device includes an airtight container, a functioning unit, and an airtightness detection unit. The airtight container has a containment space capable of being sealed airtightly. The functioning unit is stored in the containment space. The functioning unit is capable of executing a prescribed function. The airtightness detection unit is stored in the containment space. The airtightness detection unit is capable of detecting an airtightness of the containment space. | 03-17-2011 |
| 20110073978 | INFRARED IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, an infrared imaging device includes a substrate, an infrared absorption unit, a thermoelectric conversion unit, a support body, and an interconnection. The infrared absorption unit is provided on the substrate and apart from the substrate to absorb an infrared ray. The thermoelectric conversion unit is provided apart from the substrate and in contact with the infrared absorption unit between the infrared absorption unit and the substrate. The thermoelectric conversion unit converts a temperature change due to the infrared ray absorbed by the infrared absorption unit into an electrical signal. The support body supports the thermoelectric conversion unit on the substrate and apart from the substrate and transmits the electrical signal. The interconnection transmits the electrical signal in reading the electrical signal. The infrared absorption unit includes a protrusion provided on a rim of the infrared absorption unit to protrude toward the substrate. | 03-31-2011 |
| Patent application number | Description | Published |
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| 20080237468 | SOLID-STATE IMAGING DEVICE AND DRIVING METHOD THEREOF - This disclosure concerns a solid-state imaging device including a pixel thermally separated from a substrate; a heat conduction switch having one end connected to the substrate and other end capable of contacting to the substrate or the pixel, the heat conduction switch changing over a state of the pixel to one of a first state and a second state, the first state being a state in which the pixel is thermally isolated from the substrate by causing the other end of the heat conduction switch to contact with the substrate, the second state being a state in which the pixel is thermally shorted to the substrate by causing the other end of the heat conduction switch to contact with the pixel; and a signal detector detecting a difference between the signal voltage of the pixel in the first state and the signal voltage of the pixel in the second state. | 10-02-2008 |
| 20090015491 | ELECTROMAGNETIC WAVE SENSOR, IMAGING ELEMENT AND IMAGING DEVICE - The present invention enables to provide a simple and inexpensive electromagnetic wave sensor that selectively detects sub-millimeter waves and millimeter waves in a specific frequency band, an imaging element and an imaging device. The distance of the gap between a plurality of antenna elements is smaller than the wavelength of infrared light. A capacitor electrically formed by the gap between the plurality of antenna elements, and an electrical resistor portion form parallel circuits electrically coupled to the antenna portion. The plurality of antenna elements are formed so that the impedance of the antenna portion is matched with the impedance of the parallel circuits against electromagnetic waves having a predetermined frequency, and is not matched against the higher harmonics of electromagnetic waves having the predetermined frequency. | 01-15-2009 |
| 20100157091 | SOLID-STATE IMAGE SENSOR - A solid-state image sensor has a plurality of pixels, a read-out circuit and a signal processing section. The plurality of pixels includes a plurality of first pixels, a plurality of second pixels, a plurality of third pixels and a plurality of fourth pixels. The signal processing section includes a color acquisition section, a first judgment section configured to determine whether or not the white data value W in the target pixel block is smaller than a predetermined first set value, and a white color correction section configured to perform correction processing of the white color data value W in the target pixel block based on the following Expression (1) when the judgment result of the first judgment section is NO, and to output the white data value W by itself without performing the correction processing based on the Expression (1) when the judgment result of the first determination section is YES; | 06-24-2010 |
| 20100231770 | SOLID-STATE IMAGE SENSING DEVICE - A solid-state image sensing device has a plurality of pixels, a read-out circuit for reading out electric signals obtained by the photoelectric conversion element, and a signal processing unit for performing signal processing for the electric signal read out from the read-out circuit. The plurality of pixels include a first pixel having a transparent film, a plurality of second pixels each having a first color filter, a plurality of third pixels each having a second color filter, and a plurality of fourth pixels each having a third color filter. The signal processing unit has a color acquisition unit for acquiring a white pixel value and first to third color pixel values, an edge judgment unit, a color separation unit and a single color pixel calculation unit. | 09-16-2010 |
