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| 20100178180 | Fuel supply device - A male terminal is provided in a terminal hole formed in a flange unit. A female terminal and a grommet having a sealing portion to be fitted into the terminal hole are provided to a harness. A distance from an end of the sealing portion to a fore-end of the female terminal is set smaller than a distance from a fore-end of the male terminal to an opening of the terminal hole. With such setting, the grommet is retained in the terminal hole even if the female terminal is disconnected from the male terminal, thereby ensuring support of the female terminal. Moreover, a stopper is attached so as to cover the terminal hole to prevent the grommet from slipping out of the terminal hole. | 07-15-2010 |
| 20110073396 | SCOOTER-TYPE VEHICLE - A scooter-type vehicle can freely set a capacity of a fuel filter without being restricted by swing of a unit-swing type engine. A fuel supply device includes a fuel tank and a fuel supply passage for supplying fuel to an engine. A pump-anterior filter for purifying the fuel in the fuel tank, a fuel pump, a fuel filter disposed on the downstream side of the fuel pump, and an injector for injecting fuel are arranged on the fuel supply passage in this order. The fuel filter is disposed between the upper surface of the fuel tank and the step floor. The size of the fuel filter can freely be set without being restricted by swing of the engine located rearward of the fuel tank. | 03-31-2011 |
| 20110073397 | SCOOTER-TYPE VEHICLE - A scooter-type vehicle can freely set a capacity of a fuel filter without being restricted by swing of a unit-swing type engine. A cross pipe is spanned between a pair of left and right lower frames and a lower end of a down frame is connected to a central portion of the cross pipe. A fuel filter is disposed so that its lower end is higher by distance than the lower end of cross pipe. The fuel filter is disposed between the down frame and the fuel tank. Since the fuel filter is disposed in front of the fuel tank, it is not restricted by the swing of an engine located rearward of the fuel tank. Therefore, a capacity of the fuel filter can freely be set. | 03-31-2011 |
| 20110073400 | MOTORCYCLE - A motorcycle has a large accommodating space and an enlarged capacity of a fuel filter. The motorcycle includes: a fuel tank disposed on the upper side of the rear wheel and on the rear side of the luggage box; a rear fender provided between the rear frames and, disposed between the luggage box and the rear wheel, and covering the rear wheel on the front and upper sides of the rear wheel; a fuel supply path; and a fuel secondary filter. The rear fender is so disposed that its front portion faces a rear wall of the luggage box, the front portion is inclined rearwardly upward so that the distance thereto from the rear wall increases along an upward direction, and the fuel secondary filter is disposed between the rear wall of the luggage box and the front portion of the rear fender. | 03-31-2011 |
| 20120074139 | FUEL TANK STRUCTURE - A fuel tank structure including a fuel tank, a fuel filler port device formed in a cylindrical shape and arranged in the fuel tank, and a flame arrester arranged in the fuel filler port device and disposed inside the fuel tank. A fuel bleeding opening is formed in a peripheral wall part of the fuel filler port device and an arrester peripheral wall part. A cylindrical ring disposed so as to urge itself against the peripheral wall part and block the fuel bleeding opening. | 03-29-2012 |
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| 20080318356 | SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME - It is made possible to provide a highly integrated, thin apparatus can be obtained, even if the apparatus contains MEMS devices and semiconductor devices. A semiconductor apparatus includes: a first chip comprising a MEMS device formed therein; a second chip comprising a semiconductor device formed therein; and an adhesive layer bonding a side face of the first chip to a side face of the second chip, and having a lower Young's modulus than the material of the first and second chips. | 12-25-2008 |
| 20090058898 | INKJET PRINTING HEAD SUBSTRATE AND INKJET PRINTING HEAD HAVING THE SUBSTRATE - The present invention provides an inkjet printing head substrate capable of storing a large volume of information by increasing a number of fuses without enlarging a space for arranging fuses capable of storing information according to the cutting or non-cutting of fuses and a selection circuit thereof. For that purpose, two fuses are connected to a set of a drive element and a selection circuit. | 03-05-2009 |
| 20100103223 | FLEXIBLE PRINTED CIRCUIT BOARD AND LIQUID DISCHARGE HEAD INCLUDING THE SAME - A flexible printed circuit board, included in a liquid discharge head, includes a film having a length in the longitudinal direction, a plurality of connection terminals arranged in a first area of the film adjacent to one side of the film in the longitudinal direction, a contact portion disposed in a second area of the film adjacent to the other side thereof in the longitudinal direction, the contact portion including a plurality of contact pads, and a plurality of wiring lines arranged in the film. The length of the second area of the film in a direction orthogonal to the longitudinal direction is more than two times the length of the first area thereof in that direction. The planar shape of the film is L-shaped. | 04-29-2010 |
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| 20080254973 | Catalyst-carried particulate filter - A catalyst-carried particulate filter contains a catalyst obtained by mixing Pt/alumina acting to promote the burning of particulates in a high temperature range, a second oxide acting to promote the burning of particulates in a low temperature range and a first oxide acting to promote the burning of particulates in an intermediate temperature range. | 10-16-2008 |
| 20090084266 | PARTICULATE FILTER - Disclosed is a particulate filter, which is adapted to be disposed in an exhaust passage of an engine to trap particulate matter contained in exhaust gas discharged from the engine. The particulate filter comprises a filter body having a porous partition wall which defines a plurality of exhaust gas channels allowing the exhaust gas to pass therethrough, and a catalyst layer formed on a surface of the porous partition wall. The catalyst layer includes a Zr-based composite oxide which contains zirconium (Zr), and a rare-earth metal except cerium, wherein a content ratio of an oxide of the non-cerium rare-earth metal to a total amount of ZrO | 04-02-2009 |
| 20100018190 | PARTICULATE FILTER REGENERATING SYSTEM - Disclosed is a particulate filter regenerating system which comprises a fuel injection device ( | 01-28-2010 |
| 20100099554 | EXHAUST GAS PURIFICATION CATALYST - An exhaust gas purification catalyst includes a support and a catalytic layer provided on the support. The catalytic layer contains: a NOx storage material which stores NOx in exhaust gas when an air-fuel ratio of the exhaust gas is leaner than a stoichiometric air-fuel ratio, and releases the NOx when the air-fuel ratio is close to the stoichiometric air-fuel ratio or richer than the stoichiometric air-fuel ratio; and CePr-based mixed oxide particles doped with a catalytic metal and formed by complexing at least Ce and Pr. The CePr-based mixed oxide particles contain a Ce oxide and a Pr oxide which are at least partially dissolved in each other. The catalytic metal is dissolved in the oxide particles. | 04-22-2010 |
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| 20090212804 | NEEDLE TRACE TRANSFER MEMBER AND PROBE APPARATUS - A needle trace transfer member to which needle traces of probes are transferred is installed at a movable mounting table to align the probes before electrical characteristics of a target object on the mounting table are inspected by bringing the probes into electrical contact with the target object. The needle trace transfer member is made of a shape memory polymer transformed reversibly and rapidly between a glass state with a high modulus elasticity and a rubber state with a low modulus of elasticity near its glass transition temperature. The glass transition temperature is set to a temperature close to a set temperature of the mounting table. The shape memory polymer is mainly made of polyurethane-based resin. | 08-27-2009 |
| 20090219046 | PROBE CARD INCLINATION ADJUSTING METHOD, INCLINATION DETECTING METHOD AND STORAGE MEDIUM STORING A PROGRAM FOR PERFORMING THE INCLINATION DETECTING METHOD - An inclination adjusting method adjusts an inclination of a probe card installed at a probe apparatus to make the probe card be in parallel with a mounting surface of a movable mounting table for mounting thereon an object to be inspected. The method includes: detecting an average tip height of multiple probes disposed at each of plural locations of the probe card by using a tip position detecting device; obtaining an inclination of the probe card with respect to the mounting table based on differences in the average tip heights detected from the plural locations of the probe card; and adjusting the inclination of the probe card based on the obtained inclination. | 09-03-2009 |
| 20090251163 | ALIGNMENT METHOD, TIP POSITION DETECTING DEVICE AND PROBE APPARATUS - An alignment method is used in implementation of electric characteristic inspection of an object to be inspected via electric contact between the object disposed on a movable mounting table and probes. The alignment method includes detecting tip positions of the probes by using the tip position detecting device, detecting the tip positions of the probes, previously detected by the tip position detecting device, by using the second imaging unit, transferring needle marks of the probes onto a soft member provided at the tip position detecting device by allowing the probes to come into contact with the soft member, detecting the needle marks of the probes formed on the soft member by using the first imaging unit, and detecting inspection electrodes of the object corresponding to the probes by using the first imaging unit. | 10-08-2009 |
| 20090284277 | PROBE APPARATUS AND METHOD FOR CORRECTING CONTACT POSITION - A probe apparatus includes a movable mounting table for supporting an object to be tested; a probe card disposed above the mounting table and having a plurality of probes to come into contact with electrodes of the object; a support body for supporting the probe card; and a control unit for controlling the mounting table. Electrical characteristics of the object are tested based on a signal from a tester by bringing the object and the probes into electrical contact with each other by overdriving the mounting table in a state where a test head is electrically connected with the probe card by a predetermined load. Further, one or more distance measuring devices for measuring a current overdriving amount of the mounting table are provided at one or more locations of the test head or the probe card. | 11-19-2009 |
| 20090315580 | PROBE APPARATUS - A probe apparatus includes a mounting table having a mounting table main body and a chuck top, cylinder mechanisms surrounding a mount of the chuck top, and a connecting mechanism to releasably connect the cylinder mechanisms to a head plate horizontally supporting a probe card. When a semiconductor wafer, mounted on the mount, comes into contact with probes of the probe card, a control unit operates the cylinder mechanisms and the connecting mechanism to connect the cylinder mechanisms to the head plate. Thereafter, the control unit further operates the cylinder mechanisms, to move the chuck top upward from the mounting table main body by a predetermined overdrive amount. Accordingly, the probe apparatus achieves an originally required contact load between the semiconductor wafer and the probes of the probe card while preventing the probe card from being displaced upward during overdriving of the semiconductor wafer, thereby enabling a highly reliable test. | 12-24-2009 |
| 20100001751 | TRANSFER MECHANISM FOR TARGET OBJECT TO BE INSPECTED - A transfer mechanism for a target object includes at least two insulating wire materials disposed spaced from each other to transverse a mounting table, at least two pairs of supporting bodies horizontally disposed at outsides of the mounting table, for stretching said at least two wire materials in parallel with a mounting surface of the mounting table, and at least two grooves formed on the mounting surface of the mounting table to respectively receive therein said at least two wire materials by said at least two pairs of supporting bodies. The transfer mechanism further includes a first elevation driving mechanism for vertically moving said wire materials between said grooves and above of the mounting surface through said pairs of supporting bodies, wherein the target object is transferred between a carrying mechanism and the mounting table through said at least two wire materials. | 01-07-2010 |
| 20100079161 | PROBE APPARATUS - A probe apparatus includes a holding frame holding a test head through a biasing unit biasing the test head. An annular member is rotatably mounted in an opening of a ceiling plate of a main body. Cam followers are rotatably provided circumferentially on the annular member. An intermediate connecting member is provided in a lower surface of the test head, for bringing the test head into electrical contact with an upper surface of the probe card. Protrusions for guiding the cam followers are provided corresponding thereto at an outer periphery of the intermediate connecting member, upper surfaces of the protrusions being inclined. The cam followers are moved relatively upward along the respective inclined surfaces of the protrusions by rotating the annular member so that the intermediate connecting member is pushed downward against a biasing force of the biasing unit to bring the test head into press-contact with the probe card. | 04-01-2010 |
| 20110304348 | Apparatus for Driving Placing Table - Disclosed is an apparatus for driving a placing table that contributes to saving a space and reducing the weight of an inspecting apparatus. The apparatus for driving a placing table according to an exemplary embodiment of the present disclosure includes a horizontal driving mechanism that horizontally moves a placing table in an inspecting chamber, a base that supports horizontal driving mechanism, a placing table lifting mechanism (for example, air bearing) that lifts placing table from support, using compressed air in inspecting chamber, a connecting mechanism that connects horizontal driving mechanism with placing table, and a case that accommodates the horizontal driving mechanism and the base. | 12-15-2011 |
| 20120062258 | WAFER INSPECTION INTERFACE AND WAFER INSPECTION APPARATUS - A wafer inspection interface IF comprises a probe card, an adsorption unit configured to adsorb a wafer to the probe card, a wafer adsorption sealing member to which the probe card is adsorbed, and a fixing ring configured to fix the wafer adsorption sealing member to a card holder. The adsorption unit includes an air exhaustion unit, a first air duct whose right end portion is opened in the hermetically closed space and the left end portion is opened at a side of the fixing ring, a second air duct whose right end portion is opened to face an opening of the left end portion of the first air duct and the left end portion is opened to be connected with the air exhaustion unit, and a hole by which the first air duct is in communication with the second air duct. | 03-15-2012 |
| 20120062259 | WAFER INSPECTION APPARATUS AND METHOD FOR PRE-HEATING PROBE CARD - A wafer inspection apparatus includes a first and second wafer transfer mechanisms, an alignment chamber, a second wafer transfer mechanism and a plurality of inspection chambers. The first wafer transfer mechanism is installed at a first transfer area to transfer wafers individually from a housing. The alignment chamber has an alignment mechanism configured to align the wafer at an inspection position for an electrical characteristics inspection. The second wafer transfer mechanism is configured to transfer the wafer through a wafer retaining support in a second transfer area formed along the first transfer area and an alignment area. The plurality of inspection chambers is arranged at an inspection area formed along the second transfer area and is configured to inspect electrical characteristics of the wafer transferred by the second wafer transfer mechanism through the wafer retaining support. | 03-15-2012 |
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| 20090246065 | ALLOY, SHAFT MADE THEREFROM, AND MOTOR WITH SHAFT - A nonmagnetic austenitic stainless steel consists of, all by weight %, 1.5 to 3.5% of Cu, 8.5 to 9.5% of Mn, 0.18 to 0.22% of C, 0.5 to 1.0% of Si, 16.5 to 17.5% of Cr, 0.15 to 0.2% of N, 0.13 to 0.3% of S, and the balance of Fe and inevitable impurities. | 10-01-2009 |
| 20100054649 | MARTENSITIC STAINLESS STEEL AND ANTIFRICTION BEARING USING THE SAME - A martensitic stainless steel with high hardness and high corrosion resistance consists of, by weight %, 0.35 to 0.45% of C, not more than 0.2% of Si, not more than 0.3% of Mn, not more than 0.02% of P, not more than 0.02% of S, 15 to 17% of Cr, 1.5 to 2.5% of Mo, 0.001 to 0.003% of B, 0.15 to 0.25% of N, and the balance of Fe and inevitable impurities. | 03-04-2010 |
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| 20080258258 | SEMICONDUCTOR DEVICE - The invention provides a semiconductor device which has a capacitor element therein to achieve size reduction of the device, the capacitor element having larger capacitance than conventional. A semiconductor integrated circuit and pad electrodes are formed on the front surface of a semiconductor substrate. A second insulation film is formed on the side and back surfaces of the semiconductor substrate, and a capacitor electrode is formed between the back surface of the semiconductor substrate and the second insulation film, contacting the back surface of the semiconductor substrate. The second insulation film is covered by wiring layers electrically connected to the pad electrodes, and the wiring layers and the capacitor electrode overlap with the second insulation film being interposed therebetween. Thus, the capacitor electrode, the second insulation film and the wiring layers form capacitors. | 10-23-2008 |
| 20080265441 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The invention enhances moisture resistance between a supporting body and an adhesive layer to enhance the reliability of a semiconductor device. A semiconductor device of the invention has a first insulation film formed on a semiconductor element, a first wiring formed on the first insulation film, a supporting body formed on the semiconductor element with an adhesive layer being interposed therebetween, a third insulation film covering the back surface of the semiconductor element onto the side surface thereof and the side surface of the adhesive layer, a second wiring connected to the first wiring and extending onto the back surface of the semiconductor element with the third insulation film being interposed therebetween, and a protection film formed on the second wiring. | 10-30-2008 |
| 20090050988 | MEMS APPARATUS AND METHOD OF MANUFACTURING THE SAME - A MEMS apparatus includes a MEMS unit formed on a semiconductor substrate and a cover provided with a pore and serving to seal the MEMS unit. The pore is sealed with a sealing material shaped in a sphere or a hemisphere. | 02-26-2009 |
| 20090206349 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - An object of the invention is to provide a smaller semiconductor device of which the manufacturing process is simplified and the manufacturing cost is reduced and a method of manufacturing the same. Furthermore, an object of the invention is to provide a semiconductor device having a cavity. A first supporting body | 08-20-2009 |
| 20090206444 | INTEGRATED SEMICONDUCTOR DEVICE - An integrated semiconductor device includes a plurality of semiconductor elements having different integrated element circuits or different sizes; an insulating material arranged between the semiconductor elements; an organic insulating film arranged entirely on the semiconductor elements and the insulating material; a fine thin-layer wiring that arranged on the organic insulating film and connects the semiconductor elements; a first input/output electrode arranged on an area of the insulating material; and a first bump electrode formed on the first input/output electrode. | 08-20-2009 |
| 20090321903 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - This invention is directed to offer a semiconductor device in which a cavity space is easily provided in a specific region when a supporting member is bonded to a semiconductor substrate through an adhesive layer, and its manufacturing method. A resist layer is applied to an entire top surface of the semiconductor substrate | 12-31-2009 |
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| 20090061202 | High-Luminosity Stress-Stimulated Luminescent Material Emitting Ultraviolet Light, Manufacturing Method Thereof, and Usage Thereof - One embodiment of the present invention provides (i) a luminant having a unique crystal structure so as to exhibit high luminosity and (ii) a manufacturing method thereof. Further, the present invention discloses (I) a luminant which exhibits ultraviolet luminescence and (II) a manufacturing method thereof. The inventors developed a stress-stimulated luminescent material which exhibits high luminosity by using a compound having a structure obtained by inserting alkali metal ions and alkali earth metal ions into a base material structure constituted of polyhedral-structure molecules and partially substituting the alkali metal ions and alkali earth metal ions by rare earth metal ions, transition metal ions, group-III metal ions, or group-IV metal ions. Further, the inventors developed a stress-stimulated luminescent material which exhibits high-luminosity stress-stimulated ultraviolet luminescence by adding specific metal ions such as Ce as a luminescent center to the aforementioned stress-stimulated luminescent material. | 03-05-2009 |
| 20090114033 | Stress History Recording System - Provided is a stress history recording system for recording a stress history, which includes a light emitting means including a stress-stimulated luminescent material that emits light in response to a mechanical external force, and a recording means for recording a history of a photoreaction generated due to light emission from the light emitting means. This achieves a technology for recording a stress history by using the stress-stimulated luminescent material. | 05-07-2009 |
| 20090286076 | Material to be measured for stress analysis, coating liquid for forming coating film layer on the material to be measured, and stress-induced luminescent structure - In one embodiment of the present invention, on the surface of a material to be measured for stress analysis which has a stress-induced luminescent material layer formed thereon, a distortion energy is disclosed which is transmitted from a base material of a stress-induced luminescent material to the stress-induced luminescent material with high efficiency. The material to be measured for stress analysis has, on the surface thereof, a coating film layer, which emits light upon exposure to a change in distortion energy. The coating film layer is formed of a synthetic resin layer containing stress-induced luminescent particles, and the modulus of elasticity of a base material is not less than 1.0 GPa. The thickness of the coating film layer is preferably 1 μm to 500 μm. | 11-19-2009 |
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| 20080231962 | Projection type zoom lens and projection type display apparatus - Disposed in order from a magnification side are a negative first group which is fixed during zooming to effect focusing, second to fifth groups of positive refractive power which move with mutual relationship during magnification variation, and a fixed sixth group. A negative lens made of a glass material which has an anomalous dispersion property and which has 70 or more in Abbe number is disposed in the first lens group. A positive lens made of a glass material which has an anomalous dispersion property and which has 70 or more in Abbe number is disposed in the third group located closer to a reduction side than a diaphragm. The negative lens and the positive lens are cemented to their adjacent lenses, respectively. Also, bf/fw≧2.7 is satisfied where bf denotes a back focus, and fw denotes a focal length of the entire system at a wide-angle end. | 09-25-2008 |
| 20090135496 | PROJECTION ZOOM LENS AND PROJECTION TYPE DISPLAY DEVICE - A projection zoom lens is provided and includes: in order from the magnification side, a positive first lens group performing focusing with being fixed during power-varying and having a focusing function; a negative second lens group, a negative third lens group, and a positive fourth lens group, which are moved with correlation during the power-varying; and a positive fifth lens group G | 05-28-2009 |
| 20090135497 | PROJECTION ZOOM LENS AND PROJECTION TYPE DISPLAY DEVICE - A projection zoom lens is provided and includes: in order from the magnification side, a negative first lens group performing focusing with being fixed during power-varying; a positive second lens group, a positive third lens group, a positive fourth lens group, a positive fifth lens group, which are moved with correlation; and a positive sixth lens group fixed during the power-varying. An aperture diaphragm is moved between the fourth lens group and the fifth lens group during the power-varying to keep Fno constant in the whole power-varying region. In addition, the expression of 1.7| 05-28-2009 | |
| 20110157716 | ZOOM LENS FOR PROJECTION AND PROJECTION-TYPE DISPLAY APPARATUS - A zoom lens for projection includes a first negative lens group, a second positive lens group, a third positive lens group, a fourth lens group, and a fifth positive lens group, which are sequentially arranged from the magnification side of the zoom lens. The first lens group and the fifth lens group are fixed, and the second lens group, the third lens group and the fourth lens group move along the optical axis of the zoom lens when magnification of the zoom lens is changed. Each of the first lens group and the second lens group is composed of two lenses. Each of the third lens group and the fifth lens group is composed of a positive lens, and the fourth lens group is composed of five lenses. Further, the reduction side of the zoom lens is telecentric. | 06-30-2011 |
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| 20110149492 | SLIDE TYPE ELECTRONIC APPARATUS - A slide type electronic apparatus which can prevent internal structure such as a slide mechanism from being visually recognized from a gap between two cases and suppress dirt, dust and the like invading from the gap is provided. A slide type electronic apparatus according to the present invention includes: two cases; slide means, which is arranged between the two cases, for connecting the two cases in a manner that the two cases can slide each other; and covering means, which is arranged in one of the cases, for hiding a gap formed between the two cases at least at a time of an opened state in which an overlap of the two cases becomes smallest. | 06-23-2011 |
| 20110177440 | METHOD OF MANUFACTURING TONER AND TONER MANUFACTURED BY THE METHOD - A method of manufacturing toner including: preparing a first liquid by dissolving or dispersing toner components including a colorant, a release agent, and one or both of a binder resin and a precursor thereof in an organic solvent; preparing a second liquid having a viscosity of from 50 to 800 mPa·sec when measured with a Brookfield viscometer at a revolution of 60 rpm and a temperature of 25° C., by emulsifying the first liquid in an aqueous medium; and evaporating the organic solvent from the second liquid by flowing down the second liquid as a liquid film from a supply part along an inner wall surface of a pipe depressurized to 70 kPa or less in substantially a vertical direction, and heating the liquid film at not higher than a glass transition temperature of the binder resin by contact with the inner wall surface of the pipe in a heating part. A heat insulating part is provided between the supply part and the heating part. | 07-21-2011 |
| 20110222248 | MOUNTING STRUCTURE OF FLEXIBLE PRINTED CIRCUIT BOARD AND SLIDING-TYPE ELECTRONIC DEVICE - A mounting structure of a flexible printed circuit board and a sliding-type electronic device is provided by which a too large increase in thickness of devices can be avoided and a pair of housings can be slid relatively in a bending and slanting direction. In the mounting structure, an upper housing | 09-15-2011 |
