| Patent application number | Description | Published |
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| 20090029862 | HERBICIDAL SUSPENSION - A herbicidal suspension comprising (1) a sulfonylurea compound or its salt as a herbicidal component, (2) at least one surfactant selected from the group consisting of an alkoxylated sorbitol fatty acid ester and an alkoxylated sorbitan fatty acid ester, and (3) a water-immiscible diluent. A method for controlling undesired plants or inhibiting their growth, which comprises applying a herbicidally effective amount of the herbicidal suspension to the undesired plants or to a place where they grow. | 01-29-2009 |
| 20090170702 | HERBICIDAL COMPOSITION - Improvement of the effect of a herbicidally active ingredient and reduction of its dosage are required so as to reduce the environment load on a site where the herbicide is applied or the periphery thereof, more than ever. A herbicidal composition comprising (1) a herbicidal sulfonylurea compound or its salt and (2) a polyoxyalkylene alkyl ether phosphate or its salt. A method for controlling undesired plants or inhibiting their growth, by applying such a herbicidal composition. | 07-02-2009 |
| 20090264292 | HERBICIDAL COMPOSITION - Many herbicidal compositions have been developed and practically used. However, types of weeds to be controlled are also many, and their emergence extends over a long period. Accordingly, it is desired that a herbicidal composition be developed which has a wider herbicidal spectrum and which is highly active and has a long lasting effect. As a result of a research to solve such problems, the present inventors have found it possible to obtain a highly practical herbicidal composition by a combined use of (A) 2-(4,6-dimethoxypyrimidin-2-ylcarbamoylsulfamoyl)-N,N-dimethylnicotinamide or its salt and (B) N | 10-22-2009 |
| Patent application number | Description | Published |
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| 20090025155 | Substrate Cleaning Device And Substrate Processing Apparatus Including The Same - A cleaning processing unit includes a spin chuck for horizontally holding a substrate and rotating the substrate around the vertical axis passing through the center of the substrate. A bevel cleaner is disposed outside the spin chuck. The bevel cleaner includes a cleaning brush. The cleaning brush has a shape that is symmetric about its vertical axis, and has an upper bevel cleaning surface, an end surface cleaning surface, and a lower bevel cleaning surface. The end surface cleaning surface is a cylindrical surface having its axis in the vertical direction. The upper bevel cleaning surface extends out from and is inclined upward from the upper end of the end surface cleaning surface, and the lower bevel cleaning surface extends out from and is inclined downward from the lower end of the end surface cleaning surface. | 01-29-2009 |
| 20090027634 | Bevel Inspection Apparatus For Substrate Processing - A substrate processing apparatus includes an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. The interface block includes a bevel portion inspection unit. The bevel portion inspection unit inspects a bevel portion of a substrate to determine whether or not the bevel portion of the substrate is contaminated. The substrate whose bevel portion is determined to be contaminated and the substrate whose bevel portion is determined that it is not contaminated are respectively subjected to different types of processing. | 01-29-2009 |
| 20090120472 | SUBSTRATE CLEANING AND PROCESSING APPARATUS WITH MAGNETICALLY CONTROLLED SPIN CHUCK HOLDING PINS - When a substrate is subjected to bevel cleaning processing, a first magnet plate is arranged at a lower position, and a second magnet plate is arranged at an upper position. In this case, each of chuck pins enters a closed state in a region outside the first magnet plate, while entering an opened state in a region outside the second magnet plate. That is, a holder in each of the chuck pins is maintained in contact with an outer edge of the substrate when it passes through the region outside the first magnet plate, while being spaced apart from the outer edge of the substrate when it passes through the region outside the second magnet plate. | 05-14-2009 |
