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| 20080199210 | Developing device - A developing device comprises: a housing that stores developer; a developing roll that is rotatably supported in the housing and has a developing region with a roughened surface that supplies developer to an image region of an image holding member; a step portion that is formed at both sides of the developing region of the developing roll and whose diameter is smaller than that of the developing region; and a seal member that contacts a region of the step portion that is opposite to the image holding member. | 08-21-2008 |
| 20110222918 | DEVELOPING DEVICE, ASSEMBLY BODY, AND IMAGE FORMING APPARATUS - A developing device includes: a first-developer-holding-member facing a surface of a rotating latent image carrier, it rotating such that a moving direction thereof is opposite to that of the carrier at a portion where they face; a second-developer-holding-member provided at a downstream-side of the first-developer-holding-member in a direction in which the carrier rotates, and facing the surface of the carrier, it rotating such that a moving direction thereof is the same as that of the carrier at a portion where they face; a ratio of circumferential speeds of the first-developer-holding-member and the second-developer-holding-member being variable; a splitting member that splits a developer for the first-developer-holding-member and the second-developer-holding-member by hitting against the developer located between the first-developer-holding-member and the second-developer-holding-member; a moving unit that moves the splitting member; and a control unit that controls the moving unit to move the splitting member to vary split ratio of the developer. | 09-15-2011 |
| 20110229215 | DEVELOPING DEVICE, ASSEMBLY, AND IMAGE FORMING APPARATUS - A developing device includes a first developing member that rotates in a manner such that a moving direction of a portion opposing the image carrier is opposite a moving direction of the image carrier, a second developing member provided on a downstream side of the first developing member in a rotating direction of the image carrier and rotates in a manner such that a moving direction of a portion opposing the image carrier is the same as the moving direction of the image carrier, a distributing member supported movably relative to a proximal portion where the first developing member is closest to the second developing member so as to distribute developer to the first and second developing members by contact with the developer, and an a biasing member that biases the distributing member upstream in the rotating direction of the first developing member. | 09-22-2011 |
| 20110242714 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A semiconductor integrated circuit device of the invention can reduce a manufacturing cost and achieve size reduction without degrading performances. The semiconductor integrated circuit device includes an internal circuit and at least one input/output circuit. Each input/output circuit is adapted to feed an input signal from outside to the internal circuit and to output an output signal from the internal circuit to the outside. The semiconductor integrated circuit device also includes at least one first power source terminal. Each first power source terminal is associated with each input/output circuit for supplying a drive voltage to the internal circuit. The semiconductor integrated circuit device also includes at lease one second power source terminal. Each second power source terminal is associated with each input/output circuit for supplying a drive voltage to the associated input/output circuit. The semiconductor integrated circuit device also includes at least one common ground terminal. Each common ground terminal is associated with each input/output circuit for supplying a common ground voltage to the internal circuit and the associated input/output circuit. The first power source terminal, second power source terminal and common ground terminal for each input/output circuit are arranged next to each other to define a unit terminal group. | 10-06-2011 |
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| 20090014915 | METHOD FOR FEEDING MOLTEN RESIN MASS AND APPARATUS THEREFOR - A method of feeding a molten resin mass, which is capable of causing a molten resin mass to fall down into a female mold for compression molding without delay in the timing from a cylindrical transfer guide that cuts a portion of a molten resin extruded from a die head of an extruder and transfers it to a female mold for compression forming, and an apparatus therefor. The apparatus for feeding the molten resin mass has a cylindrical transfer guide which transfers a molten resin mass obtained by cutting a predetermined amount of a molten resin extruded from a die head of an extruder to a female mold for compression molding, wherein the transfer guide is provided with vibration-generating means for imparting vibration to the transfer guide. In the method of feeding the molten resin mass, the pressure in the cylindrical transfer guide is set to be higher than the pressure in the female mold for compression molding. | 01-15-2009 |
| 20090020903 | METHOD AND DEVICE FOR FEEDING MOLTEN RESIN, AND METHOD FOR MANUFACTURING MOLDED ARTICLE BY USING THE FED MOLTEN RESIN - A method and a device for feeding a molten resin capable of accurately feeding the molten resin without the delay of feed timing by preventing the molten resin from adhering to route members before it seats on a mold to increase the positioning accuracy of the molten metal in the mold, and a method of manufacturing a molded part by using the fed molten resin. Vibration is provided to the route members such as molten resin guide pins ( | 01-22-2009 |
| 20090078669 | Wide-Mouth Plastic Container and Method for Crystallization of Mouth Portion of Plastics Container - In a wide-mouth plastic container including a container body | 03-26-2009 |
| 20090096129 | METHOD OF FEEDING COMPOSITE MOLTEN RESIN AND APPARATUS FOR FEEDING THE SAME - A method of feeding a composite molten resin capable of easily forming a multi-kind-multi-layer preform. An apparatus for feeding the composite molten resin has a nozzle portion which includes an outer discharge port in which an outermost annular flow path through which a main layer-forming molten resin flows, meets an outer annular flow path through which a sub-layer-forming molten resin flows inside of the outermost annular flow path; and an inner discharge port in which a shell layer-forming molten resin annularly flowing inside of the outer conflux path, meets the core layer-forming molten resin flowing inside the shell layer; the outer discharge port and the inner discharge port being arranged in this order from the downstream toward the upstream in a direction in which the molten resins flow; wherein provision is made of a shaft-like opening/closing valve for opening and closing the inner discharge port, and a gear pump for intermittently discharging the sub-layer-forming molten resin. | 04-16-2009 |
| 20100201032 | COMPRESSION-MOLDING APPARATUS AND COMPRESSION-MOLDING METHOD - [Problem] To suppress the deviation of a synthetic resin to be fed to a metal mold and to enable the to-be-compression-molded synthetic resin to be easily molded into a shape of a pre-molded article that is to be molded. | 08-12-2010 |
| 20100264565 | METHOD AND DEVICE FOR FEEDING MOLTEN RESIN, AND METHOD FOR MANUFACTURING MOLDED ARTICLE BY USING THE FED MOLTEN RESIN - A method and a device for feeding a molten resin capable of accurately feeding the molten resin without the delay of feed timing by preventing the molten resin from adhering to route members before it seats on a mold to increase the positioning accuracy of the molten metal in the mold, and a method of manufacturing a molded part by using the fed molten resin. Vibration is provided to the route members such as molten resin guide pins ( | 10-21-2010 |
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| 20100330794 | METHOD FOR CLEANING A SEMICONDUCTOR DEVICE - There is provided a method for cleaning a semiconductor device capable of making compatible the inhibition of dissolution of a gate metal material and the acquisition of a favorable contact resistance. A method for cleaning a semiconductor device includes steps: a semiconductor substrate including silicon, and having a main surface is prepared; a multilayer gate including a metal layer and a silicon layer stacked sequentially from the bottom is formed over the main surface; a silicide layer is formed over the main surface and the silicon layer surface; an insulation layer is formed over the silicide layer in each of the main surface and the multilayer gate surface; a shared contact hole is formed in the insulation layer in such a manner that the silicide layer in the main surface of the semiconductor substrate and the surface of the multilayer gate is exposed from the insulation layer; and the shared contact hole is subjected to sulfuric acid cleaning, aqueous hydrogen peroxide cleaning, and APM cleaning separately, respectively, thereby to remove an altered layer formed in the shared contact hole. | 12-30-2010 |
| 20110081753 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A manufacturing method of a semiconductor device is provided for improving the reliability of a semiconductor device including a MISFET with a high dielectric constant gate insulator and a metal gate electrode. A first Hf-containing insulating film containing Hf, La, and O as a principal component is formed as a high dielectric constant gate insulator for an n-channel MISFET. A second Hf-containing insulating film containing Hf, Al, and O as a principal component is formed as a high dielectric constant gate insulator for a p-channel MISFET. Then, a metal film and a silicon film are formed and patterned by dry etching to thereby form first and second gate electrodes. Thereafter, parts of the first and second Hf-containing insulating films not covered with the first and second gate electrodes are removed by wet etching. At this time, a wet process with an acid solution not containing hydrofluoric acid, and another wet process with an alkaline solution are performed, and then a further wet process with an acid solution containing hydrofluoric acid is performed. | 04-07-2011 |
