Patent application number | Description | Published |
20090004052 | Oxidation protection apparatus and method for chemical liquid - An oxidation protection method for chemical liquid includes: supplying inert gas into a circulating bath containing the chemical liquid to make pressure inside the circulating bath higher than pressure outside the circulating bath; supplying the chemical liquid from the circulating bath to a chamber receiving a wafer; supplying inert gas into the chamber to make pressure inside the chamber higher than pressure outside the chamber; and returning the chemical liquid after washing from the chamber to the circulating bath. An oxidation protection method for chemical liquid includes: removing dissolved oxygen in the chemical liquid; supplying the chemical liquid to a chamber receiving a wafer; and returning the chemical liquid after washing from the chamber to a circulating bath. | 01-01-2009 |
20110061684 | CLEANING METHOD FOR SEMICONDUCTOR WAFER - A cleaning method for a semiconductor wafer with cleaning liquid comprising:
| 03-17-2011 |
20110304897 | Optical Semiconductor Module and Method for Assembling the Same - An optical semiconductor module in which displacement resulting from fixation of lenses is effectively corrected includes a first lens ( | 12-15-2011 |
20130065400 | ETCHING METHOD - According to one embodiment, an etching method includes: supplying an etching-resistant material; and etching the silicon nitride film. The supplying includes supplying the etching-resistant material to a processing surface including a surface of a silicon nitride film and a surface of a non-etching film, the non-etching film including a material different from the silicon nitride film. The etching includes etching the silicon nitride film using an etchant in a state of the etching-resistant material being formed relatively more densely on the surface of the non-etching film than on the surface of the silicon nitride film. | 03-14-2013 |
20130119013 | METHOD FOR CHEMICAL PLANARIZATION AND CHEMICAL PLANARIZATION APPARATUS - According to one embodiment, a method is disclosed for chemical planarization. The method can include forming a surface layer on a to-be-processed film having irregularity. The surface layer binds to or adsorbs onto the to-be-processed film along the irregularity to suppress dissolution of the to-be-processed film. The method can include planarizing the to-be-processed film in a processing solution dissolving the to-be-processed film, by rotating the to-be-processed film and a processing body while the to-be-processed film contacting the processing body via the surface layer, removing the surface layer on convex portions of the irregularity while leaving the surface layer on concave portions of the irregularity and making dissolution degree of the convex portions larger than dissolution degree of the concave portions. | 05-16-2013 |
20130154087 | METHOD FOR FORMING INTERCONNECTION PATTERN AND SEMICONDUCTOR DEVICE - According to one embodiment, a method for forming an interconnection pattern includes forming an insulating pattern, forming a self-assembled film, and forming a conductive layer. The insulating pattern has a side surface on a major surface of a matrix. The self-assembled film has an affinity with a material of the insulating pattern on the side surface of the insulating pattern. The forming the conductive layer includes depositing a conductive material on a side surface of the self-assembled film. | 06-20-2013 |
20130213437 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber. | 08-22-2013 |
20130217228 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - According to one embodiment, a method for fabricating a semiconductor device includes performing a back surface processing to remove at least one of a scratch and a foreign material formed on a back surface of a substrate to be processed, a front surface of the substrate being retained in a non-contact state, contacting the back surface of the substrate to a stage to be retained, and providing a pattern on the front surface of the substrate by using lithography. | 08-22-2013 |
20140170307 | METHOD FOR CLEANING IMPRINTING MASK - According to one embodiment, provided is a method for cleaning an imprinting mask including a template having an uneven pattern, a base layer disposed on the template, and a sacrificial film disposed on the base layer. In the method for cleaning the imprinting mask, the sacrificial film is removed, and a contaminant adhered on the sacrificial film is removed from the template pattern. | 06-19-2014 |
20140187042 | METHOD FOR CHEMICAL PLANARIZATION AND CHEMICAL PLANARIZATION APPARATUS - According to one embodiment, a method is disclosed for chemical planarization. The method can include forming a surface layer on a to-be-processed film having irregularity. The surface layer binds to or adsorbs onto the to-be-processed film along the irregularity to suppress dissolution of the to-be-processed film. The method can include planarizing the to-be-processed film in a processing solution dissolving the to-be-processed film, by rotating the to-be-processed film and a processing body while the to-be-processed film contacting the processing body via the surface layer, removing the surface layer on convex portions of the irregularity while leaving the surface layer on concave portions of the irregularity and making dissolution degree of the convex portions larger than dissolution degree of the concave portions. | 07-03-2014 |
Patent application number | Description | Published |
20090317980 | FILTER, SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD - A filter connectable to an external circulating system, the circulating system being included by a substrate treatment apparatus which etches a substrate with an H | 12-24-2009 |
20100267233 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A metal member layer on a silicon member layer is patterned. A sidewall film is formed on a surface of the metal member layer. The silicon member layer is patterned to form a structure including the silicon member layer and the metal member layer, the surface of which is covered with the sidewall film. After the surface of the structure is cleaned, a water-repellent protective film is formed on the surface of the structure before the surface of the structure is dried. | 10-21-2010 |
20110129219 | LIGHT MULTIPLEXER - One side surface of a diffraction grating is securely held by a holder, and further, the holder is securely supported on a substrate by a supporter in such a manner that the diffraction grating held by the holder is not brought into contact with the substrate. In this manner, the diffraction grating is fixed only onto one side surface to the supporter via the holder, and further, the diffraction grating is not brought into contact with the substrate. Therefore, the lower portion of the supporter is displaced by heat generated in the substrate, however, the displacement of the supporter cannot adversely influence directly on the diffraction grating since the holder is interposed between the displaced portion and the diffraction grating. | 06-02-2011 |
20110220152 | SUPERCRITICAL DRYING METHOD AND SUPERCRITICAL DRYING APPARATUS - According to one embodiment, a substrate having a plurality of adjacent patterns on one surface thereof is cleaned by cleaning liquid. Subsequently, after the cleaning liquid is displaced with pure water, the pure water is displaced with displacement liquid. Under a condition that the displacement liquid among the patterns does not vaporize, the displacement liquid not contributing to prevention of collapse of the patterns is removed. After the displacement liquid is removed, the substrate is held in supercritical fluid and the displacement liquid among the patterns is displaced with the supercritical fluid. After the displacement liquid among the patterns is displaced with the supercritical fluid, the supercritical fluid adhering to the substrate is vaporized. | 09-15-2011 |
20140065765 | MANUFACTURING METHOD AND MANUFACTURING APPARATUS OF FUNCTIONAL ELEMENT - According to one embodiment, the manufacturing method of a functional element includes filling a solvent comprising hydrogen gas and having organic molecules dispersed therein into a gap between the first electrode and the second electrode formed facing the first electrode, and forming an organic layer containing the organic molecules mentioned above between the first electrode and the second electrode. | 03-06-2014 |
Patent application number | Description | Published |
20100211215 | Substrate transfer apparatus and substrate treatment system - The present invention is a transfer apparatus for a substrate, including a substrate housing container housing a substrate therein and having a transfer-in/out port for the substrate formed in a side surface thereof; a gas jet unit jetting a predetermined gas toward a rear surface of the substrate in the substrate housing container; and a control unit regulating a supply amount of the predetermined gas supplied from the gas jet unit to control the substrate in the substrate housing container to a predetermined height. | 08-19-2010 |
20120116567 | SUBSTRATE TREATMENT APPARATUS, METHOD OF TRANSFERRING SUBSTRATE, AND NON-TRANSITORY COMPUTER STORAGE MEDIUM - A coating and developing treatment apparatus includes a substrate transfer mechanism; a defect inspection section; means for controlling transfer of a substrate; means for classifying a defect based on the state of the defect; means for storing a transfer route of the substrate by the substrate transfer mechanism when the substrate has been treated by treatment sections; and means for specifying, based on a kind of the defect classified by the defect classification means and the transfer route of the substrate stored in the storage means, a treatment section which is a cause of occurrence of the classified defect, and judging presence or absence of an abnormality of the specified treatment section, wherein the transfer control means controls the substrate transfer mechanism to transfer a substrate bypassing the treatment section which has been judged to be abnormal by the defective treatment specification means. | 05-10-2012 |
20120237110 | IMAGE CREATION METHOD, SUBSTRATE INSPECTION METHOD, NON-TRANSITORY RECORDING MEDIUM HAVING PROGRAM RECORDED THEREON FOR EXECUTING IMAGE CREATION METHOD OR SUBSTRATE INSPECTION METHOD, AND SUBSTRATE INSPECTION APPARATUS - An image creation method of creating a filter image for removing a pseudo defect to inspect presence/absence of a defect on a substrate includes a filter image creation step of creating the filter image by replacing a picture element value of any one of picture elements located on a circumference of a circle about a center position of a registered image with a maximum value of picture element values of a plurality of picture elements selected from among the picture elements located on the circumference. | 09-20-2012 |
20120257813 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND COMPUTER-READABLE RECORDING MEDIUM HAVING PROGRAM FOR EXECUTING THE SUBSTRATE PROCESSING METHOD RECORDED THEREIN - Provided is a substrate processing apparatus that includes: a peripheral exposing unit that performs a peripheral exposing process by irradiating light to a peripheral portion of a substrate while rotating the substrate held by a substrate holding unit using a rotation driving unit; a substrate inspecting unit that performs a substrate inspecting process based on a picked up image of the substrate while moving the substrate using a movement driving unit; and a control unit. The control unit controls the predetermined substrate processing to be stopped when the peripheral exposing process is included in the predetermined substrate processing and an error occurs in the peripheral exposing unit, and controls the substrate inspecting process to be skipped when no error occurs in both of the peripheral exposing unit and a transport unit, the substrate inspecting process is included in the predetermined substrate processing and an error occurs in the substrate inspecting unit. | 10-11-2012 |
20130088696 | SETTING METHOD OF EXPOSURE APPARATUS, SUBSTRATE IMAGING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM - A method of setting an exposure apparatus to expose exposure sectors defined on a resist film formed on a surface of a substrate with proper values of an exposure amount and a focus value for forming a pattern having a predetermined dimension includes exposing and developing an exposure sector defined on a reference substrate by a first exposure apparatus having a first state, and imaging the same. The method exposes and develops exposure sectors defined on an inspection substrate by a second exposure apparatus having a second state where at least one of the exposure amount and the focus value is unknown, and forms and images a pattern on the inspection substrate. The method determines the proper values for the exposure amount and the focus value for the second state based on luminance of the exposure sector of reference data and luminances of the exposure sectors of inspection data. | 04-11-2013 |
20140054463 | INSPECTION DEVICE, BONDING SYSTEM AND INSPECTION METHOD - According to an embodiment of the present disclosure, an apparatus of inspecting an overlapped substrate obtained by bonding substrates together is provided. The apparatus includes a first holding unit configured to hold and rotate the overlapped substrate, and a displacement gauge configured to measure displacements of peripheral sides of a first substrate and a second substrate constituting the overlapped substrate while rotating the overlapped substrate held by the first holding unit. | 02-27-2014 |
20140055599 | INSPECTION DEVICE, BONDING SYSTEM AND INSPECTION METHOD - An inspection device for inspecting the interior of an overlapped substrate produced by bonding one substrate and another substrate, comprising: a first holding unit configured to hold the rear surface of the overlapped substrate and include a cutout formed to expose a portion of the rear surface of the overlapped substrate when viewed from the top; a second holding unit configured to hold and rotate the overlapped substrate; an infrared irradiator configured to irradiate the rear surface or front surface exposed from the cutout of the overlapped substrate held on the first holding unit with an infrared ray; and an image pickup unit configured to receive the infrared ray emitted from the infrared irradiator and image the overlapped substrate held on the first holding unit in division for each of regions exposed from the cutout. | 02-27-2014 |
20140124479 | METHOD OF REMOVING COATING FILM OF SUBSTRATE PERIPHERAL PORTION, SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY STORAGE MEDIUM - A method of removing a coating film of a substrate peripheral portion, is provided with holding and supporting a circular substrate by allowing a transfer body to transfer a rear surface of the substrate to a supporting part; removing a coating film in the shape of a ring by a predetermined width size by supplying a solvent from a solvent nozzle to a peripheral portion of the coating film formed on the surface of the substrate; transferring the substrate to an inspection module for inspecting a state of the coating film by imaging the entire surface of the substrate; detecting a removal region of the coating film based on image data acquired by the inspection module; and correcting a delivery position of a succeeding substrate with respect to the supporting part by the transfer body based on the detection result of the removal region of the coating film. | 05-08-2014 |
20140160451 | SUBSTRATE REFERENCE IMAGE CREATION METHOD, SUBSTRATE DEFECT INSPECTION METHOD, SUBSTRATE REFERENCE IMAGE CREATION APPARATUS, SUBSTRATE DEFECT INSPECTION UNIT AND NON-TRANSITORY COMPUTER STORAGE MEDIUM - In the present invention, a planar distribution of pixel values in a picked-up substrate image is decomposed into a plurality of pixel value distribution components through use of a Zernike polynomial for each of substrate images; Zernike coefficients of the pixel value distribution components decomposed through use of the Zernike polynomial are calculated; a median value and values deviated from the median value by a predetermined value or more are extracted for every Zernike coefficients having a same couple of degrees from the calculated Zernike coefficients; substrate images having the extracted values are specified; and a substrate image being a defect inspection reference is created by combining the specified substrate images. | 06-12-2014 |
Patent application number | Description | Published |
20090008381 | TEMPERATURE SETTING METHOD OF THERMAL PROCESSING PLATE, TEMPERATURE SETTING APPARATUS OF THERMAL PROCESSING PLATE, PROGRAM, AND COMPUTER-READABLE RECORDING MEDIUM RECORDING PROGRAM THEREON - Temperature setting of a thermal plate is performed so that the line width of a resist pattern is uniformly formed within a wafer. The thermal plate of a PEB unit is divided into a plurality of thermal plate regions so that the temperature can be set for each of the thermal plate regions. A temperature correction value for adjusting the temperature within the wafer mounted on the thermal plate is set for each of the thermal plate regions of the thermal plate. The temperature correction value for each of the thermal plate regions of the thermal plate is set after calculation by a calculation model created from a correlation between a line width of the resist pattern formed by thermal processing on the thermal plate and the temperature correction value. The calculation model M calculates the temperature correction value to make the line width uniform within the wafer, based on a line width measured value of the resist pattern. | 01-08-2009 |
20090067780 | WAVELENGTH SELECTIVE SWITCH - In a wavelength selective switch according to the present invention, an isolator is disposed between a lens array and a first lens. The isolator includes an isolator element and a transmitting means. The isolator is disposed so that the isolator element is on light paths of input lights and that the transmitting element is on a light path of an output light. The isolator element is shared among the light paths of the plurality of input lights. The isolator element intercepts lights propagating in an opposite direction to the input lights and prevents coupling of the lights to input ports. The transmitting element transmits the output light and couples it to an output port. | 03-12-2009 |
20090076763 | METHOD OF DETECTING EXTRANEOUS MATTER ON HEAT PROCESSING PLATE, HEAT PROCESSING APPARATUS, PROGRAM, AND COMPUTER-READABLE RECORDING MEDIUM WITH PROGRAM RECORDED THEREON - In the present invention, a heating plate is divided into a plurality of regions. Integrated values of temperature fluctuations in each of the regions when a substrate is mounted on the heating plate in a normal state without extraneous matter are collected. A Mahalanobis reference space in the discriminant analysis method is formed based on the integrated values at normal time. During actual heat processing, an integrated value of temperature fluctuation of each of the regions when the substrate is mounted on the heating plate is then detected, so that a Mahalanobis distance about the integrated value during the processing is calculated based on the integrated value during the processing and the Mahalanobis reference space obtained in advance. Whether or not there is extraneous matter on the heating plate is determined by comparing the calculated Mahalanobis distance to a predetermined threshold value. | 03-19-2009 |
20090115179 | Pretensioner and seat belt apparatus - A pretensioner | 05-07-2009 |
20100025977 | Passenger protection device - The pretensioner is configured to provide a compact and less expensive pretensioner for improving the work assembly efficiency while effectively transmitting the pressing force of plural force transmission members to the ring gear. Plural balls inside the pipe are pressed under the pressure of gas from the gas generator in an emergency. The first ball presses the lever, and the balls other than the first ball sequentially press the subsequent levers such that the ring gear rotates to move rightward. The internal teeth of the ring gear are meshed with external teeth of the pinion attached to the rotary shaft at the side of the spool. The pinion then rotates to allow the spool to retract the seatbelt. The first ball abuts on the ball stopper portion of the pipe to stop the rest of the balls such that most of the balls are located in the circular movement path. | 02-04-2010 |
20120032016 | Pretensioner, seat belt retractor, seat belt device and method for assembling pretensioner - A plurality of driving force transmitting members, a piston, a spring and a gas generator are inserted into the pipe from the end of the pipe where the gas generator is mounted. The gas generator is press-fitted in the pipe while the flat faces thereof are deformed by a pair of protrusions of the pipe. Accordingly, the gas generator is temporarily held by the protrusions of the pipe. Then, one end of the pipe is firmly pressed and the gas generator is mounted in the pipe. | 02-09-2012 |
20120146319 | PRETENSIONER, SEATBELT RETRACTOR INCLUDING THE PRETENSIONER, AND SEATBELT APPARATUS INCLUDING THE SEATBELT RETRACTOR - A pipe includes a cutout portion through which levers of a ring gear enter the pipe. An inner peripheral surface of the pipe opposing the cutout portion includes a curved inner peripheral surface in a curved portion of the pipe, a linear inner peripheral surface in a linear portion of the pipe, and a transition portion from the curved inner peripheral surface to the linear inner peripheral surface. The transition portion is located closer to a position where balls start to press the levers of the ring gear, than an intersection where an imaginary straight line a extending from a cutout end portion of the cutout portion intersects an imaginary extension line of the inner peripheral surface of the linear portion of the pipe at a right angle. | 06-14-2012 |
20120212030 | PRETENSIONER, SEAT BELT RETRACTOR WITH PRETENSIONER, AND SEAT BELT UNIT INCLUDING SEAT BELT RETRACTOR - There is provided a pretensioner. The pretensioner includes: a pipe; a gas generator that generates a gas in the pipe in an emergency case; a gas generator mount on which the gas generator is mounted; a spool driving mechanism that rotates a spool in a direction to retract a seatbelt by the gas generated by the gas generator in the emergency case; a discharge hole formed in the pipe so as to allow communication between inside and outside of the pipe; and a blocking member configured to block the discharge hole from inside of the pipe, the blocking member being configured to open the discharge hole when the blocking member is pressed from outside of the pipe with a pressing force equal to or greater than a given pressing force. | 08-23-2012 |
20120256407 | PRETENSIONER, SEATBELT RETRACTOR INCLUDING THE PRETENSIONER, AND SEATBELT APPARATUS INCLUDING THE SEATBELT RETRACTOR - [Object] To allow force transmission members to smoothly move in a pipe, to facilitate setting of a stopper for stopping rotation of a ring gear, and to reduce the cost with a simple structure. | 10-11-2012 |
20140083979 | DEPOSIT REMOVAL METHOD - A deposit removal method for removing deposits deposited on the surface of a pattern formed on a substrate by etching, includes an oxygen plasma treatment process for exposing the substrate to oxygen plasma while heating the substrate and a cycle treatment process for, after the oxygen plasma treatment process, repeating multiple cycles of a first period and a second period. In the first period, the substrate is exposed to a mixture of hydrogen fluoride gas and alcohol gas inside a processing chamber and the partial pressure of the alcohol gas is set to the first partial pressure. In the second period, the partial pressure of the alcohol gas is set to the second partial pressure lower than the first partial pressure by exhausting the inside of the processing chamber. | 03-27-2014 |
Patent application number | Description | Published |
20090078695 | TEMPERATURE SETTING METHOD OF THERMAL PROCESSING PLATE, COMPUTER-READABLE RECORDING MEDIUM RECORDING PROGRAM THEREON, AND TEMPERATURE SETTING APPARATUS FOR THERMAL PROCESSING PLATE - A thermal plate of a PEB unit is divided into a plurality of thermal plate regions, and a temperature is settable for each of the thermal plate regions. A temperature correction value for adjusting the temperature within the thermal plate is settable for each of the thermal plate regions of the thermal plate. The line widths within the substrate for which a photolithography process has been finished are measured. The in-plane tendency of the measured line widths is decomposed into a plurality of in-plane tendency components using a Zernike polynomial. Then, in-plane tendency components improvable by setting the temperature correction values are extracted from the calculated plurality of in-plane tendency components and added to calculate an improvable in-plane tendency in the measured line widths. Then, the improvable in-plane tendency is subtracted from the in-plane tendency Z of the current processing states to calculate an after-improvement in-plane tendency. | 03-26-2009 |
20090082911 | TEMPERATURE SETTING METHOD OF THERMAL PROCESSING PLATE, COMPUTER-READABLE RECORDING MEDIUM RECORDING GPROGRAM THEREON, AND TEMPERATURE SETTING APPARATUS FOR THERMAL PROCESSING PLATE - In the present invention, a thermal plate is divided into a plurality of thermal plate regions, and a temperature is settable for each of the thermal plate regions. A temperature correction value for adjusting the temperature within the thermal plate is settable for each of the thermal plate regions of the thermal plate. The line widths within the wafer for which the photolithography process has been finished are first measured, and Zernike coefficients of a Zernike polynomial indicating a plurality of in-plane tendency components are calculated from the measured values of the line widths within the wafer. Then, the temperature correction values for the regions of the thermal plate to bring the calculated Zernike coefficients close to 0 are calculated using a calculation model indicating a correlation between change amounts of the Zernike coefficients and the temperature correction values. The temperature of each of the regions of the thermal plate is set based on each of the calculated temperature correction values. | 03-26-2009 |
20090226077 | DEFECT INSPECTION METHOD AND COMPUTER-READABLE STORAGE MEDIUM - The present invention includes an illuminance adjustment step of setting an optimum illuminance of the illumination; and a defect inspection step of picking up the image of the substrate illuminated with the illumination at the optimum illuminance, wherein the illuminance adjustment step has: a first step of applying illuminations at different illuminances to a plurality of measurement regions on a front surface of the substrate and picking up an image of each of the measurement regions, while moving the substrate; a second step of making a luminance of the picked up image of each of the measurement regions into a histogram to find a reference luminance where an integral value from a maximum luminance side of the histogram is a predetermined value; and a third step of calculating a correlation between each of the reference luminances and the illuminance, and setting based on the correlation an illuminance at which the reference luminance coincides with a predetermined luminance, as the optimum illuminance. | 09-10-2009 |
20120013859 | COATING AND DEVELOPING APPARATUS AND METHOD - In one embodiment, a coating and developing apparatus includes a processing block having two early-stage coating unit blocks, two later-stage coating unit blocks and two developing unit blocks, each unit blocks being vertically stacked on each other. The apparatus has at least two operation modes M | 01-19-2012 |
20120307045 | SUBSTRATE INSPECTION APPARATUS AND METHOD FOR OPERATING THE SAME - In one embodiment, a substrate inspection apparatus performs, in its maintenance mode, operations including: guiding a light emitted from an illuminating unit to an imaging device via a light-guiding member disposed in a casing; judging whether or not a level of a brightness signal obtained by the imaging device falls within a predetermined allowable range when a light emitted from the illuminating unit falls on the imaging device via the light-guiding member; and alarming, if it is judged that the value of the brightness signal is out of the predetermined allowable range, that replacement of the illuminating unit is required. | 12-06-2012 |
Patent application number | Description | Published |
20080265015 | Systems and methods for preserving and maintaining document integrity - Systems and methods consistent with embodiments of the present invention provide for a method for preserving and maintaining document integrity. In some methods for preserving and maintaining document integrity, the contents of a document, or contents of a document layer may be encoded into a machine-readable form. In some embodiments, the encoded information may be represented using a 2-dimensional bar code. In some methods for preserving and maintaining document integrity, the machine-readable code is printed along with contents of the document based on space available in the document. In some embodiments, a printed document containing the machine-readable code may be scanned and digitized, and content extracted from the scanned data. In some embodiments, the machine-readable code printed on the document is used to recreate layer data from the printed document. | 10-30-2008 |
20080265042 | Systems and Methods for Preserving and Maintaining Document Integrity - Systems and methods consistent with embodiments of the present invention provide for a method for preserving and maintaining document integrity. In some methods for preserving and maintaining document integrity, the contents of a document, or contents of a document layer may be encoded into a machine-readable form. In some embodiments, the encoded information may be represented using a 2-dimensional bar code. In some methods for preserving and maintaining document integrity, the machine-readable code is printed along with contents of the document based on space available in the document. In some embodiments, a printed document containing the machine-readable code may be scanned and digitized, and content extracted from the scanned data. In some embodiments, the machine-readable code printed on the document is used to recreate layer data from the printed document. | 10-30-2008 |
Patent application number | Description | Published |
20090086273 | METHOD FOR COMPENSATING FOR COLOR VARIATIONS ACROSS A PRINTED PAGE USING MULTIPLE-PASS PRINTING - A method for compensating for color variations introduced by printer hardware limitations and other factors is described. First, for each printer model or each individual printer, the extent of color variation throughout a printed page is determined. Based on this determination, each page is partitioned into a plurality of image areas. Then, in an actual printing process, the page of image is printed in a multi-pass process where each image area is printed in a separate pass. The digital image data is shifted and/or rotated for each pass, and the paper is shifted and/or rotated correspondingly, so that the different image areas printed in different passes form a complete image on the final printed page. From the standpoint of the pointer hardware, all passes involve printing the same area of a physical page, resulting in reduced color variation across the page. | 04-02-2009 |
20090086290 | METHOD FOR COMPENSATING FOR COLOR VARIATIONS ACROSS A PRINTED PAGE USING MULTIPLE COLOR PROFILES - A method for compensating for color variations introduced by printer hardware limitations and other factors is described. First, the extent of color variation throughout a printed page is determined. Based on this determination, each page is partitioned into a plurality of image areas. A color profile is generated for each image area. The partition and the multiple color profiles are stored in the printer. In an actual printing process, the page of image to be printed is divided into a plurality of image areas based on the paper size and the stored partition, and the respective stored color profiles for the image areas are retrieved and used to process the digital image for printing. | 04-02-2009 |